JPS59189796A - Speaker - Google Patents
SpeakerInfo
- Publication number
- JPS59189796A JPS59189796A JP6321283A JP6321283A JPS59189796A JP S59189796 A JPS59189796 A JP S59189796A JP 6321283 A JP6321283 A JP 6321283A JP 6321283 A JP6321283 A JP 6321283A JP S59189796 A JPS59189796 A JP S59189796A
- Authority
- JP
- Japan
- Prior art keywords
- power
- yoke
- speaker
- integrated circuit
- speaker body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/022—Cooling arrangements
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はオーディオ再生装置におけるスピーカに関する
ものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a speaker in an audio reproduction device.
従来例の構成とその問題点
従来のオーディオ用アンプ付スピーカの一例を第１図に
示す０第１図において１はスピーカ本体、２は上記スピ
ーカ本体１の振動板、３は上記スピーカ本体１のマグネ
ット、４は上記スピーカ本体１の磁気回路を構成するヨ
ーク、５は上記スピーカ本体１のボイスコイルへの信号
を印加する端子、６は上記スピーカ本体１への信号を供
給する信号線、７は上記スピーカ本体１を駆動する電力
増幅器（具体的にはプリント基板７ａとそこに装着され
た回路部品７ｂで構成されている）、８は上記電力増幅
器７のパワートランジスタから発生する熱を放熱する放
熱器、９はスピーカボックスである０
しかし、第１図に示す従来のアンプ付スピーカにおいて
は、上記電力増幅器７が独立しているため、上記放熱器
８としては通常のオーディオ用電力増幅器の放熱器並の
大きさが必要となり、かさが大きくなると共に重くなる
ことが欠点であり、たとえ上記電力増幅器７として音声
電力増幅用集積回路を用いでも上記放熱器８を用いなけ
ればならないという欠点は解消されなかった。Structure of a conventional example and its problems An example of a conventional speaker with an audio amplifier is shown in FIG. 1. In FIG. 4 is a yoke forming the magnetic circuit of the speaker body 1; 5 is a terminal for applying a signal to the voice coil of the speaker body 1; 6 is a signal line for supplying a signal to the speaker body 1; 7 is a signal line for supplying a signal to the speaker body 1; A power amplifier (specifically, composed of a printed circuit board 7a and a circuit component 7b mounted thereon) drives the speaker body 1, and 8 is a heat radiator that radiates heat generated from the power transistor of the power amplifier 7. However, in the conventional amplifier-equipped speaker shown in FIG. 1, the power amplifier 7 is independent, so the heatsink 8 is a heatsink of a normal audio power amplifier. The disadvantage is that it requires a medium size and becomes bulky and heavy, and even if an integrated circuit for audio power amplification is used as the power amplifier 7, the disadvantage that the heat sink 8 must be used is eliminated. There wasn't.
発明の目的
本発明は上記従来の問題点を解消するもので、発熱体で
ある電力増幅器として音声電力増幅用集積回路素子を用
い、その熱を放熱器を用いないで十分に放熱させること
により、スピーカ本体と、電力増幅器とを含めた大きさ
を小さくすると同時に軽量化することを目的とするもの
である。OBJECT OF THE INVENTION The present invention solves the above-mentioned conventional problems by using an integrated circuit element for audio power amplification as a power amplifier which is a heating element, and by sufficiently dissipating the heat without using a radiator. The purpose of this is to reduce the size of the speaker body including the power amplifier, and at the same time, to reduce the weight.
発明の構成
本発明は、スピーカ本体の磁気回路を構成するヨークの
背面に音声電力増幅用集積回路素子を密着させ、この音
声電力増幅用集積回路素子内にスピーカ駆動回路を設け
ることにより、電力増幅器の放熱器の大きさを小さくす
ることができるものである。Structure of the Invention The present invention provides a power amplifier by bringing an audio power amplifying integrated circuit element into close contact with the back of a yoke constituting a magnetic circuit of a speaker body, and providing a speaker drive circuit within this audio power amplifying integrated circuit element. The size of the heat sink can be reduced.
実施例の説明
第２図は本発明の第１の実施例を示すものである。第２
図において、１〜６は第１図に示す従来例と同じもので
ある。そして１０は音声電力増幅用集積回路（以下パワ
ーＩＣと呼ぶ）であり、スピーカ本体１を構成するヨー
ク４に密着して取付けられている。第２図において、ス
ピーカ本体１は上記パワーｘｃｔｏ内に設けられたスピ
ーカ駆動回路によって駆動される。上記パワーエＣ１０
は使用状態によっても異るが、通常数Ｗ程度の電力を消
費し、その際に発熱する。ところが、上記パワーＩＣ１
０は上記ヨーク４に密着されており、かつ上記ヨーク４
は鉄系材料を用いているだめ熱伝導率が良いので、上記
パワーＩＣ１０から発生する熱は上記スピーカ１のヨー
ク４から放熱される。すなわち第１図に示す放熱器８の
役割を上記ヨーク４が果していることになり、重量の大
きな放熱器８を省くことができる。DESCRIPTION OF EMBODIMENTS FIG. 2 shows a first embodiment of the present invention. Second
In the figure, numerals 1 to 6 are the same as the conventional example shown in FIG. Reference numeral 10 denotes an integrated circuit for audio power amplification (hereinafter referred to as power IC), which is attached in close contact with the yoke 4 constituting the speaker body 1. In FIG. 2, the speaker body 1 is driven by a speaker drive circuit provided in the power xcto. Above Power E C10
Although it varies depending on the usage condition, it usually consumes several watts of power and generates heat at that time. However, the above power IC1
0 is in close contact with the yoke 4, and the yoke 4
Since it is made of iron-based material and has good thermal conductivity, the heat generated from the power IC 10 is radiated from the yoke 4 of the speaker 1. That is, the yoke 4 plays the role of the heat sink 8 shown in FIG. 1, and the heavy heat sink 8 can be omitted.
以上のように本実施例によればパワーエＣ１０をスピー
カ本体１の磁気回路のヨーク４に密着させることにより
放熱器を省くことができ、スピーカ全体を小形化軽量化
することができる。As described above, according to this embodiment, by bringing the power C10 into close contact with the yoke 4 of the magnetic circuit of the speaker body 1, a heat sink can be omitted, and the entire speaker can be made smaller and lighter.
次に本発明の第２の実施例について説明する。Next, a second embodiment of the present invention will be described.
第３図は本発明の第２の実施例におけるスピーカを示す
ものである。第３図において、１〜６は第１図と同じも
のを示しており、１０はパワーＩ Ｃ。FIG. 3 shows a speaker in a second embodiment of the invention. In FIG. 3, 1 to 6 indicate the same things as in FIG. 1, and 10 is a power IC.
１１は放熱器である。第３図に示す第２の実施例の動作
は第２図に示す第１の実施例と同じであるが上記ヨーク
４による放熱器だけでは放熱効果が不十分である場合、
小型の放熱器１１を上記ヨーク４に取りつけることによ
って放熱効果を高めたものである。11 is a heat sink. The operation of the second embodiment shown in FIG. 3 is the same as that of the first embodiment shown in FIG.
By attaching a small heat radiator 11 to the yoke 4, the heat radiation effect is enhanced.
次に本発明の第３の実施例を第４図に示す。第４図にお
いて、１〜３．５，６．１０は第３図と同じものであり
、１２は放熱フィン１３をもつヨークである。第４図に
示す本発明の第３の実施例では、放熱器１１の代りに放
熱フィン１３がヨーク１２とともに一体成形されており
、放熱の促進と、そのだめの部品の製造及び組立の工数
の低減を計ることができる。Next, a third embodiment of the present invention is shown in FIG. In FIG. 4, 1 to 3.5 and 6.10 are the same as in FIG. 3, and 12 is a yoke with radiation fins 13. In the third embodiment of the present invention shown in FIG. 4, a heat dissipation fin 13 is integrally molded with the yoke 12 instead of the heat dissipation device 11, which promotes heat dissipation and reduces the man-hours for manufacturing and assembling the spare parts. The reduction can be measured.
発明の効果
本発明は、スピーカ本体の磁気回路を構成するヨークの
背面に音声電力増幅用集積回路素子を密着して取付け、
上記音声電力増幅用回路素子内にスピーカ駆動回路を設
けたことにより、小形、軽量のアンプ付スピーカを実現
できるものである。Effects of the Invention The present invention provides an integrated circuit device for audio power amplification that is closely attached to the back of a yoke that constitutes a magnetic circuit of a speaker body.
By providing a speaker drive circuit within the audio power amplification circuit element, it is possible to realize a small and lightweight speaker with an amplifier.
第１図は従来のアンプ付スピーカの要部破断斜視図、第
２図は本発明の第１の実施例におけるスピーカの斜視図
、第３図は本発明の第２の実施例におけるスピーカの斜
視図、第４図は本発明の第３の実施例におけるスピーカ
の斜視図である。
１・・・・・・スピーカ本体、２・・・・・・振動板、
３・川・・マグネット、４・・・・・・ヨーク、５・・
・・・・端子、６・川・・信号線、了・・・・・・電力
増幅器、８・・・・・・放熱器、９・川・・スピーカボ
ックス、１０・・・・・・音声電力増幅用回路素子（パ
ワーＩＣ）、１１・・・・・・放熱器、１２・川・・放
熱フィン付ヨーク、１３・・・・・・放熱フィン。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第３図
第４図
６５３FIG. 1 is a perspective view of a main part of a conventional amplifier-equipped speaker, FIG. 2 is a perspective view of a speaker according to a first embodiment of the present invention, and FIG. 3 is a perspective view of a speaker according to a second embodiment of the present invention. FIG. 4 is a perspective view of a speaker in a third embodiment of the present invention. 1...Speaker body, 2...Diaphragm,
3. River... Magnet, 4... York, 5...
...Terminal, 6.Signal line, End...Power amplifier, 8..Radiator, 9.Speaker box, 10..Audio. Power amplification circuit element (power IC), 11... radiator, 12... yoke with heat radiating fin, 13... radiating fin. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 3 Figure 4 653
Claims (1)
電力増幅用集積回路素子を密着して取付け、上記音声電
力増幅用集積回路素子に上記スピーカ本体を駆動する駆
動回路を設けたことを特徴とするスピーカ。An integrated circuit element for audio power amplification is closely attached to the back of a yoke constituting a magnetic circuit of the speaker body, and a drive circuit for driving the speaker body is provided on the integrated circuit element for audio power amplification. speaker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6321283A JPS59189796A (en) | 1983-04-11 | 1983-04-11 | Speaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6321283A JPS59189796A (en) | 1983-04-11 | 1983-04-11 | Speaker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59189796A true JPS59189796A (en) | 1984-10-27 |
Family
ID=13222658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6321283A Pending JPS59189796A (en) | 1983-04-11 | 1983-04-11 | Speaker |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59189796A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2305809A (en) * | 1995-09-28 | 1997-04-16 | Harman Int Ind | Loudspeaker drive unit acts as heatsink for amplifier |
| GB2319923A (en) * | 1996-11-27 | 1998-06-03 | Sony Uk Ltd | Loudspeaker yoke acts as heatsink |
| US6373957B1 (en) | 2001-05-14 | 2002-04-16 | Harman International Industries, Incorporated | Loudspeaker structure |
-
1983
- 1983-04-11 JP JP6321283A patent/JPS59189796A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2305809A (en) * | 1995-09-28 | 1997-04-16 | Harman Int Ind | Loudspeaker drive unit acts as heatsink for amplifier |
| GB2305809B (en) * | 1995-09-28 | 1997-11-05 | Harman Int Ind | Power amplifier and loudspeaker frame integration |
| US6263084B1 (en) | 1995-09-28 | 2001-07-17 | Harman International Industries, Incorporated | Power amplifier and loudspeaker frame integration |
| GB2319923A (en) * | 1996-11-27 | 1998-06-03 | Sony Uk Ltd | Loudspeaker yoke acts as heatsink |
| GB2319923B (en) * | 1996-11-27 | 2000-09-27 | Sony Uk Ltd | Loudspeaker |
| US6373957B1 (en) | 2001-05-14 | 2002-04-16 | Harman International Industries, Incorporated | Loudspeaker structure |
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