JPS5845234A - Manufacture of epoxy resin laminated board - Google Patents

Manufacture of epoxy resin laminated board

Info

Publication number
JPS5845234A
JPS5845234A JP14224581A JP14224581A JPS5845234A JP S5845234 A JPS5845234 A JP S5845234A JP 14224581 A JP14224581 A JP 14224581A JP 14224581 A JP14224581 A JP 14224581A JP S5845234 A JPS5845234 A JP S5845234A
Authority
JP
Japan
Prior art keywords
resin
impregnated
prepreg
epoxy resin
melamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14224581A
Other languages
Japanese (ja)
Other versions
JPS6365091B2 (en
Inventor
Takashi Kishi
岸 高志
Kazuo Okubo
和夫 大久保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP14224581A priority Critical patent/JPS5845234A/en
Publication of JPS5845234A publication Critical patent/JPS5845234A/en
Publication of JPS6365091B2 publication Critical patent/JPS6365091B2/ja
Granted legal-status Critical Current

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  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To obtain the titled laminated board having excellent flame retardance and processability, by preliminarily impregnating a melamine-modified phenolic resin, etc. into a substrate, impregnating the substrate with epoxy resin and drying the impregnate to obtain a prepreg, and laminating the prepreg sheets. CONSTITUTION:A substrate (e.g. linter paper) is preliminarily impregnated with a melamine-modified or guanamine-modified phenolic resin (obtained by reacting a mixture of melamine, etc. and a phenolic compound with formaldehyde in the presence of an alkaline catalyst), and dried to obtain a preliminarily impregnated substrate containing 5-30(wt)% resin. An epoxy resin is impregnated into the substrate and dried to abtain a prepreg containing 29-75% resin as a whole. The objective laminated board can be manufactured by inserting a desired number of the prepreg sheets between a pair of pressure-equalizing plates, and hot-pressing with a hydraulic press with hot plate, etc. at about 100-200 deg.C and 30-150kg/cm<2> pressure. USE:Raw material of electrical parts, structural material, material for mechanical parts, etc.

Description

【発明の詳細な説明】 本発明は、特に耐燃性及び加工性に優れたエポキシ樹脂
積層板の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention particularly relates to a method for manufacturing an epoxy resin laminate having excellent flame resistance and processability.

近年各種工業の発展に伴ない、電気部品材料、構造材料
、機械部品材料として優れた性能が要求され、なかでも
電気電子機器に用いる合成樹脂積層板には、極めて優れ
た性能がしかも多様な性能項目について要求されるよう
になった。すなわち、電気絶縁性、高周波特性がよく、
耐湿性、耐水性に富み、5機械的性能、耐熱性も良好、
さらに耐燃性、加工性に優れて、商品としての価値が高
いものであり、しかも価格が低摩であるものが望まれて
いる。そのような合成樹脂積層板の一つとして、紙、ガ
ラス等の基材にエポキシ樹脂を含浸成形したエポキシ樹
脂積層板があるが、ある種の基材の場合にはエポキシ樹
脂をそのまま含浸しても予想される高性能のものが得ら
れないことがある。従来、この対策として予め基材をフ
ェノール樹脂、メラミン樹脂、アミノ樹脂又はフェノー
ル樹脂−ゴムで予備含浸乾燥処理することが提案されて
いる。
In recent years, with the development of various industries, excellent performance has been required for electrical component materials, structural materials, and mechanical component materials.In particular, synthetic resin laminates used in electrical and electronic equipment have extremely excellent performance and a wide range of performance characteristics. Items are now required. In other words, it has good electrical insulation and high frequency characteristics.
Excellent moisture resistance and water resistance, good mechanical performance, and heat resistance.
Furthermore, it is desired to have excellent flame resistance and processability, high value as a product, and low cost. One such synthetic resin laminate is an epoxy resin laminate in which a base material such as paper or glass is impregnated with epoxy resin. However, the expected high performance may not be obtained. Conventionally, as a countermeasure against this problem, it has been proposed to pre-impregnate and dry the base material with a phenol resin, melamine resin, amino resin or phenol resin-rubber.

今まで知られているこれらの樹脂による予備処理方法で
は、予備処理をしない場合に比べて、電気絶縁性、吸水
率等において格段の向上がみられるが、耐燃性及び加工
性においては未だ十分とは云えず、用途にかなりの制約
を受けているのが現状である。
With the pretreatment methods using these resins that have been known so far, significant improvements in electrical insulation, water absorption, etc. can be seen compared to cases without pretreatment, but flame resistance and processability are still insufficient. However, the current situation is that there are considerable restrictions on its use.

本発明は、耐燃性及び加工性が他の性能とともに良好な
エポキシ樹脂積層板の提供を目的とする。
The present invention aims to provide an epoxy resin laminate that has good flame resistance and processability as well as other properties.

本発明者らはこの問題につき種々研究の結果、メラミン
又は/及びグアナミン類とフェノール類との混合物にホ
ルムアルデヒドを反応させた生成物(以下メラミン変性
又はグアナミン変性フェノール樹脂という)で、予め基
材を処理することにより、電気絶縁性、高周波特性、耐
熱性、吸水率等の一般特性に優れ、かつ耐燃性、加工性
の極めて良好なエポキシ樹脂積層板を得ることに成功し
た。
As a result of various studies on this problem, the present inventors have found that a base material is pre-prepared with a product obtained by reacting formaldehyde with melamine or/and a mixture of guanamines and phenols (hereinafter referred to as melamine-modified or guanamine-modified phenolic resin). Through this treatment, we succeeded in obtaining an epoxy resin laminate that has excellent general properties such as electrical insulation, high frequency properties, heat resistance, and water absorption, as well as extremely good flame resistance and workability.

即ち、本発明の製造方法は、基材をメラミン変性又はグ
アナミン変性フェノール樹脂で予備含浸乾燥して樹脂分
5〜30重量−を含む予備含浸基材となし、上記予備含
浸基材をエポキシ樹脂で含浸乾燥して合計樹脂分29〜
75重量%を含むプリプレグとなし、得られたプリプレ
グを積層成形することを特徴とするエポキシ樹脂積層板
の製造方法である。
That is, in the manufacturing method of the present invention, a base material is pre-impregnated with a melamine-modified or guanamine-modified phenol resin and dried to obtain a pre-impregnated base material containing a resin content of 5 to 30% by weight, and the pre-impregnated base material is pre-impregnated with an epoxy resin. After impregnating and drying, the total resin content is 29 ~
This is a method for producing an epoxy resin laminate, which is characterized by forming a prepreg containing 75% by weight, and laminating and molding the obtained prepreg.

本発明の製造方法に使用する基材は、リンター紙、クラ
フト紙、綿布、合成繊維布若しくはその不織布、ガラス
不織布、石綿紙、リンターとガラスの混抄紙、リンター
と石綿の混抄紙等エポキシ樹脂との結合性が十分でない
基材であり、また酸化アンチモン抄込紙など副資材抄込
基材が含まれる。
The base materials used in the manufacturing method of the present invention include epoxy resin, such as linter paper, kraft paper, cotton cloth, synthetic fiber cloth or non-woven fabric thereof, glass non-woven fabric, asbestos paper, mixed paper of linter and glass, mixed paper of linter and asbestos, etc. It is a base material that does not have sufficient bonding properties, and also includes base materials made from auxiliary materials such as paper made from antimony oxide.

本発明に使用するメラミン変性又はグアナミン変性フェ
ノール樹脂は、メラミン又は/及びグアナミン類(アセ
トグアナミン、ベンゾグアナミン等)とフェノーノへク
レゾール、キシレノール、インプロピルフェノール、ビ
スフェノールA等のフェノール類との混合物を金属水酸
化物、アルキルアミン等のアルカリ性触媒下にホルムア
ルデヒドと反応させたものである。メラミン又はグアナ
ミンの変性量は制限されない。
The melamine-modified or guanamine-modified phenolic resin used in the present invention is prepared by adding a mixture of melamine or/and guanamines (acetoguanamine, benzoguanamine, etc.) and phenols such as phenonohecresol, xylenol, impropylphenol, bisphenol A, etc. to metallic water. It is reacted with formaldehyde under an alkaline catalyst such as an oxide or an alkylamine. The amount of denaturation of melamine or guanamine is not limited.

本発明に使用するエポキシ樹脂は、[F]多価フェノー
ル、多価の多核フェノール又は脂肪族多価アルコールを
エピハロヒドリン又ハシハロヒ)’ IJ 7と公知の
方法によりアルカリ触媒中で反応させて得られる化合物
、■ジエンを保有する脂環式化合物若しくは脂肪族化合
物を過酸酸化によりエポキシ化して得られる化合物、■
上記の及び■の化合物がハロゲン化された化合物等が挙
げられる。硬化剤は単独で又は硬化促進剤とともに使用
することができる。硬化剤としては、脂肪族若しくは芳
香族のポリアミン、酸無水物、ポリアミド、ジシアンジ
アミド、ベンジルジメチルアミン等が挙げられる。また
必要に応じて公知の難燃剤(例えばトリクレジルホスフ
ェート、ジブロモフェニルグリシジルエーテル)、その
他添加剤を混合することができる。
The epoxy resin used in the present invention is a compound obtained by reacting [F] polyhydric phenol, polyvalent polynuclear phenol, or aliphatic polyhydric alcohol with epihalohydrin or Hashihalohi)' IJ 7 in an alkaline catalyst by a known method. , ■ Compound obtained by epoxidizing an alicyclic compound or aliphatic compound containing a diene by peracid oxidation, ■
Examples include halogenated compounds of the above compounds and (2). Curing agents can be used alone or in conjunction with curing accelerators. Examples of the curing agent include aliphatic or aromatic polyamines, acid anhydrides, polyamides, dicyandiamide, benzyldimethylamine, and the like. Further, known flame retardants (for example, tricresyl phosphate, dibromophenyl glycidyl ether) and other additives may be mixed as necessary.

予備含浸処理において基材に含浸するメラミン変性又は
グアナミン変性フェノール樹脂の樹脂分は、含浸乾燥し
た予備ぎ浸基材に対し5〜30重量係の範囲とするのが
適している。そして次に、予備含浸基材に含浸するエポ
キシ樹脂の含浸量は、含浸乾燥したシリプレグに対しメ
ラミン変性又はグアナミン変性フェノール樹脂とエポキ
シ樹脂との合計樹脂分が29〜75重量%の範囲とする
のが適している。樹脂分は、一定面積の基材、予備含浸
乾燥及びプリプレグを150℃30分間空気乾燥器中に
放置した乾燥重量から算出される。そのときの乾燥減槍
を揮発分とする。
The resin content of the melamine-modified or guanamine-modified phenol resin to be impregnated into the base material in the pre-impregnation treatment is suitably in the range of 5 to 30% by weight based on the pre-impregnated and dried pre-impregnated base material. Next, the amount of epoxy resin impregnated into the pre-impregnated base material is such that the total resin content of melamine-modified or guanamine-modified phenol resin and epoxy resin is in the range of 29 to 75% by weight based on the impregnated and dried silipreg. is suitable. The resin content is calculated from the dry weight of a certain area of the substrate, pre-impregnated and dried and prepreg left in an air dryer at 150° C. for 30 minutes. The drying loss at that time is regarded as volatile matter.

このように、予備含浸するメラミン変性又はグアナミン
変性フェノール樹脂のメラミン又はグアナミン成分が耐
燃性の向上に寄与し、フェノール分が耐衝撃性ひいては
加工性を改善し、そしてリンター紙等の基材に予備含浸
をすることが電気絶縁性、高周波特性、耐熱性、吸水率
等の一般特性の優れたものとする。上記のメラミン変性
又はグアナミン変性フェノール樹脂及びエポキシ樹脂の
樹脂分範囲(は、この耐燃性、加工性及び−膜特性が保
持できる範囲である。
In this way, the melamine or guanamine component of the pre-impregnated melamine-modified or guanamine-modified phenolic resin contributes to improving flame resistance, and the phenol component improves impact resistance and processability. Impregnation provides excellent general properties such as electrical insulation, high frequency properties, heat resistance, and water absorption. The resin content range of the above-mentioned melamine-modified or guanamine-modified phenol resin and epoxy resin is the range in which flame resistance, processability, and film properties can be maintained.

予備含浸基材にエポキシ樹脂を含浸乾燥したプリプレグ
の積層成形は、通常2枚の当て板間に所定枚数のプリプ
レグをはさみ、熱板付油圧プレスなどを用い、100〜
200°Cの温度、30〜tso#、z繍の圧力で、加
熱加圧して一体化させる。本発明のプリプレグのみを用
うればエポキシ樹脂積層板かえられ、プリプレグの外側
少くともいずれか一方の面に銅箔を重ねて積層成形すれ
ば銅張エポキシ積層板かえられる。また積層板の形状の
ほか積層管、積層棒の形状のものもえられる。そしてま
た、本発明のプリプレグの一部に本発明以外の樹脂含浸
基材を併用することもできる。
Laminate molding of prepreg made by impregnating a pre-impregnated base material with epoxy resin and drying it is usually done by sandwiching a predetermined number of prepreg sheets between two patch plates, using a hydraulic press with a hot plate, etc.
They are heated and pressed at a temperature of 200°C, a pressure of 30~Tso#, and are integrated. An epoxy resin laminate can be replaced by using only the prepreg of the present invention, and a copper-clad epoxy laminate can be replaced by stacking and molding copper foil on at least one outside surface of the prepreg. In addition to the shape of a laminated plate, those in the shape of a laminated tube or a laminated rod are also available. Furthermore, a resin-impregnated base material other than the present invention can be used in combination with a part of the prepreg of the present invention.

本発明の製造方法によるエポキシ樹脂積層板は、予備含
浸樹脂として適正量のメラミン変性又はグアナミン変性
フェノール樹脂を用いたから、従来十分でなかった耐燃
性及び衝撃によるクラック性すなわち打抜き加工性や剪
断加工性を同時に改善することができた。そして電気絶
縁性、高周波特性、耐熱性、吸水率等の一般特性が平均
して良好で、耐燃性と加工性とともにバランスのとれた
性能を有している。殊にセルロース系、合成繊維系、石
綿系の基材を用いたエポキシ樹脂積層板において従来法
による積層板に対し性能の改良が顕著である。
Since the epoxy resin laminate produced by the manufacturing method of the present invention uses an appropriate amount of melamine-modified or guanamine-modified phenol resin as the pre-impregnated resin, it has flame resistance and impact cracking resistance, that is, punching workability and shearing workability, which were previously insufficient. could be improved at the same time. It has good general properties such as electrical insulation, high frequency properties, heat resistance, and water absorption on average, and has well-balanced performance in addition to flame resistance and workability. In particular, the performance of epoxy resin laminates using cellulose-based, synthetic fiber-based, or asbestos-based base materials is significantly improved compared to laminates made by conventional methods.

以下に本発明の詳細な説明する。以下部、係とあるのは
、夫々重量部、重量%を意味する。
The present invention will be explained in detail below. The terms "part" and "part" below refer to parts by weight and percent by weight, respectively.

実施例1 フェノール100部、メラミン1050部、37%ホル
マリン1200部、トリエチルアミン10部を混合し、
80℃で90分間反応させ、減圧脱水した後メタノール
を加えて、固形分50チの樹脂溶液(A)を得た。
Example 1 100 parts of phenol, 1050 parts of melamine, 1200 parts of 37% formalin, and 10 parts of triethylamine were mixed,
After reacting at 80° C. for 90 minutes and dehydrating under reduced pressure, methanol was added to obtain a resin solution (A) with a solid content of 50 cm.

エポキシm 脂(ビスフェノールA型エポキシ樹脂:エ
ポキシ当量500 ) 100部と、硬化剤としてヘッ
ト酸無水物35部とを、アセトンに溶解して固形分50
襲の樹脂溶液(B)を得た。この樹脂溶液(B)にジブ
ロモフェニルグリシジルエーテル7部及びトリクレジル
ホスフーエート4部を混合したものを樹脂溶液(C)と
する。
100 parts of epoxy m resin (bisphenol A type epoxy resin: epoxy equivalent: 500) and 35 parts of het acid anhydride as a hardening agent were dissolved in acetone to give a solid content of 50 parts.
A second resin solution (B) was obtained. This resin solution (B) is mixed with 7 parts of dibromophenyl glycidyl ether and 4 parts of tricresyl phosphate to form a resin solution (C).

坪量150.1//dのリンター紙に、樹脂溶液(A)
を予備含浸し、150°Cで乾燥して、Bステージの樹
脂分30チ、揮発分1.9%の予備含浸紙を得た。得ら
れた予備含浸紙に、樹脂溶液(C)を含浸し、150°
Cで乾燥して、Bステージの全樹脂分60%。
Resin solution (A) on linter paper with basis weight 150.1//d
was pre-impregnated and dried at 150°C to obtain a B-stage pre-impregnated paper with a resin content of 30% and a volatile content of 1.9%. The obtained pre-impregnated paper was impregnated with the resin solution (C) and heated at 150°
Dry at C, total resin content of B stage is 60%.

揮発分1.9チのプリプレグを得た。A prepreg with a volatile content of 1.9 was obtained.

このプリプレグを7枚重ね、その片面に厚さ35μの銅
箔を重ね合せ、170°C・70kg/caで70分間
加圧加熱して冷却し、厚さ1,6朋の銅張積層板を得た
Seven sheets of this prepreg were stacked, a copper foil with a thickness of 35 μm was placed on one side of the prepreg, and heated under pressure at 170°C and 70 kg/ca for 70 minutes, cooled, and a copper-clad laminate with a thickness of 1.6 μm was formed. Obtained.

その特性を試験した結果及び準拠試験法を第1表に示す
Table 1 shows the results of testing its properties and the applicable test methods.

実施例2 フェノール100部、メラミン11部、37%ホルマリ
ン280部、トリエチルアミン1部を混合し、8゜Cで
1,10分間反応させ、減圧脱水した後メタノールを加
えて、固形分50チの樹脂溶液(D)を得た。
Example 2 100 parts of phenol, 11 parts of melamine, 280 parts of 37% formalin, and 1 part of triethylamine were mixed and reacted at 8°C for 1.10 minutes. After dehydration under reduced pressure, methanol was added to prepare a resin with a solid content of 50 cm. A solution (D) was obtained.

エポキシ樹脂(ビスフェノールA型エポキシ樹脂:エポ
キン当量500.Br量18%) loo部とフタル酸
無水物(硬化剤)15部とを、アセトンに溶解して固形
分50%の樹脂溶液(E)を得た。
Epoxy resin (bisphenol A type epoxy resin: Epoquine equivalent: 500. Br amount: 18%) The loo part and 15 parts of phthalic anhydride (curing agent) are dissolved in acetone to make a resin solution (E) with a solid content of 50%. Obtained.

坪量1501//nfのリンター紙に、樹脂溶液(D)
を予備含浸し、150℃で乾燥して、Bステージの樹脂
分30%、揮発分19%の予備含浸紙を得た。得られた
予備含浸紙に樹脂溶液(E)を含浸し、150°Cで乾
燥して、Bステージの全樹脂分60%、揮発分19%の
プリプレグを得た。
Resin solution (D) on linter paper with basis weight 1501//nf
was pre-impregnated and dried at 150° C. to obtain a B-stage pre-impregnated paper with a resin content of 30% and a volatile content of 19%. The obtained pre-impregnated paper was impregnated with the resin solution (E) and dried at 150°C to obtain a B-stage prepreg with a total resin content of 60% and a volatile content of 19%.

このプリプレグを用い、実施例1と同様な方法により銅
張積層板を得、その試験結果を第1表に示す。
Using this prepreg, a copper-clad laminate was obtained in the same manner as in Example 1, and the test results are shown in Table 1.

実施例3 フェノール100部、ベンゾグアナミン1100部、3
7係ホルマリン850部を混合し、80°Cで4時間反
応させ、減圧脱水した後アセトンを加えて、固形分80
%の樹脂溶液(F)を得た。
Example 3 100 parts of phenol, 1100 parts of benzoguanamine, 3
7. 850 parts of formalin were mixed, reacted at 80°C for 4 hours, dehydrated under reduced pressure, and then acetone was added to reduce the solid content to 80.
% resin solution (F) was obtained.

樹脂溶液(F)及び樹脂溶液(E)(実施例20項参照
)を用い、実施例1と同様な方法により銅張積層板を得
、その試験結果を第1表に示す。
Copper-clad laminates were obtained in the same manner as in Example 1 using resin solution (F) and resin solution (E) (see Example 20), and the test results are shown in Table 1.

実施例4 フェノール100部、アセトグアナミン1050部、3
7%ホルマリン1160部、トリエチルアミン10部を
混合し、80°Cで3時間反応させ、減圧脱水した後ア
セトンを加えて、固形分50チの樹脂溶液(G)を得た
Example 4 100 parts of phenol, 1050 parts of acetoguanamine, 3
1160 parts of 7% formalin and 10 parts of triethylamine were mixed, reacted at 80°C for 3 hours, dehydrated under reduced pressure, and then acetone was added to obtain a resin solution (G) with a solid content of 50%.

エポキシ樹脂(ビスフェノールA型エポキシ樹脂:エポ
キシ当量500 ) 100部とヘット酸無水物(硬化
剤) 40部とを、アセトンに溶解して固形分50チの
樹脂溶液(H)を得た。この樹脂溶液(H)にテトラブ
ロモジフェニルエーテル8部を混合したものを樹脂溶液
(I)とする。
100 parts of an epoxy resin (bisphenol A type epoxy resin: epoxy equivalent: 500) and 40 parts of Het's acid anhydride (curing agent) were dissolved in acetone to obtain a resin solution (H) with a solid content of 50 cm. This resin solution (H) was mixed with 8 parts of tetrabromodiphenyl ether to form a resin solution (I).

樹脂溶液(H)及び樹脂溶液(I)を用い、実施例1と
同様な方法により銅張積層板を得、その試験結果を第1
表に示す。
A copper-clad laminate was obtained using the resin solution (H) and the resin solution (I) in the same manner as in Example 1, and the test results were
Shown in the table.

実施例5 坪量135 g/z7/のガラスクロスに、エボキン樹
脂の樹脂溶液(H)(実施例4の項参照)を含浸し、1
50°Cで乾燥して、樹脂分45%の接着用プリプレグ
を得た。
Example 5 A glass cloth with a basis weight of 135 g/z7/ was impregnated with a resin solution (H) of Evokin resin (see the section of Example 4), and
It was dried at 50°C to obtain an adhesive prepreg with a resin content of 45%.

実施例1で得られたプリプレグを6枚重ね、その上下に
接着用プリプレグを1枚ずつ重ね、さらにその片面に3
5μの銅箔を重ね合せ、実施例1と同様な方法で成形し
て銅張積層板を得、その試験結果を第1表に示す。
6 sheets of prepreg obtained in Example 1 are stacked, 1 sheet of adhesive prepreg is placed on top and bottom of the prepreg, and 3 sheets of prepreg are stacked on one side.
Copper foils having a thickness of 5μ were laminated and molded in the same manner as in Example 1 to obtain a copper-clad laminate, and the test results are shown in Table 1.

比較例1 フェノール100部、37q6ホルマリン110部、ト
リエチルアミン5部を混合し、80°Cで100分間反
応させ、減圧脱水した後アセトンを加えて、固形分50
%の樹脂溶液(J)を得た。
Comparative Example 1 100 parts of phenol, 110 parts of 37q6 formalin, and 5 parts of triethylamine were mixed, reacted at 80°C for 100 minutes, dehydrated under reduced pressure, and then acetone was added to reduce the solid content to 50.
% resin solution (J) was obtained.

樹脂溶液(J)及び樹脂溶液(C)(実施例1の項参照
)を用い、実施例1と同様な方法により銅張積層板を得
、その試験結果を第1表に示す。
Copper-clad laminates were obtained in the same manner as in Example 1 using resin solution (J) and resin solution (C) (see Example 1), and the test results are shown in Table 1.

比較例2 メラミン100部、37%ホルマリン100部を混合t
、、so°Cで3時間反応させ、減圧脱水した後メタノ
ールを加えて、固形分80%の樹脂溶液(K)を得た。
Comparative Example 2 Mixing 100 parts of melamine and 100 parts of 37% formalin
After reacting at .degree. C. for 3 hours and dehydrating under reduced pressure, methanol was added to obtain a resin solution (K) with a solid content of 80%.

樹脂溶液(K)及び樹脂溶液(E)(実施例2の項参照
)を用い、実施例1と同様な方法により銅張積層板を得
、その試験結果を第1表に示す。
Copper-clad laminates were obtained in the same manner as in Example 1 using resin solution (K) and resin solution (E) (see Example 2), and the test results are shown in Table 1.

Claims (1)

【特許請求の範囲】[Claims] 1 基材をメラミン変性又はグアナミン変性フェノール
樹脂で予備含浸乾燥して樹脂分5〜30重量%を含む予
備含浸基材となし、上記予備含浸乾燥をエポキシ樹脂で
含浸乾燥して合計樹脂分29〜75重量%を含むプリプ
レグとなし、得られたプリプレグを積層成形することを
特徴とするエポキシ樹脂積層板の製造方法。
1 A base material is pre-impregnated and dried with a melamine-modified or guanamine-modified phenol resin to obtain a pre-impregnated base material containing a resin content of 5 to 30% by weight, and the above pre-impregnated and dried is impregnated and dried with an epoxy resin to obtain a total resin content of 29 to 30% by weight. A method for producing an epoxy resin laminate, comprising preparing a prepreg containing 75% by weight, and laminating and molding the obtained prepreg.
JP14224581A 1981-09-11 1981-09-11 Manufacture of epoxy resin laminated board Granted JPS5845234A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14224581A JPS5845234A (en) 1981-09-11 1981-09-11 Manufacture of epoxy resin laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14224581A JPS5845234A (en) 1981-09-11 1981-09-11 Manufacture of epoxy resin laminated board

Publications (2)

Publication Number Publication Date
JPS5845234A true JPS5845234A (en) 1983-03-16
JPS6365091B2 JPS6365091B2 (en) 1988-12-14

Family

ID=15310813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14224581A Granted JPS5845234A (en) 1981-09-11 1981-09-11 Manufacture of epoxy resin laminated board

Country Status (1)

Country Link
JP (1) JPS5845234A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60119186U (en) * 1984-01-20 1985-08-12 三洋電機株式会社 composite speaker
US5955184A (en) * 1995-09-29 1999-09-21 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition as well as prepreg and laminate containing the same
DE112007003742T5 (en) 2007-12-21 2010-10-28 Kuma Engineering Co., Ltd., Hirakata Supply device for powder / granules

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4883170A (en) * 1972-02-12 1973-11-06
JPS4884163A (en) * 1972-02-12 1973-11-08
JPS5114967A (en) * 1974-07-27 1976-02-05 Sumitomo Bakelite Co
JPS51109966A (en) * 1975-03-25 1976-09-29 Sumitomo Bakelite Co DENKIZETSUENYOSE KISOBANNO SEIZOHO
JPS5212224A (en) * 1975-07-18 1977-01-29 Kanebo Ltd Apparatus for producing cement products highly reinforced with glass fibres

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4883170A (en) * 1972-02-12 1973-11-06
JPS4884163A (en) * 1972-02-12 1973-11-08
JPS5114967A (en) * 1974-07-27 1976-02-05 Sumitomo Bakelite Co
JPS51109966A (en) * 1975-03-25 1976-09-29 Sumitomo Bakelite Co DENKIZETSUENYOSE KISOBANNO SEIZOHO
JPS5212224A (en) * 1975-07-18 1977-01-29 Kanebo Ltd Apparatus for producing cement products highly reinforced with glass fibres

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60119186U (en) * 1984-01-20 1985-08-12 三洋電機株式会社 composite speaker
US5955184A (en) * 1995-09-29 1999-09-21 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition as well as prepreg and laminate containing the same
DE112007003742T5 (en) 2007-12-21 2010-10-28 Kuma Engineering Co., Ltd., Hirakata Supply device for powder / granules

Also Published As

Publication number Publication date
JPS6365091B2 (en) 1988-12-14

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