JPS59189069A - 電気部品の端子のハンダ塗布装置 - Google Patents
電気部品の端子のハンダ塗布装置Info
- Publication number
- JPS59189069A JPS59189069A JP6437283A JP6437283A JPS59189069A JP S59189069 A JPS59189069 A JP S59189069A JP 6437283 A JP6437283 A JP 6437283A JP 6437283 A JP6437283 A JP 6437283A JP S59189069 A JPS59189069 A JP S59189069A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- liquid
- plate
- terminals
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title description 7
- 239000011248 coating agent Substances 0.000 title description 2
- 238000000576 coating method Methods 0.000 title description 2
- 239000007788 liquid Substances 0.000 claims abstract description 35
- 238000009434 installation Methods 0.000 claims description 2
- 230000004907 flux Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010936 titanium Substances 0.000 abstract description 2
- 229910052719 titanium Inorganic materials 0.000 abstract description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052721 tungsten Inorganic materials 0.000 abstract description 2
- 239000010937 tungsten Substances 0.000 abstract description 2
- 238000005219 brazing Methods 0.000 abstract 2
- 238000011109 contamination Methods 0.000 abstract 1
- 238000007654 immersion Methods 0.000 description 5
- 230000008719 thickening Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6437283A JPS59189069A (ja) | 1983-04-12 | 1983-04-12 | 電気部品の端子のハンダ塗布装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6437283A JPS59189069A (ja) | 1983-04-12 | 1983-04-12 | 電気部品の端子のハンダ塗布装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59189069A true JPS59189069A (ja) | 1984-10-26 |
| JPS6243784B2 JPS6243784B2 (enrdf_load_stackoverflow) | 1987-09-16 |
Family
ID=13256387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6437283A Granted JPS59189069A (ja) | 1983-04-12 | 1983-04-12 | 電気部品の端子のハンダ塗布装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59189069A (enrdf_load_stackoverflow) |
Cited By (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4739919A (en) * | 1987-06-15 | 1988-04-26 | Northern Telecom Limited | Masking of circuit boards for wave soldering |
| JPH0235450U (enrdf_load_stackoverflow) * | 1988-08-30 | 1990-03-07 | ||
| US6476487B2 (en) | 1992-10-30 | 2002-11-05 | Showa Denko K.K. | Solder circuit |
| US9093435B2 (en) | 2011-05-03 | 2015-07-28 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
| US9095074B2 (en) | 2012-12-20 | 2015-07-28 | Invensas Corporation | Structure for microelectronic packaging with bond elements to encapsulation surface |
| US9646917B2 (en) | 2014-05-29 | 2017-05-09 | Invensas Corporation | Low CTE component with wire bond interconnects |
| US9659848B1 (en) | 2015-11-18 | 2017-05-23 | Invensas Corporation | Stiffened wires for offset BVA |
| US9685365B2 (en) | 2013-08-08 | 2017-06-20 | Invensas Corporation | Method of forming a wire bond having a free end |
| US9691731B2 (en) | 2011-05-03 | 2017-06-27 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
| US9691679B2 (en) | 2012-02-24 | 2017-06-27 | Invensas Corporation | Method for package-on-package assembly with wire bonds to encapsulation surface |
| US9728527B2 (en) | 2013-11-22 | 2017-08-08 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
| US9735084B2 (en) | 2014-12-11 | 2017-08-15 | Invensas Corporation | Bond via array for thermal conductivity |
| US9761554B2 (en) | 2015-05-07 | 2017-09-12 | Invensas Corporation | Ball bonding metal wire bond wires to metal pads |
| US9761558B2 (en) | 2011-10-17 | 2017-09-12 | Invensas Corporation | Package-on-package assembly with wire bond vias |
| US9812402B2 (en) | 2015-10-12 | 2017-11-07 | Invensas Corporation | Wire bond wires for interference shielding |
| US9837330B2 (en) | 2014-01-17 | 2017-12-05 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
| US9842745B2 (en) | 2012-02-17 | 2017-12-12 | Invensas Corporation | Heat spreading substrate with embedded interconnects |
| US9852969B2 (en) | 2013-11-22 | 2017-12-26 | Invensas Corporation | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects |
| US9888579B2 (en) | 2015-03-05 | 2018-02-06 | Invensas Corporation | Pressing of wire bond wire tips to provide bent-over tips |
| US9911718B2 (en) | 2015-11-17 | 2018-03-06 | Invensas Corporation | ‘RDL-First’ packaged microelectronic device for a package-on-package device |
| US9917073B2 (en) | 2012-07-31 | 2018-03-13 | Invensas Corporation | Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package |
| US9935075B2 (en) | 2016-07-29 | 2018-04-03 | Invensas Corporation | Wire bonding method and apparatus for electromagnetic interference shielding |
| US9947641B2 (en) | 2014-05-30 | 2018-04-17 | Invensas Corporation | Wire bond support structure and microelectronic package including wire bonds therefrom |
| US9953914B2 (en) | 2012-05-22 | 2018-04-24 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
| US9984992B2 (en) | 2015-12-30 | 2018-05-29 | Invensas Corporation | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces |
| US9984901B2 (en) | 2005-12-23 | 2018-05-29 | Tessera, Inc. | Method for making a microelectronic assembly having conductive elements |
| US10008469B2 (en) | 2015-04-30 | 2018-06-26 | Invensas Corporation | Wafer-level packaging using wire bond wires in place of a redistribution layer |
| US10008477B2 (en) | 2013-09-16 | 2018-06-26 | Invensas Corporation | Microelectronic element with bond elements to encapsulation surface |
| US10026717B2 (en) | 2013-11-22 | 2018-07-17 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
| US10128216B2 (en) | 2010-07-19 | 2018-11-13 | Tessera, Inc. | Stackable molded microelectronic packages |
| US10181457B2 (en) | 2015-10-26 | 2019-01-15 | Invensas Corporation | Microelectronic package for wafer-level chip scale packaging with fan-out |
| US10297582B2 (en) | 2012-08-03 | 2019-05-21 | Invensas Corporation | BVA interposer |
| US10299368B2 (en) | 2016-12-21 | 2019-05-21 | Invensas Corporation | Surface integrated waveguides and circuit structures therefor |
| US10332854B2 (en) | 2015-10-23 | 2019-06-25 | Invensas Corporation | Anchoring structure of fine pitch bva |
| US10381326B2 (en) | 2014-05-28 | 2019-08-13 | Invensas Corporation | Structure and method for integrated circuits packaging with increased density |
| US10460958B2 (en) | 2013-08-07 | 2019-10-29 | Invensas Corporation | Method of manufacturing embedded packaging with preformed vias |
| US10490528B2 (en) | 2015-10-12 | 2019-11-26 | Invensas Corporation | Embedded wire bond wires |
-
1983
- 1983-04-12 JP JP6437283A patent/JPS59189069A/ja active Granted
Cited By (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4739919A (en) * | 1987-06-15 | 1988-04-26 | Northern Telecom Limited | Masking of circuit boards for wave soldering |
| JPH0235450U (enrdf_load_stackoverflow) * | 1988-08-30 | 1990-03-07 | ||
| US6476487B2 (en) | 1992-10-30 | 2002-11-05 | Showa Denko K.K. | Solder circuit |
| US9984901B2 (en) | 2005-12-23 | 2018-05-29 | Tessera, Inc. | Method for making a microelectronic assembly having conductive elements |
| US10128216B2 (en) | 2010-07-19 | 2018-11-13 | Tessera, Inc. | Stackable molded microelectronic packages |
| US10593643B2 (en) | 2011-05-03 | 2020-03-17 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
| US10062661B2 (en) | 2011-05-03 | 2018-08-28 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
| US9093435B2 (en) | 2011-05-03 | 2015-07-28 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
| US9691731B2 (en) | 2011-05-03 | 2017-06-27 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
| US11424211B2 (en) | 2011-05-03 | 2022-08-23 | Tessera Llc | Package-on-package assembly with wire bonds to encapsulation surface |
| US10756049B2 (en) | 2011-10-17 | 2020-08-25 | Invensas Corporation | Package-on-package assembly with wire bond vias |
| US11735563B2 (en) | 2011-10-17 | 2023-08-22 | Invensas Llc | Package-on-package assembly with wire bond vias |
| US9761558B2 (en) | 2011-10-17 | 2017-09-12 | Invensas Corporation | Package-on-package assembly with wire bond vias |
| US11189595B2 (en) | 2011-10-17 | 2021-11-30 | Invensas Corporation | Package-on-package assembly with wire bond vias |
| US9842745B2 (en) | 2012-02-17 | 2017-12-12 | Invensas Corporation | Heat spreading substrate with embedded interconnects |
| US9691679B2 (en) | 2012-02-24 | 2017-06-27 | Invensas Corporation | Method for package-on-package assembly with wire bonds to encapsulation surface |
| US10510659B2 (en) | 2012-05-22 | 2019-12-17 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
| US10170412B2 (en) | 2012-05-22 | 2019-01-01 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
| US9953914B2 (en) | 2012-05-22 | 2018-04-24 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
| US9917073B2 (en) | 2012-07-31 | 2018-03-13 | Invensas Corporation | Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package |
| US10297582B2 (en) | 2012-08-03 | 2019-05-21 | Invensas Corporation | BVA interposer |
| US9095074B2 (en) | 2012-12-20 | 2015-07-28 | Invensas Corporation | Structure for microelectronic packaging with bond elements to encapsulation surface |
| US9615456B2 (en) | 2012-12-20 | 2017-04-04 | Invensas Corporation | Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface |
| US10460958B2 (en) | 2013-08-07 | 2019-10-29 | Invensas Corporation | Method of manufacturing embedded packaging with preformed vias |
| US9685365B2 (en) | 2013-08-08 | 2017-06-20 | Invensas Corporation | Method of forming a wire bond having a free end |
| US10008477B2 (en) | 2013-09-16 | 2018-06-26 | Invensas Corporation | Microelectronic element with bond elements to encapsulation surface |
| US10629567B2 (en) | 2013-11-22 | 2020-04-21 | Invensas Corporation | Multiple plated via arrays of different wire heights on same substrate |
| US10290613B2 (en) | 2013-11-22 | 2019-05-14 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
| US10026717B2 (en) | 2013-11-22 | 2018-07-17 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
| USRE49987E1 (en) | 2013-11-22 | 2024-05-28 | Invensas Llc | Multiple plated via arrays of different wire heights on a same substrate |
| US9728527B2 (en) | 2013-11-22 | 2017-08-08 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
| US9852969B2 (en) | 2013-11-22 | 2017-12-26 | Invensas Corporation | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects |
| US11990382B2 (en) | 2014-01-17 | 2024-05-21 | Adeia Semiconductor Technologies Llc | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
| US10529636B2 (en) | 2014-01-17 | 2020-01-07 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
| US9837330B2 (en) | 2014-01-17 | 2017-12-05 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
| US11404338B2 (en) | 2014-01-17 | 2022-08-02 | Invensas Corporation | Fine pitch bva using reconstituted wafer with area array accessible for testing |
| US10381326B2 (en) | 2014-05-28 | 2019-08-13 | Invensas Corporation | Structure and method for integrated circuits packaging with increased density |
| US10032647B2 (en) | 2014-05-29 | 2018-07-24 | Invensas Corporation | Low CTE component with wire bond interconnects |
| US9646917B2 (en) | 2014-05-29 | 2017-05-09 | Invensas Corporation | Low CTE component with wire bond interconnects |
| US10475726B2 (en) | 2014-05-29 | 2019-11-12 | Invensas Corporation | Low CTE component with wire bond interconnects |
| US9947641B2 (en) | 2014-05-30 | 2018-04-17 | Invensas Corporation | Wire bond support structure and microelectronic package including wire bonds therefrom |
| US9735084B2 (en) | 2014-12-11 | 2017-08-15 | Invensas Corporation | Bond via array for thermal conductivity |
| US9888579B2 (en) | 2015-03-05 | 2018-02-06 | Invensas Corporation | Pressing of wire bond wire tips to provide bent-over tips |
| US10806036B2 (en) | 2015-03-05 | 2020-10-13 | Invensas Corporation | Pressing of wire bond wire tips to provide bent-over tips |
| US10008469B2 (en) | 2015-04-30 | 2018-06-26 | Invensas Corporation | Wafer-level packaging using wire bond wires in place of a redistribution layer |
| US9761554B2 (en) | 2015-05-07 | 2017-09-12 | Invensas Corporation | Ball bonding metal wire bond wires to metal pads |
| US10559537B2 (en) | 2015-10-12 | 2020-02-11 | Invensas Corporation | Wire bond wires for interference shielding |
| US10115678B2 (en) | 2015-10-12 | 2018-10-30 | Invensas Corporation | Wire bond wires for interference shielding |
| US10490528B2 (en) | 2015-10-12 | 2019-11-26 | Invensas Corporation | Embedded wire bond wires |
| US11462483B2 (en) | 2015-10-12 | 2022-10-04 | Invensas Llc | Wire bond wires for interference shielding |
| US9812402B2 (en) | 2015-10-12 | 2017-11-07 | Invensas Corporation | Wire bond wires for interference shielding |
| US10332854B2 (en) | 2015-10-23 | 2019-06-25 | Invensas Corporation | Anchoring structure of fine pitch bva |
| US10181457B2 (en) | 2015-10-26 | 2019-01-15 | Invensas Corporation | Microelectronic package for wafer-level chip scale packaging with fan-out |
| US10043779B2 (en) | 2015-11-17 | 2018-08-07 | Invensas Corporation | Packaged microelectronic device for a package-on-package device |
| US9911718B2 (en) | 2015-11-17 | 2018-03-06 | Invensas Corporation | ‘RDL-First’ packaged microelectronic device for a package-on-package device |
| US9659848B1 (en) | 2015-11-18 | 2017-05-23 | Invensas Corporation | Stiffened wires for offset BVA |
| US9984992B2 (en) | 2015-12-30 | 2018-05-29 | Invensas Corporation | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces |
| US10325877B2 (en) | 2015-12-30 | 2019-06-18 | Invensas Corporation | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces |
| US10658302B2 (en) | 2016-07-29 | 2020-05-19 | Invensas Corporation | Wire bonding method and apparatus for electromagnetic interference shielding |
| US9935075B2 (en) | 2016-07-29 | 2018-04-03 | Invensas Corporation | Wire bonding method and apparatus for electromagnetic interference shielding |
| US10299368B2 (en) | 2016-12-21 | 2019-05-21 | Invensas Corporation | Surface integrated waveguides and circuit structures therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6243784B2 (enrdf_load_stackoverflow) | 1987-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59189069A (ja) | 電気部品の端子のハンダ塗布装置 | |
| US3889364A (en) | Method of making soldered electrical connections | |
| CA1213073A (en) | Method of manufacturing printed wiring boards | |
| US4011980A (en) | Flow-over mass soldering | |
| US4337573A (en) | Method for constructing an electrical interconnection circuit and apparatus for realizing the method | |
| US3690943A (en) | Method of alloying two metals | |
| US3416958A (en) | Alloy coating for electrical conductors | |
| JPH0331785B2 (enrdf_load_stackoverflow) | ||
| EP0111599A1 (en) | Method of processing through-holes | |
| USH54H (en) | Soldering external leads to film circuits | |
| JP2521177B2 (ja) | プリント基板のはんだコ―ト方法 | |
| JPH05259632A (ja) | プリント配線板およびその製造方法 | |
| JP3520457B2 (ja) | 錫被覆金属板及びその製造法 | |
| JP2679455B2 (ja) | チップ状電子部品の半田付け方法 | |
| JPH03237735A (ja) | Ｔａｂテープ | |
| KR950008697B1 (ko) | Tab 테이프 | |
| JPS6339117B2 (enrdf_load_stackoverflow) | ||
| JPH06177514A (ja) | プリント配線板の製造方法 | |
| JPH01112721A (ja) | 電子部品のリード線取付方法 | |
| JPH06342968A (ja) | プリント配線板、その製造方法及びその実装方法 | |
| Klein Wassink | An Introduction to Soldering: Part 1 | |
| JPH01151183A (ja) | 角形電子部品の製造方法 | |
| Morris | Equipment evaluations and process techniques for drag soldering printed wiring assemblies | |
| JPS60206195A (ja) | 半田層の形成方法 | |
| JPH031105B2 (enrdf_load_stackoverflow) |