JPS59181687A - Integrated circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Prior Art and Problems] The present invention relates to an integrated circuit board with good heat conduction and excellent heat dissipation. Conventionally, integrated circuit boards have been made of ceramics whose main component is alumina, glass, metal plates fully coated with an insulating film, or enameled iron plates.For example, an alumina substrate with silver
Print palladium-based glaze paste and heat at 700℃~
A circuit conductor is formed by firing at 900°C, a ruthenium oxide paste is printed and fired to form a resistor, and then chip capacitors, semiconductor IC chips, transistor chips, etc. are die-bonded to form an integrated circuit. There is. Then, a lead frame is attached to this board (molded with ΩJ resin, or sealed in a resin case to make it into an electronic component, which is a conventional and common method).

By the way, these hybrid integrated circuits are often used in micro-power circuits that do not generate heat, but recently they have been used in high-power circuits such as audio power ICs, switching regulators, motor drivers, etc. However, since these circuits consume power of several watts to several tens of watts, it is necessary to consider heat dissipation. Alumina substrates are known as insulators with good thermal conductivity, and can dissipate heat generated by micro-power circuits, but cannot adequately handle the heat generated by high-power circuits as described above. .

Therefore, the metal plate (aluminum, iron) is placed on the integrated circuit board.
It has been proposed to use a material provided with a Jljf coating, or an enameled steel plate.

[Object of the Invention] As mentioned above, metal plates have been used for some time in integrated circuit boards for high power circuits, but when metal plates are used, it is necessary to ensure complete insulation. If the insulation coating is made thicker to achieve perfect insulation, the heat dissipation effect will decrease, and if it is made thinner, pinholes will occur. An object of the present invention is to provide an integrated circuit board made of a metal plate with perfect insulation and excellent heat dissipation.

[Inquiry into Breaking] The present invention forms an insulating film by coating the surface of a metal plate with an insulating tube *A containing metal powder made of flat particles dispersed on the organic insulating side (15). This is an integrated circuit board for high power circuit elements, which is characterized by:

Iron, aluminum, soot, nickel, etc. can be used as the metal powder, but aluminum is preferred from the viewpoint of cost. It is preferable that the metal powder is a flat particle, and when mixed with an organic insulating resin, the organic insulating resin io
50 to 400 parts by volume of metal powder is sometimes effective.

Below 50 parts by volume, heat transfer '6. The ratio is low, and the number of layers due to particle orientation decreases, resulting in a decrease in withstand voltage.

Further, if the amount is 400 parts by volume or more, the coach ink properties during coating are poor, the coating film is not leveled, and the thickness is uneven.

This material consisting of metal powder and a certain insulation material is coated onto a metal plate using a roll coater. By coating with a roll coater, the flat metal particles are oriented horizontally, forming a layered film and preventing pinholes from forming. After applying this adhesive to a metal plate, heating is required to solidify it. By this heating, the metal powder reacts with oxygen in the air and water generated in the wood to form an insulating oxide film on the surface. 〃・Integrated circuit boards made of metal plates with perfect insulation and excellent heat dissipation are available.

[Example ■] An aluminum plate with a thickness of 2 mm was used as the metal plate, aluminum flat particles that passed through a sieve were used as the metal powder, and phenol-modified xylene resin was used as the organic insulating resin. Adopting each, 50 parts of Zu Mashi Aluminum Oyoko was mixed with 100 parts of 1 fat,
Butyl cellosolve as an Ib agent was mixed uniformly with a knife to prepare an insulating paint having a viscosity of 501 J voids. Coat this insulating cylinder P)'c with a full-minimum board Nibber roll coater) to a thickness of 2Uμmvc, heat the insulator at 180℃ for 50 minutes, completely cure the resin, and insulate it.
A film was formed. 1.6 x 3.2 on top of this insulating film
A chip resistor of mm was fixed with silver paint, voltage was applied to set O and SW to I, and temperature jW was added and the temperature was 325°C. FC, the aluminum plate and the silver paint are completely resistant to 1 company pressure.
(I determined it to be 3850 V.

Met.

[Real Example II] Same method as Example ■, pattern J goods 10
In actual experiments, an insulating paint containing 4 DD volume parts of aluminum particles per 0 volume parts showed that the upper temperature range was 220 DEG C. and the film pressure resistance was 760 V.

[Comparative example] The same chip resistor as in Example ■ was painted silver on a paper fail information board. ! 'l set the temperature to 41
゛] The temperature was determined to be 176"C, and smoke was being emitted from the electrode plate.

[Effect of heat generation] As shown in the above example, the board of this invention has excellent heat dissipation properties, and even if it is used with circuit elements that generate high heat of 300℃ or more, the dielectric strength voltage will decrease. It has the effect of achieving the above-mentioned purpose of "germination" as a substrate for an integrated circuit forming a high-strength circuit.

Representative Patent Attorney Masaaki Shiba

Claims (3)

[Claims] (1) Integrated circuit board for flat grain power circuit elements on the surface of a metal plate and organic insulating resin (2) The integrated circuit board according to claim (1), wherein the metal powder is flat particles of aluminum. (3) The integrated circuit according to claim (1), wherein the metal powder and the organic insulating resin are mixed in such a manner that the amount of the metal powder is 50 to 40 parts by volume per 100 parts by volume of the organic insulating resin. substrate