JPS5919827A - 温度センサ - Google Patents
温度センサInfo
- Publication number
- JPS5919827A JPS5919827A JP13066682A JP13066682A JPS5919827A JP S5919827 A JPS5919827 A JP S5919827A JP 13066682 A JP13066682 A JP 13066682A JP 13066682 A JP13066682 A JP 13066682A JP S5919827 A JPS5919827 A JP S5919827A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- thin film
- film thermistor
- thermistor chip
- temperature sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000010409 thin film Substances 0.000 claims abstract description 25
- 239000012212 insulator Substances 0.000 claims abstract description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 abstract description 7
- 239000012744 reinforcing agent Substances 0.000 abstract description 3
- 230000004043 responsiveness Effects 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 2
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 235000013305 food Nutrition 0.000 description 8
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000002485 combustion reaction Methods 0.000 description 3
- 238000010411 cooking Methods 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 239000005871 repellent Substances 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 235000013555 soy sauce Nutrition 0.000 description 3
- 239000010931 gold Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013066 combination product Substances 0.000 description 1
- 229940127555 combination product Drugs 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000010794 food waste Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/223—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor characterised by the shape of the resistive element
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Electric Ovens (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13066682A JPS5919827A (ja) | 1982-07-26 | 1982-07-26 | 温度センサ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13066682A JPS5919827A (ja) | 1982-07-26 | 1982-07-26 | 温度センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5919827A true JPS5919827A (ja) | 1984-02-01 |
JPS6359085B2 JPS6359085B2 (enrdf_load_stackoverflow) | 1988-11-17 |
Family
ID=15039702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13066682A Granted JPS5919827A (ja) | 1982-07-26 | 1982-07-26 | 温度センサ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5919827A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010055013A1 (en) * | 2008-11-14 | 2010-05-20 | Epcos Ag | Sensor element and process for assembling a sensor element |
CN110730904A (zh) * | 2017-07-04 | 2020-01-24 | 株式会社电装 | 温度传感器 |
-
1982
- 1982-07-26 JP JP13066682A patent/JPS5919827A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010055013A1 (en) * | 2008-11-14 | 2010-05-20 | Epcos Ag | Sensor element and process for assembling a sensor element |
US8228160B2 (en) | 2008-11-14 | 2012-07-24 | Epcos Ag | Sensor element and process for assembling a sensor element |
CN110730904A (zh) * | 2017-07-04 | 2020-01-24 | 株式会社电装 | 温度传感器 |
CN110730904B (zh) * | 2017-07-04 | 2021-02-19 | 株式会社电装 | 温度传感器 |
Also Published As
Publication number | Publication date |
---|---|
JPS6359085B2 (enrdf_load_stackoverflow) | 1988-11-17 |
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