JPS59189072A - Flux coater - Google Patents

Flux coater

Info

Publication number
JPS59189072A
JPS59189072A JP5263384A JP5263384A JPS59189072A JP S59189072 A JPS59189072 A JP S59189072A JP 5263384 A JP5263384 A JP 5263384A JP 5263384 A JP5263384 A JP 5263384A JP S59189072 A JPS59189072 A JP S59189072A
Authority
JP
Japan
Prior art keywords
flux
top surface
foamed
foam
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5263384A
Other languages
Japanese (ja)
Inventor
Kiyoshi Shirakawa
白川 清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP5263384A priority Critical patent/JPS59189072A/en
Publication of JPS59189072A publication Critical patent/JPS59189072A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/082Flux dispensers; Apparatus for applying flux

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE:To coat uniformly a flux by immersing a foamed body of which at least the top surface is made flat into the flux in such a way as to parallel the top surface thereof with the top surface of the flux and feeding air in the flux thereby making the propagating distance of foam equal and the size of the foamed flux the same. CONSTITUTION:A foamed body 7 which is made into a flat plate shape is used and is installed roughly in parallel with the top surface of a flux 4. Said body is covered with a holder 8 so as to all the air fed through a pipe 3 into the same is ejected through the body 7. The foamed flux is then generated only on the flat top surface side of the body 7 and since the propagating distance to the top surface of the flux is equal, the size of the foamed flux is the same.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は自動半田付装置に使用する発泡式のフラックス
塗布装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a foaming type flux applicator used in automatic soldering equipment.

従来例の構成とその問題点 一般に使用されている発泡式のフラックス塗布装置はい
ずれも第1図に示すように容器1内に焼結合金や素焼に
よって構成された円筒状の発泡体2を配置し、外部から
パイプ3を通じて空気を送り込むことにより容器1内に
充満されたフラックス4を発泡させ、ノズル5を通じて
印刷配線板6の裏面に上記発泡されたフラックス4を塗
布するように構成している。ところで、この種のもので
は発泡体2が円筒状に形成されてお7−リ、パイプ3を
通じて送り込まれた空気が発泡体2の全周に形成された
無数の孔から噴出するように構成されているため、フラ
ックス上面に至る気泡の伝搬距離が異なる関係で発泡し
たフラックスの大きさが発泡体2の上方で形成されたも
のと下方で形成されたものとで大きく異なることになり
、印刷配線板6の裏面に塗布されるフラックスの量が著
しく不均一になるという問題があった。
Conventional Structures and Problems Generally used foam-type flux applicators all have a cylindrical foam body 2 made of sintered metal or bisque fired in a container 1, as shown in FIG. The flux 4 filled in the container 1 is foamed by sending air from the outside through a pipe 3, and the foamed flux 4 is applied to the back surface of the printed wiring board 6 through a nozzle 5. . By the way, in this kind of foam body 2, the foam body 2 is formed in a cylindrical shape, and the air fed through the pipe 3 is configured so as to blow out from numerous holes formed around the entire circumference of the foam body 2. Therefore, the size of the foamed flux differs greatly between the foamed flux formed above and below the foam 2 due to the difference in the propagation distance of the bubbles to the upper surface of the flux, and the printed wiring There was a problem in that the amount of flux applied to the back surface of the plate 6 was significantly non-uniform.

発明の目的 本発明は以上のような従来の欠点を除去するものであり
、簡単な構成で均一にむらなく7ラノクスを印刷配線板
に塗布できる優れたフラックス塗布装置を提供すること
を目的とするものである。
Purpose of the Invention The purpose of the present invention is to eliminate the above-mentioned conventional drawbacks, and an object thereof is to provide an excellent flux coating device that can uniformly and evenly coat a printed wiring board with 7 Ranox with a simple configuration. It is something.

発明の構成 上記の目的を達成するため、本発明のフラックス塗布装
置は、少なくとも上面がフラットに形成された発泡体を
、その上面がフラックスの上面とはソ平行になるように
上記フラックスの中に浸漬配置したことを特徴とするも
のであり、特に、発泡体を平板状に形成することにより
発泡されたフラックスの大きさがはソ均一になるように
構成したものである。
Structure of the Invention In order to achieve the above object, the flux coating device of the present invention includes a foamed body having at least a flat top surface, which is placed in the flux so that the top surface is parallel to the top surface of the flux. It is characterized by a dipping arrangement, and in particular, it is constructed so that the foamed flux is uniform in size by forming the foam into a flat plate shape.

実施例の説明 以下、本発明のフラックス塗布装置について一実施例の
図面とともに説明する。第2図は本発明のフラックス塗
布装置における一実施例の断側面図であり、図中、第1
図と同一の符号を付したものは同一のものを示している
。そして、7は平板状に形成されフラックス4の上面と
はソ平行に配置された焼結合金、素焼等より成る発泡体
、8は発泡体γを保持し、パイプ3全通し−ご送り適才
れ/(空気がすべて発泡体7を通して噴出されるように
カバーするホルダーである。このように構成すると、発
泡したフラックスは発泡体7の平和な上l) 面側のみに発生され、フラックス上面に至る気泡伝搬距
離が等しいために発泡したフラックスの大きさが同一の
ものとなり、印刷配線板6に対して常に均一に塗布され
る。
DESCRIPTION OF EMBODIMENTS The flux coating apparatus of the present invention will be described below with reference to drawings of one embodiment. FIG. 2 is a cross-sectional side view of one embodiment of the flux coating apparatus of the present invention, and in the figure, the first
Items with the same reference numerals as those in the figures indicate the same items. 7 is a foam made of sintered alloy, bisque, etc. formed into a flat plate and placed parallel to the upper surface of the flux 4; 8 holds a foam γ; / (This is a holder that covers so that all the air is blown out through the foam 7. With this configuration, the foamed flux is generated only on the peaceful upper surface of the foam 7) and reaches the top surface of the flux. Since the bubble propagation distances are equal, the size of the foamed flux is the same, and the printed wiring board 6 is always uniformly coated.

尚、実施例では発泡体7全体を平板状に形成しているが
、少なくとも上面のみフラットに形成されているもので
あtばはソ同様の効果を得ることができ、これに代える
ことも可能である。
In the example, the entire foam 7 is formed into a flat plate shape, but if at least only the upper surface is formed flat, the same effect as in the case can be obtained, and it is also possible to replace this. It is.

発明の効果 上記実施例より明らかなように本発明のフラックス塗布
装置は、発泡体として平板状のものを使用し、しかもこ
れをフラックスの上面に対してはソ平行に配置している
だめ、パイプを通して空気を送シ込むことにより形成さ
れる発泡したフラックスの大きさはほとんど同一のもの
になり、印刷配線板に対しても常に均一に塗布されるこ
とになる。したがって、本発明によればその後の半田付
作業も著しく均一になり実用上きわめて有利なものであ
る。
Effects of the Invention As is clear from the above embodiments, the flux applicator of the present invention uses a flat plate as the foam and is arranged parallel to the upper surface of the flux. The size of the foamed flux formed by blowing air through it becomes almost the same, and it is always uniformly applied to the printed wiring board. Therefore, according to the present invention, the subsequent soldering work becomes extremely uniform, which is extremely advantageous in practice.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のフラックス塗布装置の断側面図、第2図
は本発明のフラックス塗布装置における一実施例の断側
面図である。 1・・・・・容器、3・・・・・パイプ、4・・・ 7
ラノクス、5・−ノズノペ6・・ 印刷配線板、7・ 
・発泡体、8・・ ホルダー。
FIG. 1 is a sectional side view of a conventional flux coating device, and FIG. 2 is a sectional side view of an embodiment of the flux coating device of the present invention. 1... Container, 3... Pipe, 4... 7
Rannox, 5・-Nozunope 6・・ Printed wiring board, 7・
- Foam, 8... Holder.

Claims (1)

【特許請求の範囲】[Claims] 少なくとも上面がフラットに形成された平板状の発泡体
を、その上面がフラ、ノクスの上面とはソ平行に々るよ
うに上記フラックスの中に浸漬配置したことを特徴とす
るフラ・ノクス塗布装置。
A Fura Nox coating device characterized in that a flat plate-shaped foam having at least a flat top surface is immersed and placed in the flux so that the top surface is parallel to the top surface of the Fura Nox. .
JP5263384A 1984-03-19 1984-03-19 Flux coater Pending JPS59189072A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5263384A JPS59189072A (en) 1984-03-19 1984-03-19 Flux coater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5263384A JPS59189072A (en) 1984-03-19 1984-03-19 Flux coater

Publications (1)

Publication Number Publication Date
JPS59189072A true JPS59189072A (en) 1984-10-26

Family

ID=12920224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5263384A Pending JPS59189072A (en) 1984-03-19 1984-03-19 Flux coater

Country Status (1)

Country Link
JP (1) JPS59189072A (en)

Similar Documents

Publication Publication Date Title
US4602730A (en) Device for soldering printed board
JPS59189072A (en) Flux coater
EP0139360A3 (en) A sound-absorbent metal sheet, a method for its manufacture and acoustic materials made therefrom
IT8123618A0 (en) PROCEDURE FOR PREPARING A SURFACE OF AN OBJECT FOR COATING WITH POLYMERS AND OBJECT COATED WITH POLYMERS THROUGH SAID PROCEDURE.
ATE209T1 (en) DEVICE FOR APPLYING A LAYER OF SOLDER TO A CIRCUIT BOARD
JPS59189071A (en) Flux coater
JPS563690A (en) High speed through-hole plating method
US5868324A (en) Nozzle for soldering apparatus
JP3000729U (en) Flux applicator
JPH0116236B2 (en)
DE3460855D1 (en) Coating masses from plastisols or organosols and process for improving the adherence thereof on metallic substrates
CN208362519U (en) A kind of electroplanting device
JPH07266031A (en) Device for coating flux
JPS6422374A (en) Coating equipment
JP3903535B2 (en) Coating film forming method and apparatus
JP2842095B2 (en) Flux coating device
JPS57109569A (en) Coating method for flux
JPH0242475U (en)
JPS62110869A (en) Automatic flux coating device
JPS54117542A (en) Equipment for fluidized powder coating
JPS605480U (en) Paint film forming equipment
JPS5310112A (en) Supersonic atomizer
JPH02295673A (en) Flux applying device
JPS5826546Y2 (en) Auxiliary cathode for plating printed circuit boards
JPS5828698Y2 (en) fluxa