JPS59173343U - 半導体素子収納容器 - Google Patents

半導体素子収納容器

Info

Publication number
JPS59173343U
JPS59173343U JP1983067886U JP6788683U JPS59173343U JP S59173343 U JPS59173343 U JP S59173343U JP 1983067886 U JP1983067886 U JP 1983067886U JP 6788683 U JP6788683 U JP 6788683U JP S59173343 U JPS59173343 U JP S59173343U
Authority
JP
Japan
Prior art keywords
storage container
semiconductor element
element storage
cap
seal ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983067886U
Other languages
English (en)
Other versions
JPS6334276Y2 (ja
Inventor
安田　美子
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP1983067886U priority Critical patent/JPS59173343U/ja
Publication of JPS59173343U publication Critical patent/JPS59173343U/ja
Application granted granted Critical
Publication of JPS6334276Y2 publication Critical patent/JPS6334276Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａは従来の半導体素子収納容器の正面図、第１図
すは同素子のシーム溶接用キャップの正面断面図、第２
図は従来の半導体素子収納容器にキャップをシーム慴接
した様子を示す断面図、第３図はシールリングに突起部
を一体化させた構造をもら本発明の実施例の半導体素子
収納容器の斜視図、第４図は同容器にキャップを溶接し
た状態を示す断面図である。 ５・・・・・・シールリング、訃・・・・・キャップ位
置決め用突起部、９・・曲シールリングのインライン側
、１０・・・・・・シールリングのアウトライン側。

Claims (1)

    【実用新案登録請求の範囲】
  1. キャップを載置するシールリング部周縁に、キャップの
    位置決めを確実に行なうための突起部を設けたことを特
    徴とする半導体素子収納容器。
JP1983067886U 1983-05-06 1983-05-06 半導体素子収納容器 Granted JPS59173343U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983067886U JPS59173343U (ja) 1983-05-06 1983-05-06 半導体素子収納容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983067886U JPS59173343U (ja) 1983-05-06 1983-05-06 半導体素子収納容器

Publications (2)

Publication Number Publication Date
JPS59173343U true JPS59173343U (ja) 1984-11-19
JPS6334276Y2 JPS6334276Y2 (ja) 1988-09-12

Family

ID=30198070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983067886U Granted JPS59173343U (ja) 1983-05-06 1983-05-06 半導体素子収納容器

Country Status (1)

Country Link
JP (1) JPS59173343U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559450A (en) * 1978-07-05 1980-01-23 Nec Corp Container for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559450A (en) * 1978-07-05 1980-01-23 Nec Corp Container for semiconductor device

Also Published As

Publication number Publication date
JPS6334276Y2 (ja) 1988-09-12

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