JPS59203778A - Method of bonding ceramic sintered bodies having different thermal expansion coefficients or ceramic sintered body to metal member - Google Patents
Method of bonding ceramic sintered bodies having different thermal expansion coefficients or ceramic sintered body to metal memberInfo
- Publication number
- JPS59203778A JPS59203778A JP7599683A JP7599683A JPS59203778A JP S59203778 A JPS59203778 A JP S59203778A JP 7599683 A JP7599683 A JP 7599683A JP 7599683 A JP7599683 A JP 7599683A JP S59203778 A JPS59203778 A JP S59203778A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic sintered
- sintered body
- thermal expansion
- metal member
- different thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Ceramic Products (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は熱膨張係数の異なるセラミックス焼結体どうし
あるいはセラミックス焼結体と金属部材との接合方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of joining ceramic sintered bodies having different coefficients of thermal expansion or a ceramic sintered body and a metal member.
［発明の技術的背景とその問題点］
従来より、熱膨張係数の異なるセラミックス焼結体どう
しあるいはセラミックス焼結体と金属部材との接合は接
着剤による方法や機械的嵌合等の方法により行われてい
た。[Technical background of the invention and its problems] Traditionally, ceramic sintered bodies with different coefficients of thermal expansion or a ceramic sintered body and a metal member have been joined by methods such as adhesives and mechanical fitting. I was worried.
しかしながら、このような方法は、接合強電が小さく、
また使用時にかなりの熱がかかる場合は、熱膨張係数の
差により応力がかかり、界面で剥離したり、クラックが
発生してついには破断してしまうという欠点があった。However, in such a method, the junction strong electric current is small and
Furthermore, when a considerable amount of heat is applied during use, stress is applied due to the difference in thermal expansion coefficients, resulting in peeling at the interface, cracks, and eventually breakage.
［発明の目的１
本発明者らはこのような点に対処して鋭意研究を進めた
結果、予めセラミックス焼結体の表面または内部にクラ
ックを発生させたものを熱膨張係数の異なるものと接合
させると、熱膨張係数の差に起因する応力がクラック間
隙の膨張、収縮により緩和でき、接合強度の大きい接合
体が得られることを見出した。[Objective of the Invention 1] The present inventors have carried out intensive research to address these points, and as a result, it has been discovered that a ceramic sintered body with cracks generated on the surface or inside thereof can be joined to a ceramic sintered body with a different coefficient of thermal expansion. It has been found that by doing so, the stress caused by the difference in coefficient of thermal expansion can be alleviated by the expansion and contraction of the crack gap, and a bonded body with high bonding strength can be obtained.
本発明はこのような知見に基づいてなされたもので、熱
膨張係数の異なるものであっても接合強度が大きく、剥
Ｍ等の生じることのない接合方法を提供することを目的
とする。The present invention was made based on such knowledge, and an object of the present invention is to provide a bonding method that has high bonding strength even when materials have different coefficients of thermal expansion and does not cause peeling M or the like.
［発明の概要］
すなわち本発明方法は、表面または内部にクラックを有
するセラミックス焼結体を、熱膨張係数の異なるセラミ
ックス焼結体または金属部材と接合させることを特徴と
する。[Summary of the Invention] That is, the method of the present invention is characterized in that a ceramic sintered body having a crack on the surface or inside is joined to a ceramic sintered body or a metal member having a different coefficient of thermal expansion.
本発明において、セラミックス焼結体の表面または内部
にクラックを発生させるには、例えばセラミックスを焼
成する際に、セラミックスの外層に熱膨張係数の異なる
物質を被覆し、焼成時の加熱、冷却条ｆ［をコント「１
−ルすることにより行なうことができる。In the present invention, in order to generate cracks on the surface or inside of the ceramic sintered body, for example, when firing the ceramic, the outer layer of the ceramic is coated with a substance having a different coefficient of thermal expansion, and heating and cooling conditions during firing are applied. [Conte ``1
- This can be done by
熱膨張係数の異なる物質としては、セラミックス焼結体
を金属部材と接合させる場合は金属、特に周期率表の■
、ｖ１■、Ｖｌ、■族から選ばれた一種または二種以上
のものや、あるいはモリブデンシリサイド、タングステ
ンシリサイドのようなケイ化物、炭化物、ホウ化物、窒
化物、酸化物のうち導電性を有する無機物質あるいは焼
成中の反応により導電性を有する無機物質となる非導電
性無機物質を使用することができる。When joining a ceramic sintered body to a metal member, materials with different coefficients of thermal expansion should be metals, especially metals with different coefficients of thermal expansion.
, v1■, Vl, one or more selected from the group ■, or conductive inorganic materials among silicides, carbides, borides, nitrides, and oxides such as molybdenum silicide and tungsten silicide. It is possible to use a non-conductive inorganic material that becomes a conductive inorganic material by reaction during firing.
このようにしてセラミックス焼結体の表面または内部に
クラックを発生させたのち熱膨張係数の異なるセラミッ
クス焼結体または金属部材と接合させるには、常法によ
り行なうことができる。例えば金属部材と接合させる場
合は、クラックを有するセラミックス焼結体にニッケル
めっき等を施し、ろう材を介して接合させる。After cracks are generated on the surface or inside of the ceramic sintered body in this manner, the ceramic sintered body or metal member having a different coefficient of thermal expansion can be bonded to the ceramic sintered body by a conventional method. For example, when joining a metal member, a ceramic sintered body having cracks is plated with nickel or the like, and then joined via a brazing material.
また、このようにセラミックス焼結体表面にクラックを
生じさせた場合は、これが導電層等をコーティングする
時のアンカーポイントとなり、接３−
合強度を上げる効果を発揮する。Furthermore, when cracks are generated on the surface of the ceramic sintered body in this way, these serve as anchor points when coating a conductive layer, etc., and exhibit the effect of increasing the bonding strength.
［発明の実施例］ 次に本発明の実施例について説明する。[Embodiments of the invention] Next, examples of the present invention will be described.
実施例１
セラミックス焼結体の表面または内部にクラックを発生
させるため、窒化ケイ素粉末を厚さ４龍となるよう金型
内に充填し、その上にタングステンを７５モル％となる
よう窒化ケイ素粉末に混合した混合粉末を厚さ０．５ｍ
ｍとなるよう充填し、４５０ ｋｇ ／ ｃｌの圧力で
１７５０℃、１時間加熱し、４０℃／ｍｔｎの条件で冷
却を行なった。Example 1 In order to generate cracks on the surface or inside of a ceramic sintered body, silicon nitride powder was filled into a mold to a thickness of 4 mm, and 75 mol% of tungsten was added on top of the silicon nitride powder. The mixed powder mixed with
mtn, heated at 1750°C for 1 hour at a pressure of 450 kg/cl, and cooled at 40°C/mtn.
このようにして得られた焼結体には、表面（混合粉末層
）にクラックが生じていた。The sintered body thus obtained had cracks on its surface (mixed powder layer).
この焼結体にニッケルめっきを施し、８００℃で加熱し
た後、銀ろうを介して鋼材と接合したところ、接合強度
は６ ’ｌ Ｏｋｇ ／ ｃｄであった。This sintered body was nickel plated, heated at 800°C, and then bonded to a steel material via silver solder, and the bonding strength was 6'l Okg/cd.
実施例２
金型内に窒化ケイ素粉末を厚さ２醋、４０モル％モリブ
デン−窒化ケイ素の混合粉末を厚さ１龍、さらにその上
に７５モル％モリブデン−窒化ケイ４−
素の混合粉末を厚さ１能となるよう充填し、４５０ ｋ
ｇ ／ ｃｄの圧力で１７５０℃で１時間加熱した後、
３０℃／ｍｉｎの速度で冷却して焼結体の内部又は表面
混合粉末層にクラックを発生させた。Example 2 Silicon nitride powder was placed in a mold to a thickness of 2 mm, 40 mol% molybdenum-silicon nitride mixed powder was placed 1 mm thick, and on top of that, a 75 mol% molybdenum-silicon nitride mixed powder was placed. Filled to a thickness of 1 kg, 450 k
After heating at 1750 °C for 1 h at a pressure of g/cd,
The sintered body was cooled at a rate of 30° C./min to generate cracks in the mixed powder layer inside or on the surface of the sintered body.
このようにして得られた焼結体にニッケルめっきを施し
、８００℃で加熱した後、銀ろうにより鋼材と接合した
ところ、接合強度は５６０ ｋｇ／ ｃｄであった。The sintered body thus obtained was nickel-plated, heated at 800°C, and then joined to a steel material using silver solder. The joint strength was 560 kg/cd.
［発明の効果］
以上説明したように本発明方法によれば、熱膨張係数の
差に起因する応力がクラック間隙の膨張、収縮により緩
和でき、接合強度の大きい接合体が得られる。[Effects of the Invention] As explained above, according to the method of the present invention, the stress caused by the difference in coefficient of thermal expansion can be alleviated by the expansion and contraction of the crack gap, and a bonded body with high bonding strength can be obtained.
代理人弁理士 須 山 佐 −Representative Patent Attorney Suyama Sa
Claims (3)
焼結体を、熱膨張係数の異なるセラミックス焼結体また
は金属部材と接合させることを特徴とする熱膨張係数の
箕なるセラミックス焼結体どうしあるいはセラミックス
焼結体と金属部材との接合方法。(1) A ceramic sintered body having a crack on the surface or inside is joined to a ceramic sintered body or a metal member having a different coefficient of thermal expansion. A method of joining a structure and a metal member.
熱膨張係数の異なる物質が被覆されている特許請求の範
囲第１項記載の熱膨張係数の異なるセラミックス焼結体
どうしあるいはセラミックス焼結体と金属部材との接合
方法。(2) A ceramic sintered body having cracks is a ceramic sintered body having a different thermal expansion coefficient as described in claim 1, or a ceramic sintered body whose surface is coated with a substance having a different thermal expansion coefficient. How to join metal parts.
物質または焼成中の反応により導電性を有する無機物質
となる非導電性無機物質である特許請求の範囲第２項記
載の熱膨張係数の異なるセラミックス焼結体どうしある
いはセラミックス焼結体と金属部材との接合方法。(3) The coefficient of thermal expansion according to claim 2, wherein the substances having different coefficients of thermal expansion are conductive inorganic substances or non-conductive inorganic substances that become conductive inorganic substances by reaction during firing. A method for joining ceramic sintered bodies of different types or a ceramic sintered body and a metal member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7599683A JPS59203778A (en) | 1983-04-28 | 1983-04-28 | Method of bonding ceramic sintered bodies having different thermal expansion coefficients or ceramic sintered body to metal member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7599683A JPS59203778A (en) | 1983-04-28 | 1983-04-28 | Method of bonding ceramic sintered bodies having different thermal expansion coefficients or ceramic sintered body to metal member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59203778A true JPS59203778A (en) | 1984-11-17 |
| JPH0432035B2 JPH0432035B2 (en) | 1992-05-28 |
Family
ID=13592401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7599683A Granted JPS59203778A (en) | 1983-04-28 | 1983-04-28 | Method of bonding ceramic sintered bodies having different thermal expansion coefficients or ceramic sintered body to metal member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59203778A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101902874B1 (en) * | 2016-07-14 | 2018-10-01 | 윤국원 | A floor structures |
-
1983
- 1983-04-28 JP JP7599683A patent/JPS59203778A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0432035B2 (en) | 1992-05-28 |
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