JPS59186336A - Wafer supply apparatus - Google Patents
Wafer supply apparatusInfo
- Publication number
- JPS59186336A JPS59186336A JP5924783A JP5924783A JPS59186336A JP S59186336 A JPS59186336 A JP S59186336A JP 5924783 A JP5924783 A JP 5924783A JP 5924783 A JP5924783 A JP 5924783A JP S59186336 A JPS59186336 A JP S59186336A
- Authority
- JP
- Japan
- Prior art keywords
- cassette
- fixing
- rotating device
- wafer
- cassette fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、ウェハ供給装置に係り、特に複数個のカセッ
トからウェハを取り出し、また、複数個のカセットヘウ
ェハを回収するのｆこ好適なウェハ供給装置に関する、
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a wafer supply device, and particularly to a wafer supply device suitable for taking out wafers from a plurality of cassettes and collecting wafers into a plurality of cassettes. Regarding the supply device,
It is something.
従来のウェハ供給装置を第１図により説明する。 A conventional wafer supply device will be explained with reference to FIG.
第１図で、一方のカセット１０ａ （第１図では、）＼
右側のカセット）に装填されているウェノ（図示省略）
をカセット１０ ａから取り出す場合は、まず駆動モー
タ１１ ａを駆動し、歯車１２ ａと噛合すると共１こ
カセット１０ ａの１ピッチ分の距離に対応したピッチ
円直径を有する歯車１３ ａを回転させ台形ネジ１４
ａを回転させる。これ蚤こより可動具１５ ａおよび可
動具１５ａ１こ設けられたカセット固定台１６ ａは、
カセット１０ ａの１ピンチ分に相当する距離だけ、こ
の場合は、下降し、カセット固定台１６ ａに載置て
Ｘれ固定されているカセット１０ ａは１ピッチ分下降
する。その結果、カセット１０ａの最下部ｌこ装填され
たウェハは、搬送ベルト１７ ａに載置され、搬送ベル
ト１７ ａを、二の場合は、時計回りに駆動させる二と
でカセット１０ ａ外へ取り出される。このような操作
によりカセット１０ ａを１ピツチ毎下降させることで
カセット１０ ａに隻螺→呻欣デ沖θ１−１５装填され
たウェハは全てカセット１０ ａ外へ取り出される。In Fig. 1, weno (not shown) loaded in one cassette 10a (in Fig. 1, )\right cassette)
When taking out the cassette 10a from the cassette 10a, first drive the drive motor 11a to rotate the gear 13a which meshes with the gear 12a and has a pitch circle diameter corresponding to the distance of one pitch of the cassette 10a. Trapezoidal screw 14
Rotate a. The movable tool 15a and the cassette fixing base 16a provided with the movable tool 15a are as follows:
In this case, the cassette 10a is lowered by a distance corresponding to one pinch, and the cassette 10a placed on the cassette fixing base 16a and fixed in an X-shape is lowered by one pitch. As a result, the wafer loaded at the bottom of the cassette 10a is placed on the conveyor belt 17a, and is taken out of the cassette 10a by driving the conveyor belt 17a clockwise. It will be done. By lowering the cassette 10a one pitch at a time through such an operation, all of the wafers loaded in the cassette 10a in the direction θ1-15 are taken out of the cassette 10a.
次に、他方のカセット１０ｂ （第１図では、左側のカ
セット）に装填されているウェハ（図示省略）をカセッ
トｔｏ ｂから取り出す場合は、まず、駆動モータ１１
ｂを駆動し、歯車１２ ｂと噛合すると兵舎こカセッ
ト１０ ｂの１ピッチ分の距離に対応したピンチ円直径
を有する歯＄１３ｂを回転させ台形イ、ジ１４ｂを回転
させる。これにより可動具１５ ｂおよび可動具１５
ｂ ｆこ設けられたカセット固定台１６ ｂは、カセッ
ト１０ｂの１ピンチ分に相当する距離だけ、この場合は
下降し、カセット固定台１６ ｂに載置され固定されて
いるカセット１０ ｂは１ピッチ分下降する。その結果
、カセット１０ ａの最下部に装填されたウェハは、搬
送ベルｈ １７ ｂ ＋こ載置され、搬送ベルｌ−１７
ｂ並びに搬送ベルト１７ ａを、この場合は、時計回り
に駆動させることでカセット１０ ｂ外へ取り出される
。このような操作蚤こよりカセット１０ ｂを１ピンチ
毎下降させることでカセット１０ ｂに装填されたウェ
ハは全てカセット１０ｂ外へ取り出される。Next, when taking out the wafer (not shown) loaded in the other cassette 10b (the left cassette in FIG. 1) from the cassette to b, first, the drive motor 11
When gear 12b is driven and meshed with gear 12b, tooth 13b having a pinch circle diameter corresponding to the distance of one pitch of barracks cassette 10b is rotated, and trapezoid 14b is rotated. As a result, the movable tool 15 b and the movable tool 15
The cassette fixing base 16b provided with b f is lowered by a distance corresponding to one pinch of the cassette 10b, and the cassette 10b placed and fixed on the cassette fixing base 16b is moved down by one pitch. It descends by a minute. As a result, the wafer loaded at the bottom of the cassette 10a is placed on the transport bell h 17 b +, and is placed on the transport bell l-17.
The cassette 10b is taken out by driving the cassette 10b and the conveyor belt 17a clockwise in this case. All the wafers loaded in the cassette 10b are taken out of the cassette 10b by lowering the cassette 10b one pinch at a time using this operating flea.
なお、上記した操作とは逆操作によりウェハはカセット
１０ａ、１Ｏｂｌこ回収され装填される。また、カセッ
ト１０ ａからのウェハの取り出し、カセット１０ ａ
へのウェハの回収完了後、カセット１０ ｂからのウェ
ハの取り出し、カセット１０ｂへのウエノ凡の回収を行
うこともてきる。The wafers are recovered and loaded into the cassette 10a by a reverse operation to that described above. Also, taking out the wafer from the cassette 10a, and removing the wafer from the cassette 10a
After the wafer collection is completed, the wafers can be taken out from the cassette 10b and the wafers can be collected into the cassette 10b.
このようなウェハ供給装置では、カセット個数に見合う
台数のカセット昇降装置を設置する必要があるため、ウ
ェハ供給装置の価格が増大するといった欠点があった。Such a wafer supply apparatus has the disadvantage that the price of the wafer supply apparatus increases because it is necessary to install a number of cassette lifting devices corresponding to the number of cassettes.
本発明の目的は、カセット個数に依らずカセット昇降装
置を１台設置するだけで良いようにすることで、価格の
増大を抑制できるウェハ供給装置を提供することにある
。SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer supply device that can suppress increases in cost by installing only one cassette lifting device regardless of the number of cassettes.
四
水元戸は、カセット固定台が複数個着脱可能（こに配設
されると共に、配設されたカセット固定台を同一軸心で
回動させる回動装置と、該回動装置との間でカセット固
定台を１台毎授受可能に設けられたカセット昇降装置と
、該昇降装置で昇降するカセット固定台に載置、固定さ
れたカセットととの間でウェハな授受可能に設けられた
ウェハ搬送手段とで構成したことを特徴とするもので、
カセット個数に依らずカセット昇降装置を１台設置する
だけで良いよう裔こしたものである。Shimizu Mototo has multiple cassette fixing bases that can be attached and detached. A cassette elevating device is provided to allow cassette fixing tables to be transferred one by one, and a cassette is placed and fixed on a cassette fixing table that is raised and lowered by the elevating device. It is characterized by comprising a conveyance means,
This design was inherited so that it is only necessary to install one cassette lifting device regardless of the number of cassettes.
本発明の一実施例を第２図により説明する。 An embodiment of the present invention will be described with reference to FIG.
第２図で、ウェハ供給装置は、複数個、この場合は２個
のカセット固定台１６ｃ、１６ｄが着脱可能１こ配設さ
れると共に、配設されたカセット固定台１６ｃ、１６ｄ
を同一軸心で回動させる回動装置加と、回動装置加との
間でカセット固定台１６ｃ、−１６ｄを１台毎授受可能
）こ設けられたカセット昇降装置間と、カセット昇降装
置（資）で昇降するカセット固定台１．６ｃ、１６ｄｊ
こ載置、固定されたカセット１０ ａ ＋１０ ｂとの
間でウェハ（図示省略）を授受可能憂こ設けられたウェ
ハ搬送手段、例えば、搬送ベルト４０とで構成されてい
る。In FIG. 2, the wafer supply device includes a plurality of detachable cassette fixing bases 16c and 16d, and two cassette fixing bases 16c and 16d.
The cassette fixing bases 16c and -16d can be exchanged one by one between the rotating device and the rotating device. Cassette fixing stand 1.6c, 16dj that goes up and down with
The cassettes 10 a + 10 b placed and fixed thereon are configured with a wafer conveying means, for example, a conveying belt 40, which is capable of transferring and receiving wafers (not shown).
回動装置（イ）は、カセット固定台支持具（以下、支持
具と略）２１と、支持具２１の中央部に垂設された軸ｎ
と、軸２２裔こ設けられたタイマ歯車２３ａと、タイマ
歯車２３ａが回動可能蚤こ設けられた昇降手段、例えば
、シリンダＵと、タイマ歯車２３ａ１こ噛合するタイマ
歯車２３ｂと、タイマ歯車２３ｂを回動駆動する駆動モ
ータ５とで構成されている。支持具２１には、カセット
の奥行よりも大きい間隔で、この場合、２個の突起物２
６ａ、２６ｂが形成されている。The rotation device (A) includes a cassette fixing table support (hereinafter referred to as support) 21 and a shaft n vertically installed in the center of the support 21.
, a timer gear 23a provided on a shaft 22, an elevating means provided with a rotatable collar, for example, a cylinder U, a timer gear 23b meshing with the timer gear 23a, and a timer gear 23b. It is composed of a drive motor 5 that rotates. The support 21 has, in this case, two protrusions 2 at intervals greater than the depth of the cassette.
6a and 26b are formed.
カセット昇降装置間は、台形ネジ３１と対応し設けられ
たガイド棒３２と、台形ネジ３１とガイド棒３２とに昇
降可能に設けられた可動具おと、可動具間）こ、その上
方の位置で設けられたカセット固定台支持具台（以下、
支持台と略）３４と、台形ネジ３１に設けられた歯車３
５ ａと、歯車３５ａ１こ噛合する歯車３５ｂと、歯車
３５ｂを回動駆動する駆動モータ３６とで構成されてい
る。支持台あには、カセット固定台１６ｃ、１６ｄ固定
用の突起物３７が形成されている。また、歯車３５ａは
、カセットの１１ノチ分の距離に対応したピンチ円直径
を有している。Between the cassette lifting device, there is a guide rod 32 provided corresponding to the trapezoidal screw 31, a movable tool provided on the trapezoidal screw 31 and the guide rod 32 so that it can be raised and lowered, and a position above the movable tool. The cassette fixing base support stand (hereinafter referred to as
A support stand (abbreviated) 34 and a gear 3 provided on a trapezoidal screw 31
5a, a gear 35b that meshes with the gear 35a, and a drive motor 36 that rotationally drives the gear 35b. A protrusion 37 for fixing the cassette fixing bases 16c and 16d is formed on the support base. Further, the gear 35a has a pinch circle diameter corresponding to a distance of 11 notches of the cassette.
カセット固定台１６ｃ、１６ｄには、突起物２６ａ。A protrusion 26a is provided on the cassette fixing bases 16c and 16d.
２６ｂに対応する形状の凹５０ａ、５０ｂが形成される
と共に、突起物３７に対応する形状の凹５１ａ、５１ｂ
が形成されている。また、搬送ベルト４０がカセット昇
降装置（９）と対応した位置１こ配置されている。Recesses 50a and 50b are formed in a shape corresponding to the protrusion 37, and recesses 51a and 51b are formed in a shape corresponding to the protrusion 37.
is formed. Further, a conveyor belt 40 is disposed at one position corresponding to the cassette lifting device (9).
支持具２】には、カセット固定台１６ｃ、１６ｄが固定
され、カセット固定台１６ｃ、１６ｄには、例えば、ウ
ェハが装填されたカセット１０ａ、１０ｂが載置、固定
される。Cassette fixing stands 16c and 16d are fixed to the support 2, and cassettes 10a and 10b loaded with wafers, for example, are placed and fixed on the cassette fixing stands 16c and 16d.
この状態でカセット固定台１６ ｃの凹５１． ａが、
第２図１こ示すように支持台あの突起物３７と対向する
位１Ｎまで回動装置加で回動される。その後、支持台あ
を所定レベルとすると共奢こ、突起物３７が凹５１ａに
充分挿入されるまで支持具２１はシリンダ列で降下させ
られる。このような支持台Ｍへのカセット固定台１６
ｃの固定完了後、搬送ヘルド４０によるカセット１６
Ｃからのウェハ取出し操作を阻害しない位置まで支持具
２１は退避させられる。その後、駆動モータ３６を駆動
し、歯車３５ｂを介し歯車３５ａを回転させ台形ネジ３
１を回転させる。これにより、可動具３３および支持台
調はカセットｌＯａの１ピッチ分に相当する距離だけ、
この場合は、下降し、支持台Ｍ、カセット固定台１６
ｃを介しカセット１０ａは１ピッチ分下降する。その結
果、カセット１０ａの最下部に装填されたウェハは、搬
送ベルト４０１こ載置され、搬送ベルト４０を、この場
合は、時計回１月こ駆動させることでカセット１０ ａ
外へ取出される。このような操作によりカセット１０
ａを１ピンチ毎下降させることでカセットｔＯａ装填さ
れたウェハは全てカセット１０ ａ外へ取出される。In this state, the recess 51 of the cassette fixing base 16c. a is,
As shown in FIG. 2, the support base is rotated by the rotation device until it faces the protrusion 37 1N. Thereafter, once the support base is set at a predetermined level, the support 21 is lowered in a row of cylinders until the protrusion 37 is fully inserted into the recess 51a. A cassette fixing base 16 to such a support base M
After the fixing of c is completed, the cassette 16 is moved by the transport heald 40.
The support 21 is retracted to a position where it does not obstruct the operation of taking out the wafer from C. After that, the drive motor 36 is driven to rotate the gear 35a via the gear 35b, and the trapezoidal screw 3 is rotated.
Rotate 1. As a result, the movable tool 33 and the support table are moved by a distance corresponding to one pitch of the cassette lOa.
In this case, the support stand M and the cassette fixing stand 16 are lowered.
The cassette 10a is lowered by one pitch through the path c. As a result, the wafer loaded at the bottom of the cassette 10a is placed on the conveyor belt 401, and by driving the conveyor belt 40 clockwise in this case, the wafer is transferred to the cassette 10a.
taken outside. Through such operations, cassette 10
By lowering a one pinch at a time, all the wafers loaded in the cassette tOa are taken out of the cassette 10a.
このようなウェハのカセット１０ ａ外への取出し完了
後、カセット固定台１６ ｃは、突起物２６ａが凹５０
ａ ｌ二充分挿入されるまで、また、突起物３７が凹
５１ ａから充分離脱するまでシリンダ列で上昇させら
れる。その後、この状態で駆動モータ２５ヲ駆動しタイ
マ歯車２３ｂを介しタイマ歯車２３ａを回動させること
で、カセット固定台１６ ｄは凹５１ ｂが支持台調の
突起物３７と対向する位置まで回動される。After the removal of such a wafer from the cassette 10a is completed, the cassette fixing base 16c has the protrusion 26a in the recess 50.
It is raised by the cylinder row until it is fully inserted and until the protrusion 37 is sufficiently removed from the recess 51a. Thereafter, by driving the drive motor 25 in this state and rotating the timer gear 23a via the timer gear 23b, the cassette fixing base 16d is rotated to a position where the recess 51b faces the support base-like protrusion 37. be done.
その後は、上記した操作と同様にてカセット＋６ ｄは
支持台調に固定され、カセット１０ｂ（こ装填されたウ
ェハは順次カセット１０ ｂ外へ取出される。Thereafter, the cassette +6d is fixed to the support base in the same manner as described above, and the wafers loaded in the cassette 10b are sequentially taken out of the cassette 10b.
なお、上記した操作とは逆操作によりウェハはカセット
１０ａ、１０１）に回収され装填される。また、ヨセノ
ト１０ ａからのウェハ取出し、カセット１０ ａへの
ウェハ回収完了後、カセット１０ｂからのウェハ取出し
、カセット１０ ｂへのウェハ回収を行うこともできる
、
本実施例のようなウェハ供給装置では、カセットが２個
の場合でもカセット昇降装置は１台設置するだけでよい
ので、ウェハ供給装置の価格の増大を抑制できる。Note that the wafers are collected and loaded into the cassettes 10a, 101) by a reverse operation to that described above. In addition, in the wafer supply device as in this embodiment, it is possible to take out the wafer from the cassette 10a and to collect the wafer into the cassette 10b after completing the collection of the wafer to the cassette 10a. Even when there are two cassettes, it is only necessary to install one cassette elevating device, so it is possible to suppress an increase in the price of the wafer supply device.
なお、このような効果は、カセット個数が更蚤こ多々な
るほど顕著となる。Note that this effect becomes more pronounced as the number of cassettes increases.
本発明は、以上説明したように、ウェハ供給装置を、カ
セット固定台が複数個着脱可能に配設されると共【こ、
配設されたカセット固定台を同一軸心で回動させる回動
装置と、この回動装置との間でカセット固定台を１個毎
授受可能に設けられたカセット昇降装置と、この昇降装
置で昇降するカセット固定台に載置、固定されたカセッ
トとの間でウェハな授受可能奢こ設けられたウェハ搬送
手段とで構成したことで、カセットの個数に依らずカセ
ット昇降装置を１台設置するだけで良いので、ウェハ供
給装置の価格の増大を抑制できる効果がある。As explained above, the present invention provides a wafer supply device in which a plurality of cassette fixing stands are removably disposed, and
A rotating device that rotates the disposed cassette fixing bases around the same axis, a cassette lifting device that is provided so that the cassette fixing tables can be transferred one by one between the rotating device, and this lifting device. The cassette lifting device is placed on a cassette fixing table that moves up and down, and is equipped with a luxurious wafer transport means that allows transfer of wafers between fixed cassettes, so one cassette lifting device can be installed regardless of the number of cassettes. This has the effect of suppressing an increase in the price of the wafer supply device.
第１図は、従来のウェハ供給装置の正面図、第２図は、
本発明によるウェハ供給装置の一実施例を示す正面図で
ある。
１６ｏ、１６ｄ ・・・・・カセット固定台、（イ）・
・・回動装置、２１ ・・支持具、ｎ・・・・・軸、
２３ａ、Ｚ３ｂ ・・タイマ歯車、屑・・・・・シリ
ンダ、２５．３６・・・・駆動モータ、２６ａ、２６ｂ
、３７・・・・・突起物、３０ ・・・カセット昇降
装置、３１・・・・・台形ネジ、３２・・・・ガイド棒
、３３・・・・・支持台、３５ａ、３５ｂ・・・・・歯
車、４０・・・−・搬送ヘルド、５０ ａ 、 ５０
ｂ、 ５１ ａ、 ５１ ｂ−凹代理人 弁理士 高
橋 明 夫
＼Figure 1 is a front view of a conventional wafer supply device, and Figure 2 is a
1 is a front view showing an embodiment of a wafer supply device according to the present invention. 16o, 16d...Cassette fixing stand, (a)
... Rotating device, 21 ... Supporting device, n ... Axis,
23a, Z3b...Timer gear, scrap...Cylinder, 25.36...Drive motor, 26a, 26b
, 37... Protrusion, 30... Cassette lifting device, 31... Trapezoidal screw, 32... Guide rod, 33... Support stand, 35a, 35b... ...Gear, 40...--Transportation heald, 50 a, 50
b, 51 a, 51 b-Concave agent Patent attorney Akio Takahashi\
Claims (1)
に、配設された前記カセット固定台を同一軸心で回動さ
せる回動装置と、該回動装置との間で前記カセット固定
台を１台毎授受可能に設けられたカセット昇降装置と、
該昇降装置で昇降する前記カセット固定台ｔこ載置、固
定されたカセットとの間でウェハを授受可能に設けられ
たウェハ搬送手段とで構成したことを特徴とするウェハ
供給装置。1. A plurality of cassette fixing bases are removably disposed, and a rotating device that rotates the disposed cassette fixing bases about the same axis, and a rotating device that rotates the cassette fixing base between the rotating device and the rotating device. A cassette elevating device that can be delivered and received one by one,
A wafer supply device comprising: the cassette fixing table which is raised and lowered by the lifting device; and a wafer transport means provided to be able to transfer wafers between the cassette fixing table and the fixed cassette.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5924783A JPS59186336A (en) | 1983-04-06 | 1983-04-06 | Wafer supply apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5924783A JPS59186336A (en) | 1983-04-06 | 1983-04-06 | Wafer supply apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59186336A true JPS59186336A (en) | 1984-10-23 |
Family
ID=13107858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5924783A Pending JPS59186336A (en) | 1983-04-06 | 1983-04-06 | Wafer supply apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59186336A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9611656B2 (en) | 2000-03-31 | 2017-04-04 | Pergo (Europe) Ab | Building panels |
| US9623433B2 (en) | 2004-10-05 | 2017-04-18 | Valinge Innovation Ab | Appliance and method for surface treatment of a board shaped material and floorboard |
| US9816278B2 (en) | 2005-12-29 | 2017-11-14 | Flooring Technologies Ltd. | Panel and method of manufacture |
-
1983
- 1983-04-06 JP JP5924783A patent/JPS59186336A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9611656B2 (en) | 2000-03-31 | 2017-04-04 | Pergo (Europe) Ab | Building panels |
| US9677285B2 (en) | 2000-03-31 | 2017-06-13 | Pergo (Europe) Ab | Building panels |
| US9623433B2 (en) | 2004-10-05 | 2017-04-18 | Valinge Innovation Ab | Appliance and method for surface treatment of a board shaped material and floorboard |
| US9816278B2 (en) | 2005-12-29 | 2017-11-14 | Flooring Technologies Ltd. | Panel and method of manufacture |
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