JPS59189090A - スクラツプチヨツパ装置 - Google Patents

スクラツプチヨツパ装置

Info

Publication number
JPS59189090A
JPS59189090A JP58062510A JP6251083A JPS59189090A JP S59189090 A JPS59189090 A JP S59189090A JP 58062510 A JP58062510 A JP 58062510A JP 6251083 A JP6251083 A JP 6251083A JP S59189090 A JPS59189090 A JP S59189090A
Authority
JP
Japan
Prior art keywords
scrap
cut
laser
laser beam
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58062510A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6254595B2 (enExample
Inventor
Hideaki Kaita
戒田　英昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58062510A priority Critical patent/JPS59189090A/ja
Publication of JPS59189090A publication Critical patent/JPS59189090A/ja
Publication of JPS6254595B2 publication Critical patent/JPS6254595B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Accessories And Tools For Shearing Machines (AREA)
  • Laser Beam Processing (AREA)
JP58062510A 1983-04-08 1983-04-08 スクラツプチヨツパ装置 Granted JPS59189090A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58062510A JPS59189090A (ja) 1983-04-08 1983-04-08 スクラツプチヨツパ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58062510A JPS59189090A (ja) 1983-04-08 1983-04-08 スクラツプチヨツパ装置

Publications (2)

Publication Number Publication Date
JPS59189090A true JPS59189090A (ja) 1984-10-26
JPS6254595B2 JPS6254595B2 (enExample) 1987-11-16

Family

ID=13202242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58062510A Granted JPS59189090A (ja) 1983-04-08 1983-04-08 スクラツプチヨツパ装置

Country Status (1)

Country Link
JP (1) JPS59189090A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6268797U (enExample) * 1985-10-18 1987-04-30
US7456372B2 (en) 1996-11-20 2008-11-25 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7462802B2 (en) 1996-11-20 2008-12-09 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6268797U (enExample) * 1985-10-18 1987-04-30
US7456372B2 (en) 1996-11-20 2008-11-25 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7462802B2 (en) 1996-11-20 2008-12-09 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7667160B2 (en) 1996-11-20 2010-02-23 Ibiden Co., Ltd Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7732732B2 (en) 1996-11-20 2010-06-08 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board

Also Published As

Publication number Publication date
JPS6254595B2 (enExample) 1987-11-16

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