JPS59171344U - Contact for flat IC package contact - Google Patents

Contact for flat IC package contact

Info

Publication number
JPS59171344U
JPS59171344U JP6453383U JP6453383U JPS59171344U JP S59171344 U JPS59171344 U JP S59171344U JP 6453383 U JP6453383 U JP 6453383U JP 6453383 U JP6453383 U JP 6453383U JP S59171344 U JPS59171344 U JP S59171344U
Authority
JP
Japan
Prior art keywords
contact
package
flat
horizontal
planting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6453383U
Other languages
Japanese (ja)
Other versions
JPH0220836Y2 (en
Inventor
則行 松岡
Original Assignee
山一電機工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山一電機工業株式会社 filed Critical 山一電機工業株式会社
Priority to JP6453383U priority Critical patent/JPS59171344U/en
Publication of JPS59171344U publication Critical patent/JPS59171344U/en
Application granted granted Critical
Publication of JPH0220836Y2 publication Critical patent/JPH0220836Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はリード突出タイプのフラット形ICパッケージ
を例示する斜視図、第2図はリードレスタイプのフラッ
ト形ICパッケージを例示する底面図、第3図は従来の
フラット形ICパッケージ用ソケット及びコンタクトを
略示するソケット断面図、第4図A図は本考案に係るフ
ラット形ICパッケージ用ソケットのコンタクトの実施
例を拡大示する斜視図、同B図は同側面図、第5図は第
4図のコンタクトを基本とする変形例を示すコンタクト
側面図、第6図は他の実施例を示すコンタ−クト斜視図
、第7図A図は第4図のコンタクトをソケット基盤へ植
付けたソケットを一部切欠して示す斜視図、同B図は同
ソケットを配線基盤に搭載した状態を略示する断面図、
第8図は第6図のコンタクトの圧入植込孔を略示するソ
ケット基盤一部側面図である。 1・・・フラット形ICパッケージ、5・・・フラット
形ICパッケージ接触用コンタクト、5a・・・フラッ
ト形ICパッケージとの接触に供される横U字形接片部
、5b・・・ソケット基盤への圧入植込みに供される植
付片部、5C・・・配線基盤等との接続に供される雄接
片部。
Fig. 1 is a perspective view illustrating a lead protruding type flat IC package, Fig. 2 is a bottom view illustrating a leadless type flat IC package, and Fig. 3 is a conventional socket and contact for a flat IC package. FIG. 4A is an enlarged perspective view showing an embodiment of the contact of the flat type IC package socket according to the present invention, FIG. 4B is a side view of the same, and FIG. Fig. 6 is a contact side view showing a modification based on the contact shown in Fig. 6, a contact perspective view showing another embodiment, and Fig. 7A shows a socket in which the contact shown in Fig. 4 is planted in a socket base. A partially cutaway perspective view, and Figure B is a sectional view schematically showing the socket mounted on the wiring board.
FIG. 8 is a partial side view of the socket base schematically showing a press-fit hole for the contact shown in FIG. 6. FIG. DESCRIPTION OF SYMBOLS 1...Flat type IC package, 5...Flat type IC package contact, 5a...Horizontal U-shaped contact piece provided for contact with flat type IC package, 5b...To socket base 5C: a male contact piece used for connection with a wiring board, etc.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フラット形ICパッケージのソケットに用いるコンタク
トであって、フラット形ICパッケージの端子との接触
に供される横U字形接片部とソケット基盤への圧入植込
みに供される植付片部と、配線基盤等との接続に供され
る雄接片部とを備えたコンタクトにおいて、上記植付部
を上記横U字形接片の側位に並べて配し、該側位植付片
部の一端を上記横U字形接片の下片端部に連設すると共
に、同側位植付片部他端に上記雄端子を連設したことを
特徴とするフラッド形ICパッケージ接触用コンタクト
A contact used for a socket of a flat IC package, which includes a horizontal U-shaped contact piece part used for contact with a terminal of a flat IC package, a planting piece part used for press-fitting into a socket base, and wiring. In a contact provided with a male contact piece part provided for connection with a base etc., the planting part is arranged side by side of the horizontal U-shaped contact piece, and one end of the side planting piece part is arranged side by side with the above-mentioned horizontal U-shaped contact piece. A contact for contacting a flood type IC package, characterized in that the male terminal is connected to the lower end of a horizontal U-shaped contact piece, and the male terminal is connected to the other end of the same side planting piece.
JP6453383U 1983-04-28 1983-04-28 Contact for flat IC package contact Granted JPS59171344U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6453383U JPS59171344U (en) 1983-04-28 1983-04-28 Contact for flat IC package contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6453383U JPS59171344U (en) 1983-04-28 1983-04-28 Contact for flat IC package contact

Publications (2)

Publication Number Publication Date
JPS59171344U true JPS59171344U (en) 1984-11-16
JPH0220836Y2 JPH0220836Y2 (en) 1990-06-06

Family

ID=30194716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6453383U Granted JPS59171344U (en) 1983-04-28 1983-04-28 Contact for flat IC package contact

Country Status (1)

Country Link
JP (1) JPS59171344U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55136481A (en) * 1979-04-09 1980-10-24 Fujitsu Ltd Socket for integrated circuit package and method of mounting same
JPS5676276U (en) * 1979-11-19 1981-06-22

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55136481A (en) * 1979-04-09 1980-10-24 Fujitsu Ltd Socket for integrated circuit package and method of mounting same
JPS5676276U (en) * 1979-11-19 1981-06-22

Also Published As

Publication number Publication date
JPH0220836Y2 (en) 1990-06-06

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