JPS59186479A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To absorb a position shift between a semiconductor chip and a package where the semiconductor chip is arranged fixedly when an optical system consisting of a lens and a solid-state image pickup element consisting of the semiconductor chip and package are combined together by forming the solid- state image pickup element, and optical system consisting in one body. CONSTITUTION:A projection part 5b is provided to rear recessed part 5a of the optical system 5 consisting of the lens, etc., and fitted in the positioning reference hole 4 of the solid-state image pickup element 1, and while an image of an object is picked up by connecting the lead part 6 of the solid-state image pickup element 1 to a camera set electrically, positioning is performed longitudinally, laterally, and in a rotational direction; and the solid-state image pickup element 1 is adhered and fixed to the optical system 5 there by using a resin adhesive 7. Thus, the position shift between the package 3 and chip 2 is absorbed by the optical system 5 and corrected.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a solid-state imaging device, and particularly to a solid-state imaging device in which the optical axes of a solid-state imaging probe and an optical system are made to coincide with each other with high precision.

[Background of the invention]

In conventional solid-state imaging devices, the solid-state imaging device, in which a semiconductor chip is housed in a package, and the optical system, which consists of a lens, are each formed independently. A reference hole was provided to align the center axis of the optical system. Normally, the solid-state image sensor is manufactured by an electronic component supplier, and the solid-state image sensor and optical system are assembled by a camera set manufacturer.

In this case, since the solid-state imaging probe and the camera are assembled in separate steps, it is necessary to improve the positioning accuracy between the package mounting hole of the solid-state image element and the center of the chip. However, packages for solid-state image sensors are often made of materials such as ceramics.
Therefore, it has been difficult to provide highly accurate positioning holes.

In addition, as shown in the plan view of the manufacturing section in Fig. 1, the solid-state imaging cable l
The chip 2 is attached to the package 3 in a predetermined positional relationship by brazing. At this time, the positioning of the chip 2 is performed using a positioning reference hole 4 provided in the package 3 as a reference. However, the positional relationship between the pan cage 3 and the chip 2 may deviate due to work errors or errors in the positioning reference hole 4 when mounting the chip 2. This misalignment causes an optical axis misalignment with the optical system when the solid-state imaging device l is attached to the camera, posing a problem in that normal imaging is impossible.

[Purpose of the invention]

Therefore, the present invention has been made in view of the above-mentioned conventional problems, and its object is to provide a solid-state structure that absorbs the misalignment between the chip and the package when combining an optical system and a solid-state image sensor. An object of the present invention is to provide an imaging device.

[Summary of the invention]

In order to achieve such an object, a solid-state imaging device according to the present invention integrates an optical system and a solid-state imaging element.

[Embodiments of the invention]

Next, embodiments of the present invention will be described in detail using the drawings.

FIG. 2 is a cross-sectional configuration diagram of a main part showing an embodiment of a solid-state imaging device according to the present invention, and the same symbols as those in the above-mentioned figures indicate the same elements, and the explanation thereof will be omitted. In the figure, a protrusion 5b is provided on the four rear parts 5a of an optical system 5 consisting of a lens, etc., and the positioning reference hole of the solid-state image sensor I is fitted into this protrusion 5b, and the lead part 6 of the solid-state image sensor I is inserted into the protrusion 5b. While electrically connecting a camera set (not shown) to image the subject, align the vertical, horizontal, and rotational directions. Once the predetermined positioning is achieved, use the resin adhesive 7 at that point to attach the solid-state image sensor. 1 is adhesively fixed to the optical system 5.

According to such a configuration, the optical system 5 can absorb and correct the positional deviation between the package 3 and the tip 2.

FIGS. 3 and 4 are main part cross-sectional configuration diagrams showing other embodiments of the solid-state imaging device according to the present invention, and since the same symbols as in the above-mentioned figures represent the same elements, a description thereof will be omitted. First, the third
In the figure, a solid-state image sensor l is mounted on the protrusion 5b of the optical system 5.
The positioning reference hole 4 is inserted and the screw 8 is used to fix the positioning hole 4 in place. In this case, the optical system 5
The diameter of the protruding portion 5b is relatively smaller than the diameter of the reference hole 4, and the configuration is such that a dimensional tolerance is provided between the two diameter dimensions. In addition, in FIG.
Adhesive and fix it to a using resin adhesive 7. In this case, in both of the above embodiments, the lead portion 6 of the solid-state image sensor l
Connect it to the camera set, and while capturing the image of the subject,
Needless to say, after the alignment in the lateral and rotational directions is completed, the arrangement is fixed.

Even in such a configuration, effects completely equivalent to those of the above-mentioned embodiments can be obtained.

〔Effect of the invention〕

As explained above, according to the present invention, after combining the optical system and the solid-state image sensor, positional deviations in the vertical, I, and co-rotation directions that occur when the chip is adhesively fixed to the package by brazing or the like can be corrected. Since it can be corrected in the process, the optical axes of the chip and the optical system are aligned with high precision, and an extremely excellent effect can be obtained in that normal imaging is possible.

[Brief explanation of drawings]

FIG. 1 is a plan view of a main part showing an example of a conventional solid-state imaging device, FIG. 2 is a sectional view of a main part showing an embodiment of a solid-state imaging device according to the present invention, and FIGS. FIG. 7 is a cross-sectional configuration diagram of main parts showing another embodiment of the solid-state imaging device according to the invention. l...solid-state image sensor, 2...chip, 34 package, 4...positioning reference hole, 5-optical system, 5
a Recessed portion on the back of the song, 5b... protruding portion, 6 song lead portion, 7
Curved resin adhesive, 8 medium screws. 1st eye 3rd figure 2nd flash) 64 Kasumi

Claims (1)

[Claims] 1. A solid-state imaging device, characterized in that a solid-state imaging device comprising a semiconductor chip and a package in which the semiconductor chip is fixedly arranged, and an optical system comprising a lens are integrally constructed.