JPS59193030A - Processor - Google Patents

Abstract

PURPOSE:To obtain a wafer dry cleaning device having a high processing effect by a method wherein the device to perform dry cleaning of a semiconductor wafer is constructed of a process chamber having inside an ultraviolet light source, and moreover to generate ozone by feeding O2 gas, and a carrying in and out part of the wafer therefrom is constructed of taper type wafer pads to come in contact with the circumference of the wafer in dotted manner. CONSTITUTION:A cleaning chamber 6 and a cleaning supplementing chamber 7 are provided adjoining mutually on an electric control part 5, a gas feed opening 8 is dug to the cleaning chamber 6, and an O2 gas source 12 and an N2 gas source 13 are connected thereto through a filter 11. Moreover an exhaust vent 16 is provided to the cleaning supplementing chamber 7, and processed gas is exhausted therefrom. At this construction, a long sideways ?-shape fork 18 constructing a carrying in and out part 3 is made to advance and retreat from the chambers 7, 6, and in the chamber 6, ultraviolet rays radiated from lamps 9 are irradiated to the surface and the back of a wafer 4 on wafer pads 25 provided at the tip thereof, in the chamber 7, static electricity is removed by lamps 14, and at the same time, rereaction of ozone is removed using lamps 15. At this time, the wafer pads 25 are constructed of a pair of holders 26a, 26b having the taper faces, and the wafer 4 is supported by dots.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a processing apparatus that utilizes ultraviolet light, and particularly to a cleaning apparatus that is optimal for dry cleaning of semiconductor wafers.

[Background Art] In the manufacturing process of semiconductor components, when semiconductor wafers are subjected to various treatments, organic substances may adhere to the wafer soil.If heat treatment is performed without sufficiently removing these organic substances, organic ions may be formed. There is a risk that it may enter the inside of the wafer and deteriorate the characteristics of the semiconductor. For this reason, a cleaning action to remove this organic matter is required, and various cleaning devices have been proposed, among them ultraviolet i%61? c- Utilize oxygen gas to ozone? It is preferable to use a dry cleaning apparatus in which the ozone is used to spread the organic material and separate it from the surface of the wafer.

However, in this type of equipment that has been used so far, there is only one clean unit in the cleaning chamber. By introducing a fully ventilated atmosphere and irradiating this atmosphere with ultraviolet rays, ozone is released from the oxygen in the atmosphere, so various ionic gases contained in the atmosphere are directly drawn into the cleaning chamber. ,
The initial cleaning effect is often not achieved.

In addition, with conventional equipment, wafers and
Garage that can be freely accessed and removed from the cleaning room 2. Because it was washed 7 times on the tray, the pallet 2. ) There is a problem in that ozone does not effectively act on the back surface of the wafer, which is in close contact with the wafer, and the back surface of the wafer cannot be cleaned.

[Purpose of the invention]

The purpose of the present invention is to completely prevent the intrusion of unnecessary gaionic gas into the processing chamber during cleaning, etc., while also making it possible to perform surface treatment such as cleaning the back side of the workpiece7, thereby making it possible to perform high-precision processing. A processing device that can do it? It is about providing.

Another object of the present invention is to provide a processing apparatus in which ozone generated within a processing chamber can evenly act on the object to be processed, thereby enhancing processing sound effects.

The above and other objects and novel features of the present invention are as follows:
It will be clear from the description of this specification and attached page 171.

[Summary of the invention]

A brief overview of the representative inventions disclosed in this application is as described below.

In other words, while supplying oxygen into the processing chamber and turning it into keozonate, the object to be processed is supported only at its periphery and ozone acts on its front and back surfaces. This prevents the contamination of ozone and improves the effect of ozone on the front and back surfaces of the object to be treated.

〔Example〕

1 to 4 show one embodiment of the present invention. In FIG. 1, 2 is the main body of a cleaning device [1] which is a surface treatment device, and 3 is a semiconductor wafer that is an object to be cleaned. This is a transport section that carries in and out. The main body 2 has a cleaning chamber 6 on an electric control section 5 on which a conveying section 3 is placed, and an auxiliary cleaning chamber 7 is provided adjacent to the cleaning chamber 6. The cleaning chamber 6 is airtight except for the entrance and exit of the wafer 4, and is equipped with a gas supply port 8 and a lamp 9 as a source of ultraviolet energy. A filter 11 is passed through the gas supply port 8, and an oxygen gas source 12 and a nitrogen gas source 13 are all connected to the gas supply port 8, so that straw gas can flow into the cleaning chamber 6. Further, the ultraviolet lamps 9 are arranged in rows at appropriate intervals so as to face the front and back surfaces of the wafers 4 being carried in, respectively. On the other hand, inside the cleaning auxiliary chamber 7, an electrode 14 for removing static electricity is arranged on the upper side, an ultraviolet lamp 15 for re-reacting and eliminating ozone is arranged on the lower side, and furthermore, an ultraviolet lamp 15 for re-reacting and eliminating ozone is arranged at the lower end. There are 16 locations.

The transfer section 3 has a pair of parallel guide shafts 17, 17 installed on the electric control section 5, extending in the direction in which the wafers 4 are carried in and out, as shown in FIG. And this guide shaft 17
．． A movable table 19 to which the lower end of a fork 18 having an oblong U-shape is fixed is supported on 17 so as to be able to reciprocate in the direction of extension of the guide shaft 17.17. That is, as shown in FIG.
The roller 20' (+-) is in rolling contact with the inside of the guide shaft 17.17.In addition, the roller 20' (+-) is in rolling contact with the inside of the guide shaft 17.17. A part of the belt 24 mounted between the pulley 22 and a pulley 23 pivotally supported at the opposite end is connected to the movable table 19, and the movable table 19 can be moved by driving the motor 21.

At the tip of the fork IB, in this example, two wafer receivers 25.25 are arranged side by side, each horizontally supporting 4.4 wafers. As fully shown in FIG. 4, these wafer receivers 25 (25) have - holder 26a
, 261)'i They are fixedly supported at intervals slightly smaller than the wafer diameter. Each holder 26a, 26b has a middle part cut off and wafer contact parts 27a, 27a and 27b at both ends.
271)? In addition, the contact parts 27a, 27a and 27'b, 27'b are shaped as tapered surfaces facing each other, and are formed on the peripheral edge (especially the lower edge) of the wafer 4. This is supported by point contact. As a result, the back surface of the wafer 4 does not come into contact with the fork receiver 25, and the wafer 4 is supported with both the front and back surfaces open.

According to the above-mentioned structure, when all the oxygen gas and the 9-wire gas are supplied into the cleaning chamber 6, the oxygen is converted into ozone by the ultraviolet energy of the ultraviolet lamp 9. On the other hand, if the movable table 19 is moved forward by the movable table 19 by driving the motor 21' (Z) using the boot +122. The wafer is carried into chamber 6, where it is cleaned with ozone.At this time, since the atmosphere is not infiltrated into chamber 6, there is no ionic gas, and cleaning is performed without contamination. 4 is supported at its periphery by the holders 26a and 26b, and both the front and back surfaces are open, so both surfaces can be effectively cleaned.Furthermore, the ozone and the gas are passed from the cleaning chamber 6 to the exhaust port 16. Since the current flows toward a certain auxiliary chamber 7, it evenly hits the four surfaces of the wafer, making it possible to perform uniform cleaning.

The ozone that has flowed into the auxiliary chamber 7 enters the auxiliary chamber 7, reacts again, becomes oxygen gas, and is discharged from the exhaust gas 16 together with nitrogen gas.

After cleaning, move the movable table 1 by operating the motor 21 in the opposite direction.
When the fork 18 is moved back nine times, the fork 18 is also moved back together, and the wafer 4 is carried out from the cleaning chamber 6.

During unloading, the wafer 4 is removed in the auxiliary chamber 7,
Adhesion of dust etc. is prevented.

In addition, in the series of steps described above, the movable table 1
9 is configured to roll on a guide shaft 17.17 by a roller 2°, so there is no generation of abrasion powder (dust), and it can be used in a dusty environment. In addition, it is possible to completely suppress dust from entering the cleaning chamber 6.

In addition to cleaning, the present invention can also be applied to surface treatments such as machining and ching.

〔effect〕

(1) In the cleaning room, ozone is produced by oxygen gas supplied from an oxygen gas source without introducing atmospheric air. Since the product is generated and washed seven times, it is possible to perform dry cleaning with a high degree of cleanliness without the ionic gas in the atmosphere being mixed in.

(2) When ozone flows from the cleaning chamber to the auxiliary chamber in the Z-direction, it flows along the surface of the object to be cleaned. Can be cleaned evenly.

(3) The wafer, which is the object to be cleaned, is held at the periphery by the abutting part shaped like the holder, and both the front and back sides of the wafer are open, so the front and back sides can be cleaned at the same time. It not only enhances the cleaning effect, but also improves the effectiveness of the stems.

Although the invention has been specifically explained above based on all the embodiments of the invention made by the present inventor, it is to be noted that the present invention is not limited to the above embodiments, and can be modified as much as possible without departing from the gist thereof. Not even. For example, supply ports for oxygen gas, etc. may be arranged above and below the cleaning chamber, and three or more wafer receivers may be arranged in parallel in the vertical direction. Furthermore, a cylinder mechanism may be employed for the driving force of the movable table.

[Application field]

The above explanation has mainly been about the case where the invention made by the present inventor is applied to a semiconductor wafer cleaning device, which is the field in which the invention was first applied. It can also be applied to cleaning, especially cleaning plate-shaped articles.

[Brief explanation of the drawing]

Fig. 1 is a side sectional view of the overall configuration of the cleaning device of the present invention, Fig. 2 is a perspective view of the conveying section, Fig. 3 is an enlarged sectional view along the mm line of Fig. 2, and Fig. 4 is the It is an enlarged view of the main part of the figure. 1...Cleaning device, 2...Main body, 3...Transportation section, 4
...Object to be cleaned (wafer), 6. Cleaning chamber, 7. Cleaning auxiliary chamber, 8. Gas supply port, 9. Ultraviolet source (ultraviolet lamp), 17. Guide shaft, 18. fork, 1
9...Movable table, 21...Motor, 25...
Wafer receiver, 26a, 26b-=holder, 27a, 2
7'b - Wafer contact part. Fig. 1 Fig. 3 Knob 2θ Fig. 4

Claims (1)

[Scope of Claims] 1. It has a processing chamber that is equipped with an ultraviolet light source and that supplies oxygen gas to generate all ozone, and a transport section that can carry out and put the object to be processed into this processing chamber, and The processing equipment is characterized by a structure that supports only the periphery of the object to be processed and allows the front and back sides of the object to be completely opened. 2. The processing apparatus according to claim 1, wherein the processing chamber has a nearly airtight structure that prevents the introduction of all air into the processing chamber. 3. The wafer support provided in the transport section as the workpiece has a tapered wafer contact portion that contacts the wafer periphery in a dotted manner.Claim 1 Or the processing device according to item 2.