JPS59186336A - Wafer supply apparatus - Google Patents

Wafer supply apparatus

Info

Publication number
JPS59186336A
JPS59186336A JP5924783A JP5924783A JPS59186336A JP S59186336 A JPS59186336 A JP S59186336A JP 5924783 A JP5924783 A JP 5924783A JP 5924783 A JP5924783 A JP 5924783A JP S59186336 A JPS59186336 A JP S59186336A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
device
cassette
fixing
fixing board
rotating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5924783A
Inventor
Takahiro Fujisawa
Sakae Kono
Minoru Soraoka
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of waers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

PURPOSE:To use only a single unit of lifting device and lower the cost by respectively providing concaved portion at the lower end of a plurality of cassette fixing boards, engaging a protrusion of the cassette fixing support provided to a rotating device which rotates about the same axis with such concaved part, breaking engagement by moving downward the rotating device when the fixing board is located on the transfer belt of lifting device through the rotation of the rotating device and by transferring the fixing board on the belt. CONSTITUTION:The concaved parts 50a, 50b are respectively provided to the lower surface of a plurality of cassette fixing boards 10a, 10b and these parts are engaged with the protrusions 26a, 26b of the cassette fixing support 21 provided to the rotating device 20 which rotates in the same axis and freely goes upward and downward. Next, a cassette lifting device 30 having the transfer belt 40 at the upper surface is disposed under the cassette fixing board to be transferred, the rotating device 20 is rotated and when any fixing board is located on the device 30, the device 20 is moved downward, breaking engagement with the fixing board. Thereby, the fixing board is transferred on the device 20 and it is then transferred by the belt 40.
JP5924783A 1983-04-06 1983-04-06 Wafer supply apparatus Pending JPS59186336A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5924783A JPS59186336A (en) 1983-04-06 1983-04-06 Wafer supply apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5924783A JPS59186336A (en) 1983-04-06 1983-04-06 Wafer supply apparatus

Publications (1)

Publication Number Publication Date
JPS59186336A true true JPS59186336A (en) 1984-10-23

Family

ID=13107858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5924783A Pending JPS59186336A (en) 1983-04-06 1983-04-06 Wafer supply apparatus

Country Status (1)

Country Link
JP (1) JPS59186336A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9611656B2 (en) 2000-03-31 2017-04-04 Pergo (Europe) Ab Building panels
US9623433B2 (en) 2004-10-05 2017-04-18 Valinge Innovation Ab Appliance and method for surface treatment of a board shaped material and floorboard
US9816278B2 (en) 2005-12-29 2017-11-14 Flooring Technologies Ltd. Panel and method of manufacture

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9611656B2 (en) 2000-03-31 2017-04-04 Pergo (Europe) Ab Building panels
US9677285B2 (en) 2000-03-31 2017-06-13 Pergo (Europe) Ab Building panels
US9623433B2 (en) 2004-10-05 2017-04-18 Valinge Innovation Ab Appliance and method for surface treatment of a board shaped material and floorboard
US9816278B2 (en) 2005-12-29 2017-11-14 Flooring Technologies Ltd. Panel and method of manufacture

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