JPS59208865A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPS59208865A
JPS59208865A JP8264783A JP8264783A JPS59208865A JP S59208865 A JPS59208865 A JP S59208865A JP 8264783 A JP8264783 A JP 8264783A JP 8264783 A JP8264783 A JP 8264783A JP S59208865 A JPS59208865 A JP S59208865A
Authority
JP
Japan
Prior art keywords
electrodes
bonding
flip chip
wire bonding
chip bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8264783A
Other languages
Japanese (ja)
Inventor
Minoru Enomoto
Kazuyoshi Sato
Akio Anzai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8264783A priority Critical patent/JPS59208865A/en
Publication of JPS59208865A publication Critical patent/JPS59208865A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818Bonding techniques
    • H01L2224/81801Soldering or alloying
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys

Abstract

PURPOSE:To realize high-density mounting easily by forming both an electrode for flip chip bonding and an electrode for wire bonding on the same substrate. CONSTITUTION:A plurality of separate pellets 9 are connected on electrodes 6 for flip chip bonding in a conductive manner through face down bonding by solder bumps on a mounting substrate 8 consisting of Si with the electrodes 6 for flip chip bonding and electrodes 7 for wire bonding. The electrodes 7 for wire bonding are connected to conductive sections 13 in a body to be mounted such as a mounting substrate 10 consisting of a substance such as ceramics in a conductive manner by wires 11. High-density mounting is enabled because the electrodes for flip chip bonding and the electrodes for wire bonding are formed on the same substrate.
JP8264783A 1983-05-13 1983-05-13 Semiconductor device and manufacture thereof Pending JPS59208865A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8264783A JPS59208865A (en) 1983-05-13 1983-05-13 Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8264783A JPS59208865A (en) 1983-05-13 1983-05-13 Semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS59208865A true JPS59208865A (en) 1984-11-27

Family

ID=13780218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8264783A Pending JPS59208865A (en) 1983-05-13 1983-05-13 Semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS59208865A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010510647A (en) * 2006-11-20 2010-04-02 インターナショナル・ビジネス・マシーンズ・コーポレーション Method for forming wire joint and solder joint

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010510647A (en) * 2006-11-20 2010-04-02 インターナショナル・ビジネス・マシーンズ・コーポレーション Method for forming wire joint and solder joint
JP4659120B2 (en) * 2006-11-20 2011-03-30 インターナショナル・ビジネス・マシーンズ・コーポレーション Method for forming wire joint and solder joint

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