JPS60136151U

JPS60136151U - semiconductor socket

Info

Publication number: JPS60136151U
Application number: JP2377484U
Authority: JP
Inventors: 明山岸
Original assignee: 関西西本電気株式会社
Priority date: 1984-02-20
Filing date: 1984-02-20
Publication date: 1985-09-10

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図及び第２図は半導体検査装置の一例を示す正面図
及び側面図、第３図は半導体検査装置の他の一例を示す
正面図である。第４−乃至第６図は本考案の前提となる
ソケット例を説明するためのもので、第４図は分解斜視
図、第５図及び第６図は組付後の背面図及び側面図であ
る。第７図乃至第９図は本考案の一実施例を示し、第７
図は組付前の斜視図、第８図は組付後の側面図、第９図
は第７図でのソケットの部分拡大断面図である。第１０図及び第１１図は第７図のソケットの他の利用例
を説明するための各側面図である。１５・−・ソケット、１６・・・ソケット本体、へ〜ｂ
７・・・ピン端子。第５図　　　　　−第６図1 and 2 are a front view and a side view showing an example of a semiconductor testing device, and FIG. 3 is a front view showing another example of the semiconductor testing device. Figures 4 to 6 are for explaining examples of sockets that are the premise of the present invention. Figure 4 is an exploded perspective view, and Figures 5 and 6 are rear and side views after assembly. be. 7 to 9 show an embodiment of the present invention, and FIG.
The figure is a perspective view before assembly, FIG. 8 is a side view after assembly, and FIG. 9 is a partially enlarged sectional view of the socket in FIG. 7. FIGS. 10 and 11 are side views for explaining other usage examples of the socket shown in FIG. 7. 15...Socket, 16...Socket body, to b
7...Pin terminal. Figure 5 - Figure 6

Claims

[Scope of utility model registration request]

A plurality of parallel pin ends protruding from the socket body, at least the protruding portion of the child are made of an easily bendable soft metal, and the selected pin terminal can be converted into a selected non-bendable pin terminal as required. A semiconductor socket characterized by being bent to make electrical contact.