JPS59174628A - Production of laminated plate - Google Patents

Production of laminated plate

Info

Publication number
JPS59174628A
JPS59174628A JP4854783A JP4854783A JPS59174628A JP S59174628 A JPS59174628 A JP S59174628A JP 4854783 A JP4854783 A JP 4854783A JP 4854783 A JP4854783 A JP 4854783A JP S59174628 A JPS59174628 A JP S59174628A
Authority
JP
Japan
Prior art keywords
resin
phenolic resin
water
laminate
impregnated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4854783A
Other languages
Japanese (ja)
Other versions
JPH0126373B2 (en
Inventor
Shigeru Ito
繁 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP4854783A priority Critical patent/JPS59174628A/en
Publication of JPS59174628A publication Critical patent/JPS59174628A/en
Publication of JPH0126373B2 publication Critical patent/JPH0126373B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Organic Insulating Materials (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:The base is, before being impregnated with a thermosetting resin, pretreated with a mixture of a water-soluble phenolic resin and a novolak type phenolic resin to give laminated plates with high dimensional stability, heat resistance and good punching properties. CONSTITUTION:At first, the base such as kraft paper is pretreated with a mixture of (A) a water-soluble phenolic resin and (B) a novolak type phenolic resin, preferably the content of component B is 20-60wt%, then impregnated with (C) a thermosetting resin, preferably modified with a drying oil. The products are dried and the resultant prepregs are laminated to give the objective plates. The resin B is preferably obtained by allowing formaldehyde to react with phenol so that the molar ratio is 0.1-0.4.

Description

【発明の詳細な説明】 本発明は、寸法安定性、耐熱性に優れ且つ打抜き加工性
、耐水特性、電気特性に優れた積層板の製造法に関する
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a laminate having excellent dimensional stability and heat resistance, as well as excellent punching workability, water resistance properties, and electrical properties.

近年、電子機器工業の発展に伴い回路基板の高密度化の
要求と共に実装システムの著しい進歩により、使用され
る積層板にも寸法安定性、打抜き加工性(層間密着性)
の優れたものが要求されている。
In recent years, with the development of the electronic equipment industry, there has been a demand for higher density circuit boards, and significant advances in mounting systems have led to improvements in the dimensional stability and punching workability (interlayer adhesion) of the laminates used.
Excellent products are required.

従来、積層板に用いられるフェノール樹脂は、一般に1
核体のメチロールフェノール類を主体とするレゾール型
樹脂である。このレゾール型樹脂は、基材への含浸性が
優れている長所はあるが、硬化過程での脱水縮合反応に
よる縮合水や未反応物などの揮発分の発生が多いため、
得られる積層板は加熱や吸湿により収縮、膨張が大きく
寸法安定性に不満足である。
Conventionally, the phenolic resin used for laminates is generally 1
It is a resol type resin whose core is methylolphenol. Although this resol type resin has the advantage of being excellent in impregnating the base material, it generates a lot of volatile matter such as condensed water and unreacted substances due to dehydration condensation reaction during the curing process.
The resulting laminate exhibits large shrinkage and expansion due to heating and moisture absorption, and its dimensional stability is unsatisfactory.

一方、ノボラック型フェノール樹脂は、前記レゾール型
フェノール樹脂に比べ寸法安定性が優れていることが知
られているか、ノボラック型フェノール樹脂は基材への
含浸性が悪(積層板としたときの基材層間密着が悪(電
気特性、耐水特性等に問題があった。
On the other hand, novolak-type phenolic resins are known to have superior dimensional stability compared to the resol-type phenolic resins, and novolak-type phenolic resins have poor impregnation properties into base materials (when used as a laminate, they have poor dimensional stability). Poor adhesion between material layers (problems with electrical properties, water resistance, etc.).

迷 本発明は上ぢのような従来の欠点を除去し、寸法安定性
等の良好な積層板を提供することを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned conventional drawbacks and provide a laminate with good dimensional stability.

上記目的を達成するために本発明は、水溶性フェノール
樹脂でIii+処理した基材に熱硬化性樹脂を含浸乾燥
して得たプリプレグを積層成形する積層板の製造におい
て、前記水溶性フェノール樹脂にノボラック型フェノー
ル樹脂を混合したものを用いることを特徴とする。
In order to achieve the above object, the present invention provides a method for manufacturing a laminate in which a prepreg obtained by impregnating and drying a thermosetting resin on a base material treated with Iiii+ with a water-soluble phenol resin is applied to the water-soluble phenol resin. It is characterized by using a mixture of novolac type phenolic resin.

本発明に用いるノボラック型フェノール樹脂は、フェノ
ール、クレゾール、キシレノール、ブチルフェノール、
ノニルフェノール等のフェノール類とホルムアルデヒド
、パラホルムアルデヒド等のホルムアルデヒド類とを後
者に対して前者を過剰に用いて酸性触媒下で反応させた
ものである。ホルムアルデヒド順/フェノール類のモル
比はO1〜04が好ましい。0.1未満ではノボラック
型フェノール樹脂の長所がでなくなり、0.4を越える
と樹脂分子量が大きくなり含浸性を損なう。また、本発
明に用いる水溶性フェノール樹脂は、フェノール、クレ
ゾール、キシレノール、ブチルフェノール、ノニルフェ
ノール等のフェノール類とホルムアルデヒド、パラホル
ムアルデヒド等のホルムアルデヒド類とを前者、に対し
て後者を過剰に用いて塩基性触媒下で反応させた低分子
量のものである。水溶性フェノール樹脂に混合するノボ
ラック型フェノール樹脂の比率は20〜60重量%が適
当である。ノボラック型フェノール樹脂の混合量が多過
ぎると基材への含浸性を損なう。また、少な過ぎると寸
法安定性の効果がな(なる。
The novolac type phenolic resin used in the present invention includes phenol, cresol, xylenol, butylphenol,
It is a reaction between phenols such as nonylphenol and formaldehydes such as formaldehyde and paraformaldehyde using an excess of the former relative to the latter under an acidic catalyst. The molar ratio of formaldehyde/phenols is preferably O1 to O4. If it is less than 0.1, the advantages of the novolac type phenol resin will not be exhibited, and if it exceeds 0.4, the resin molecular weight will increase and impregnating properties will be impaired. In addition, the water-soluble phenolic resin used in the present invention is prepared by combining phenols such as phenol, cresol, xylenol, butylphenol, and nonylphenol with formaldehydes such as formaldehyde and paraformaldehyde, and using an excess of the latter with respect to the former to form a basic catalyst. This is the low molecular weight product that was reacted below. The appropriate proportion of the novolac type phenol resin mixed with the water-soluble phenol resin is 20 to 60% by weight. If the amount of novolac type phenol resin mixed is too large, the impregnating property to the base material will be impaired. Also, if it is too small, the dimensional stability will not be effective.

上記混合樹脂を予めコツトンリンター紙、クラフト紙等
の基材に含浸させ、予備乾燥した後。
After pre-impregnating a base material such as cotton linter paper or kraft paper with the above mixed resin and pre-drying it.

熱硬化性樹脂を含浸乾燥してプリプレグを得る。A prepreg is obtained by impregnating and drying a thermosetting resin.

本発明1と用いる前記熱硬化性樹脂は特に限定するもの
ではないが、積層板の打抜き加工性を向上させるために
乾性油等で変性したものが好ましい。
The thermosetting resin used in the present invention 1 is not particularly limited, but it is preferably modified with drying oil or the like in order to improve the punching workability of the laminate.

上記プリプレグを所要枚数重ね合わせ、必要に応じてさ
らに片面または両面に金属箔を重ねて加熱、加圧して積
層板あるいは金属箔張積層板を得る。
A required number of the above prepregs are stacked, and if necessary, metal foil is further stacked on one or both sides, and heated and pressed to obtain a laminate or a metal foil-clad laminate.

次に本発明の詳細な説明する。Next, the present invention will be explained in detail.

実施例 フェノール500fと8596パラホルムアルデヒド3
8gをパラトルエンスルホン酸0、3 Fの存在下で8
0〜85℃に加熱し4時間反応させた後、トリエンとメ
タノール(1:l)混合溶剤で希釈して樹脂分5096
のノボラック型フェノール樹脂を得た。このワニスをA
ワニスとする。
Example phenol 500f and 8596 paraformaldehyde 3
8g of paratoluenesulfonic acid in the presence of 0.3F
After heating to 0 to 85°C and reacting for 4 hours, diluted with a mixed solvent of triene and methanol (1:l) to reduce the resin content to 5096.
A novolak type phenolic resin was obtained. This varnish is A
Use varnish.

ノニルフェノール110fと3796ホルマリン301
.85%パラホルムアルデヒド40fをトリメチルアミ
ン30fの存在下で80〜85℃に加熱し1時間反応さ
せた後更にフェノール330f、8596パラホルムア
ルデヒド230Fを添加し80〜85℃で3時間反応さ
せた後メタノールで希釈して樹脂分50%の水溶性フェ
ノール樹脂、を得た。このワニスをBワニスとする。
Nonylphenol 110f and 3796 formalin 301
.. 85% paraformaldehyde 40f was heated to 80-85°C in the presence of trimethylamine 30f and reacted for 1 hour, then phenol 330f and 8596 paraformaldehyde 230F were added and reacted at 80-85°C for 3 hours, then diluted with methanol. A water-soluble phenol resin having a resin content of 50% was obtained. This varnish will be referred to as B varnish.

合成りレゾール(m−クレゾール6596、p−クレゾ
ール35%)’1509と桐油750fとをパラトルエ
ンスルホン酸0.9fの存在下で80〜85℃に加熱し
3時間反応させた。
Synthetic resol (m-cresol 6596, p-cresol 35%) '1509 and 750f of tung oil were heated to 80-85°C in the presence of 0.9f of para-toluenesulfonic acid and reacted for 3 hours.

次いで2596アンモニア水24F、85%ノ寸ラホル
ムアルデヒド300g及びメタノール100Fを加え8
0〜85℃で4時間反応させた。次に、減圧上濃縮した
後トルジエンとメタノール(1:1)混合溶剤で希釈し
て衝脂分50%の桐油変性フェノール樹脂を得た。
Next, add 24F of 2596 ammonia water, 300g of 85% formaldehyde and 100F of methanol.
It was made to react at 0-85 degreeC for 4 hours. Next, the mixture was concentrated under reduced pressure and diluted with a mixed solvent of toludiene and methanol (1:1) to obtain a tung oil-modified phenol resin with a fat content of 50%.

このワニスをCワニスとする。This varnish will be referred to as C varnish.

上記Aワニス・とBワニスを重量でA:B=4:6の比
率で混合し、これを025關厚さのクラフト紙に樹脂含
量が2096になるよう含浸させ、予備乾燥した後Cワ
ニスを含浸させ乾燥して樹脂金[15296のプリプレ
グを得た。このプリプレグ8枚とその片側に35ミクロ
ン厚さの接着剤付き銅箔を重ねて温度160℃、圧力1
00 Kp /+mにて60分間加熱加圧して厚さ1.
6韮の銅張積層板を得た。
The above A varnish and B varnish were mixed in a ratio of A:B = 4:6 by weight, and this was impregnated into kraft paper with a thickness of 0.25 mm to a resin content of 2096. After pre-drying, varnish C was mixed. A prepreg of resin gold [15296] was obtained by impregnation and drying. Eight sheets of this prepreg were layered with a 35 micron thick adhesive-coated copper foil on one side at a temperature of 160°C and a pressure of 1.
Heat and press at 00 Kp/+m for 60 minutes to a thickness of 1.
A copper-clad laminate of 6 layers was obtained.

その性能を第1表に示す。Its performance is shown in Table 1.

比較例1 Bワニスを0.25 闘厚さのクラフト紙化樹脂含量か
20%になるよう含浸させ、予備乾燥した後Cワニスを
含浸させ乾燥して樹脂金Ω52%のプリプレグを得た。
Comparative Example 1 A kraft paper with a thickness of 0.25 mm was impregnated with varnish B to a resin content of 20%, and after preliminary drying, varnish C was impregnated and dried to obtain a prepreg with a resin gold Ω of 52%.

このプリプレグを使用して実施例と同様の条件にて銅張
積層板を得た。
Using this prepreg, a copper-clad laminate was obtained under the same conditions as in the example.

その性能を第1表に示す。Its performance is shown in Table 1.

比較例2 Cワニスを025朋厚さのクラフト紙に含浸乾燥して樹
脂付着分52%のプリプレグを得た。このプリプレグを
使用して実施例と同様の条件にて銅張積層板を得た。そ
の性能を第1表に示す。
Comparative Example 2 A prepreg with a resin adhesion content of 52% was obtained by impregnating 025 mm thick kraft paper with C varnish and drying it. Using this prepreg, a copper-clad laminate was obtained under the same conditions as in the example. Its performance is shown in Table 1.

第     1     表 上述のように本発明は、ノボラック型フェノール樹脂を
混合した水溶性フェノール樹脂で基材を前処理し次いで
熱硬化性樹脂を含浸乾燥したプリプレグを積層成形する
ので、層間密着性良好で、電気特性、耐水特性および寸
法安定性の優れた積層板が得られる点その工業的価値は
極めて大なるものである。
Table 1 As mentioned above, in the present invention, the base material is pretreated with a water-soluble phenolic resin mixed with a novolac type phenolic resin, and then the prepreg which is impregnated with a thermosetting resin and dried is laminated and molded, so that good interlayer adhesion is achieved. The industrial value of this method is extremely great because a laminate with excellent electrical properties, water resistance properties, and dimensional stability can be obtained.

Claims (1)

【特許請求の範囲】 1 水溶性フェノール樹脂で前処理した基材に熱硬化性
樹脂を含浸乾燥して得たプリプレグを積層成形する積層
板の製造において、前記水溶性フェノール樹脂にノボラ
ック型フェノール樹脂を混合することを特徴とする積層
板の製造法。 2 ノボラック型フェノール樹脂の混合比が20〜60
重量%である特許請求の範囲第1項記載の積層板の製造
法。
[Scope of Claims] 1. In the production of a laminate in which prepregs obtained by impregnating and drying a thermosetting resin on a base material pretreated with a water-soluble phenolic resin are laminated and molded, a novolak-type phenolic resin is added to the water-soluble phenolic resin. A method for manufacturing a laminate, characterized by mixing. 2 Mixing ratio of novolac type phenolic resin is 20 to 60
% by weight. A method for producing a laminate according to claim 1.
JP4854783A 1983-03-23 1983-03-23 Production of laminated plate Granted JPS59174628A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4854783A JPS59174628A (en) 1983-03-23 1983-03-23 Production of laminated plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4854783A JPS59174628A (en) 1983-03-23 1983-03-23 Production of laminated plate

Publications (2)

Publication Number Publication Date
JPS59174628A true JPS59174628A (en) 1984-10-03
JPH0126373B2 JPH0126373B2 (en) 1989-05-23

Family

ID=12806391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4854783A Granted JPS59174628A (en) 1983-03-23 1983-03-23 Production of laminated plate

Country Status (1)

Country Link
JP (1) JPS59174628A (en)

Also Published As

Publication number Publication date
JPH0126373B2 (en) 1989-05-23

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