JPS59191715A - エポキシ樹脂組成物の製法 - Google Patents
エポキシ樹脂組成物の製法Info
- Publication number
- JPS59191715A JPS59191715A JP6719783A JP6719783A JPS59191715A JP S59191715 A JPS59191715 A JP S59191715A JP 6719783 A JP6719783 A JP 6719783A JP 6719783 A JP6719783 A JP 6719783A JP S59191715 A JPS59191715 A JP S59191715A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- mold release
- molding
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 30
- 239000000203 mixture Substances 0.000 title claims abstract description 30
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229920003986 novolac Polymers 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims abstract description 7
- 230000008018 melting Effects 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 239000006082 mold release agent Substances 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 7
- 238000010298 pulverizing process Methods 0.000 claims description 4
- -1 curing accelerator Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 12
- 238000002156 mixing Methods 0.000 abstract description 5
- 238000005452 bending Methods 0.000 abstract description 4
- 238000009835 boiling Methods 0.000 abstract description 4
- 238000005336 cracking Methods 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000000227 grinding Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- UALAKBZSBJIXBP-UHFFFAOYSA-N 1-phenylethane-1,1,2,2-tetrol Chemical compound OC(O)C(O)(O)C1=CC=CC=C1 UALAKBZSBJIXBP-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6719783A JPS59191715A (ja) | 1983-04-15 | 1983-04-15 | エポキシ樹脂組成物の製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6719783A JPS59191715A (ja) | 1983-04-15 | 1983-04-15 | エポキシ樹脂組成物の製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59191715A true JPS59191715A (ja) | 1984-10-30 |
| JPS6244773B2 JPS6244773B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-09-22 |
Family
ID=13337934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6719783A Granted JPS59191715A (ja) | 1983-04-15 | 1983-04-15 | エポキシ樹脂組成物の製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59191715A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6320325A (ja) * | 1986-07-14 | 1988-01-28 | Toshiba Corp | 樹脂封止型半導体装置 |
| JP2002284853A (ja) * | 2001-03-23 | 2002-10-03 | Sumitomo Bakelite Co Ltd | ワックス含有溶融混合物、エポキシ樹脂組成物及び半導体装置 |
| JP2009275109A (ja) * | 2008-05-14 | 2009-11-26 | Nitto Denko Corp | 半導体封止用樹脂組成物およびその製法、ならびにそれを用いた半導体装置 |
| WO2012029762A1 (ja) * | 2010-09-02 | 2012-03-08 | 住友ベークライト株式会社 | 樹脂成形体及びその製造方法、樹脂組成物及びその製造方法ならびに、電子部品装置 |
| JP2013001893A (ja) * | 2011-06-21 | 2013-01-07 | Sumitomo Bakelite Co Ltd | 樹脂原料粉末の製造方法、樹脂原料粉末、樹脂成形体および電子部品装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5328960A (en) * | 1976-08-30 | 1978-03-17 | Kubota Ltd | Nitration treatment |
| JPS53127599A (en) * | 1977-04-13 | 1978-11-07 | Hitachi Ltd | Epoxy resin composition |
-
1983
- 1983-04-15 JP JP6719783A patent/JPS59191715A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5328960A (en) * | 1976-08-30 | 1978-03-17 | Kubota Ltd | Nitration treatment |
| JPS53127599A (en) * | 1977-04-13 | 1978-11-07 | Hitachi Ltd | Epoxy resin composition |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6320325A (ja) * | 1986-07-14 | 1988-01-28 | Toshiba Corp | 樹脂封止型半導体装置 |
| JP2002284853A (ja) * | 2001-03-23 | 2002-10-03 | Sumitomo Bakelite Co Ltd | ワックス含有溶融混合物、エポキシ樹脂組成物及び半導体装置 |
| JP2009275109A (ja) * | 2008-05-14 | 2009-11-26 | Nitto Denko Corp | 半導体封止用樹脂組成物およびその製法、ならびにそれを用いた半導体装置 |
| WO2012029762A1 (ja) * | 2010-09-02 | 2012-03-08 | 住友ベークライト株式会社 | 樹脂成形体及びその製造方法、樹脂組成物及びその製造方法ならびに、電子部品装置 |
| JP2012072379A (ja) * | 2010-09-02 | 2012-04-12 | Sumitomo Bakelite Co Ltd | 樹脂成形体及びその製造方法、樹脂組成物及びその製造方法ならびに、電子部品装置 |
| US8957532B2 (en) | 2010-09-02 | 2015-02-17 | Sumitomo Bakelite Company Limited | Resin compact, method for producing resin compact, resin composition, method for producing resin composition and electronic component device |
| JP2013001893A (ja) * | 2011-06-21 | 2013-01-07 | Sumitomo Bakelite Co Ltd | 樹脂原料粉末の製造方法、樹脂原料粉末、樹脂成形体および電子部品装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6244773B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-09-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH05156121A (ja) | フェノール樹脂成形材料 | |
| JPH05239321A (ja) | エポキシ樹脂組成物および半導体封止装置 | |
| JPS58198525A (ja) | エポキシ樹脂組成物 | |
| JPS59191715A (ja) | エポキシ樹脂組成物の製法 | |
| JPH08245755A (ja) | エポキシ樹脂組成物および電子部品封止装置 | |
| JPS6222825A (ja) | 封止用樹脂組成物 | |
| JPH0249329B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPH06239976A (ja) | エポキシ樹脂組成物および半導体封止装置 | |
| JPH1030049A (ja) | エポキシ樹脂組成物および電子部品封止装置 | |
| JPH093169A (ja) | 封止用樹脂組成物および電子部品封止装置 | |
| JPH01249825A (ja) | 封止用樹脂組成物およびその製造方法 | |
| JPS5975923A (ja) | 半導体封入用エポキシ樹脂組成物 | |
| JPH06329765A (ja) | エポキシ樹脂組成物の製造方法と半導体封止装置 | |
| JPH06228282A (ja) | エポキシ樹脂組成物および半導体封止装置 | |
| JPS58173850A (ja) | 半導体装置 | |
| JPS6317286B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPH01144439A (ja) | 封止用樹脂組成物およびその製造方法 | |
| JPH0753671A (ja) | エポキシ樹脂組成物および半導体封止装置 | |
| JPH01144440A (ja) | 封止用樹脂組成物およびその製造方法 | |
| JPS63225618A (ja) | 封止用樹脂組成物およびその製造方法 | |
| JPH0739471B2 (ja) | 封止用樹脂組成物 | |
| JPH0621154B2 (ja) | 封止用樹脂組成物 | |
| JPH11302503A (ja) | エポキシ樹脂組成物および半導体封止装置 | |
| JPH0314050B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPS63142025A (ja) | 封止用樹脂組成物 |