JPS59169307A - Method of forming rubber/plastic cable connector - Google Patents
Method of forming rubber/plastic cable connectorInfo
- Publication number
- JPS59169307A JPS59169307A JP58041502A JP4150283A JPS59169307A JP S59169307 A JPS59169307 A JP S59169307A JP 58041502 A JP58041502 A JP 58041502A JP 4150283 A JP4150283 A JP 4150283A JP S59169307 A JPS59169307 A JP S59169307A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- composition
- cable
- molding
- covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Landscapes
- Gas Or Oil Filled Cable Accessories (AREA)
- Processing Of Terminals (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、ゴム・プラスチックケーブル接続部、すなわ
ちケーブルの中間及び終端接続部の成形方法に係り、良
性能のゴム・プラスチックケーブル接続部を成形し得る
方法に関するものである。、従来やゴム・プラスチック
絶縁ケーブル接続部、つまりケーブルの終端及び中間接
続部の成形方法は、例えば中間接続部を例にとって説明
すると、次の如くであった。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for molding rubber-plastic cable connections, that is, intermediate and terminal connections of cables, and relates to a method for molding rubber-plastic cable connections with good performance. . Conventional methods for forming rubber/plastic insulated cable connection parts, that is, cable terminations and intermediate connection parts, are as follows, taking the intermediate connection part as an example.
すなわち、先ず、接続しようとする2本のケーブルの終
端を鉛筆先状に削り、露出させた導体相互を圧縮スリー
ブ等で接続した後、半導電収縮チューブ等を使用して、
内部半導電層を形成する。That is, first, shave the ends of the two cables to be connected into a pencil point shape, connect the exposed conductors with a compression sleeve, etc., and then use a semiconductive shrink tube or the like to
forming an inner semiconducting layer;
その後、接続部内部半導電層とケーブル°絶縁体(ペン
シリング部)との上に、所望の成形金型を覆い、該成形
金型中に、絶縁性組成物、例えば絶縁相hσを、必要な
場合には、半導電性組成物例えは半導電性横詰を、押出
機等で注入し、ケーブル接続部の補強絶縁層を成形する
。この補強杷縁層の架橋が必要な場合には、前記成形金
型を架橋に必要な温度まで加熱するか、あるいは適当な
架橋用金型(図示せず)を使用して実施する。Then, on top of the internal semiconducting layer of the connection part and the cable ° insulation (penciling part), cover the desired mold, and into the mold, insulating composition, e.g. In such a case, a semiconductive composition, such as a semiconductive horizontal filler, is injected using an extruder or the like to form a reinforcing insulating layer at the cable connection portion. If crosslinking of the reinforcing rim layer is required, this can be done by heating the mold to a temperature necessary for crosslinking or by using a suitable crosslinking mold (not shown).
しかしながら、このような従来のケーブル接続部の成形
方法には、次のような問題点があった。However, such a conventional method for forming a cable connection part has the following problems.
すなわち、前記の成形金型に、絶縁性あるいは半導電性
組成物を注入成形した後、成形金型を開き、得られたケ
ーブル接続部の破壊試験を実施すると、低い破壊値で絶
縁破壊した。そしてその破壊孔を見ると、接続したケー
ブルの絶縁体のペンシリングスロープの立ち上り部分に
大きな空隙が発生しており、この空隙内には水が溜って
いて、この空隙から破壊が進行していた。That is, after injecting an insulating or semiconductive composition into the mold, the mold was opened, and the resulting cable connection was subjected to a breakdown test, resulting in dielectric breakdown with a low breakdown value. When we looked at the fracture hole, we found that a large void had formed in the rising part of the penciling slope of the insulator of the connected cable, and water had accumulated in this void, and the fracture was progressing from this void. .
発明者らはかかる現象について鋭意解明を試みた結果、
かかる現象は成形金型を覆った後、前記樹脂等の組成物
の、押出すなわち注入温度に適する温度に成形金型を加
熱するが、ケーブル絶縁体表面に耐着していた水分、成
形金型に閉じ込められた空気中の水分等が、例えば、比
較的温度の低い金属体であるケーブル導体上に凝結する
ためで・はないかと推定した。As a result of our earnest efforts to elucidate this phenomenon, the inventors found that
This phenomenon occurs when the mold is heated to a temperature suitable for the extrusion or injection temperature of the composition such as the resin after the mold is covered, but the moisture that has adhered to the surface of the cable insulator is removed from the mold. It is assumed that this is because moisture trapped in the air condenses on, for example, the cable conductor, which is a metal body with a relatively low temperature.
本発明は、以上の推定に基づき、鋭意研究の結果、上記
空隙の発生を防止するためには、成形金型内のあらゆる
箇所、特にケーブル導体、絶縁体近傍で相対湿度をio
o%未満にすることにより、ケーブル上への結露を防止
すればよいことを見出し、本発明を完成するに到った。Based on the above estimation and as a result of intensive research, the present invention has found that in order to prevent the generation of the above-mentioned voids, the relative humidity should be adjusted to io
It was discovered that dew condensation on the cable could be prevented by reducing the amount to less than 0%, and the present invention was completed.
すなわち、第1図にみられるように1本発明は接続すべ
きゴム・プラスチックケーブル(A)及び(B)の導体
接続部8を半導電性組成物あるいは絶縁性組成物2によ
って被覆成形するに当り、ケーブル導体接続部8及びそ
の近傍la上に、所望の成形金型δを覆った後、該成形
金型8中に、半導電性組成物あるいは絶縁性組成物2を
注入する前、及び注入時に、前記成形金型3で覆われた
空間部分4を相対湿度100%未満に乾燥させることを
特徴とするものである。That is, as shown in FIG. 1, the present invention provides a method for coating and molding the conductor connecting portions 8 of the rubber/plastic cables (A) and (B) to be connected with a semiconductive composition or an insulating composition 2. After covering the desired molding die δ on the cable conductor connection portion 8 and its vicinity la, and before injecting the semiconductive composition or the insulating composition 2 into the molding die 8, and It is characterized in that the space 4 covered by the molding die 3 is dried to a relative humidity of less than 100% during injection.
本発明方法において成形金型8で覆われた空間部分4を
相対湿度100%未満とする方法としては種々考えられ
るが例えば所望の成形金型8にて覆うべき空間部公舎の
ケーブル絶縁体5、ケーブル導体6、内・外部牛導電層
7を適宜な手段により、温度90℃以下に加熱した後、
直ちに、成形金型8を覆う方法。In the method of the present invention, there are various ways to reduce the relative humidity of the space 4 covered by the molding die 8 to less than 100%. After heating the cable conductor 6 and the inner and outer conductive layers 7 to a temperature of 90°C or less by appropriate means,
A method of immediately covering the molding die 8.
すなわち、成形金型8を覆う前に、該成形金型8が覆う
導体接続部8、ペンシリング部9等を9゜°C以下に加
熱し、それらの表面吸着水分を除去しておく0この方法
の場合加熱温度を90’C以下に限定したのは、90℃
を越えると、ゴム・プラスチツタケーブル絶縁体5が導
体6の荷重により容易に加熱変形してしまうためである
。That is, before covering the molding die 8, the conductor connection part 8, pencil ring part 9, etc. covered by the molding die 8 are heated to 9°C or less to remove moisture adsorbed on their surfaces. In the case of the method, the heating temperature was limited to 90'C or less.
This is because if the load exceeds 1.0, the rubber/plastic cable insulator 5 will easily be heated and deformed by the load of the conductor 6.
他の方法としてはケーブル導体接続部8及びその近傍l
a上に所望の成形金型8を覆った後、該成形金型δ中を
乾燥した気体で置換した方法がある0
すなわち、成形金型8を覆った後、該成形金型δ内を乾
燥気体で置換し、成形金型8内を乾燥させる。乾燥気体
としては特にその種類を限定しないが、取扱いの容易さ
から窒素ガス、乾燥空気が好ましく、工事現場、特にマ
ンホール等での施工の際には乾燥空気の使用が好ましい
。気体の置換方法としては、成形金・型8の押出機10
によ−る樹脂注入孔11から気体を流し込む等の方法が
考えられる。気体の乾燥手段としては、市販の乾燥ガス
あるいはモレキュラーシープ等の乾燥機を通して気体を
供給する等の方法がある。Another method is to
There is a method in which a desired mold 8 is covered on top of the mold 8, and then the inside of the mold δ is replaced with dry gas0. In other words, after the mold 8 is covered, the inside of the mold δ is dried. The inside of the molding die 8 is dried by replacing with gas. The type of dry gas is not particularly limited, but nitrogen gas and dry air are preferred from the viewpoint of ease of handling, and dry air is preferably used during construction at construction sites, particularly in manholes. As a gas replacement method, the extruder 10 of the molding die/mold 8 is used.
Possible methods include injecting gas from the resin injection hole 11 according to the invention. As a means for drying the gas, there are methods such as supplying the gas through a commercially available drying gas or a dryer such as molecular sheep.
さらに他の方法としては、ケーブル導体接続部8及びそ
の近傍la上に所望の成形金型8を覆った後、該成形金
型8中に乾燥剤(図示せず)を゛含有せしめる方法があ
る。Still another method is to cover the cable conductor connection portion 8 and its vicinity la with a desired mold 8, and then contain a desiccant (not shown) in the mold 8. .
すなわち、成形金型8の適当な箇所に乾燥剤を置き、金
型8を低湿度雰囲気に保つ。方法としては金型8内の適
当な箇所に乾燥剤入れを作るとか、乾燥剤を適当な容器
に入れ、金型8内に設置する等の方法が考えられる。That is, a desiccant is placed at an appropriate location on the mold 8 to maintain the mold 8 in a low-humidity atmosphere. Possible methods include creating a desiccant container at a suitable location within the mold 8, or placing the desiccant in a suitable container and placing it inside the mold 8.
さらに他の方法として、内部の空気と外気との交換が容
易である一部が外気と連通ずる所望の成形金型8を、用
いる方法がある。Still another method is to use a desired molding die 8 in which a portion of the mold 8 communicates with the outside air so that the air inside the mold can be easily exchanged with the outside air.
すなわち、成形金型8内の湿度の高い空気を樹脂注入と
共に外部へ押出して、成形金型a内の結露3防止するも
のであって、金型8の適当な箇所にオーバーフロ一孔(
図示せず)を設ける等の方法がある。That is, the highly humid air inside the mold 8 is pushed out together with resin injection to prevent dew condensation 3 inside the mold a, and an overflow hole (
(not shown).
本発明方法は上記方法に特定されるものでなく、適宜な
手法により成形金型3内の相対湿度を100チ未満にす
ることにより初期の効果が得られるものである。The method of the present invention is not limited to the above method, but the initial effect can be obtained by reducing the relative humidity in the molding die 3 to less than 100 degrees using an appropriate method.
以下本発明をさらに実施例及び比較例について説明する
。The present invention will be further described below with reference to Examples and Comparative Examples.
比較例
66 KV eV 250−のケーブルを両端末鉛筆先
状に削った後、圧縮スリーブで露出させた導体相互を接
続した後、半導電性熱収縮チューブを使用して、内部半
導電層7を成形した。その後、形成した内部半導電層7
上に成形金型8を設置し、ポリエチレン樹脂(日本ユニ
カー株式会社製商品名HFDJ 4201 E ) 2
を成形金型8内に注入し、注入完了と同時に、成形金型
8を昇温し架橋させた。Comparative Example 66 After cutting both ends of a KV eV 250- cable into a pencil point shape, and connecting the exposed conductors with each other with a compression sleeve, the internal semiconductive layer 7 was formed using a semiconductive heat shrink tube. Molded. After that, the formed internal semiconducting layer 7
A molding die 8 is installed on top, and a polyethylene resin (product name: HFDJ 4201 E manufactured by Nippon Unicar Co., Ltd.) 2
was injected into the mold 8, and at the same time as the injection was completed, the mold 8 was heated to crosslink.
架橋後、外部半導電層として半導電生ゴムテープを巻き
、交流破壊試験に供したところ、120KVで破壊した
。破壊孔を観察したところ、内部半導電層7と絶縁層5
界面に空隙が存在し、そこから破壊がスタートしていた
。また、空隙には水が溜っていた。After crosslinking, a semiconductive raw rubber tape was wrapped as an external semiconductive layer and subjected to an alternating current destructive test, which resulted in failure at 120 KV. When the fracture hole was observed, it was found that the inner semiconducting layer 7 and the insulating layer 5
A void existed at the interface, and destruction started from there. Also, water had accumulated in the voids.
実施例トI
前記比較−と同様に66 KV OV 250−の導体
接続部8を、第1図に示すように、成形金型8にて覆い
、金型8内を第1表に記載したようにそれぞれ乾燥した
後、前記比較例にて用い蛤と同一の樹脂(HFDJ 4
201 K )を金型8内に、押出機10により注入口
11がら注入し、その後、加熱架橋してケーブル接続部
を成形し丸面して作成したケーブル接続部について、交
流破壊値の測定及び空隙部の生成の有無を調べた。得ら
れた第1表に併記した。Example I As in the comparison above, the conductor connection part 8 of the 66 KV OV 250- was covered with a molding die 8 as shown in FIG. After drying, the same resin as the clam used in the comparative example (HFDJ 4
201 K) was injected into the mold 8 through the injection port 11 using the extruder 10, and then heated and crosslinked to form a cable connection part with a rounded surface.The AC breakage value was measured and The presence or absence of voids was investigated. The results are also listed in Table 1.
表から明らかなように、本発明方法によれば内部半導電
層と絶縁体界面などでの空隙発生が防止され、交流破壊
特性も著しく向上したケーブル接続部が得られるもので
ある。As is clear from the table, according to the method of the present invention, it is possible to prevent the generation of voids at the interface between the internal semiconducting layer and the insulator, and to obtain a cable connection portion with significantly improved AC breakdown characteristics.
第1図は本発明の一実施例に係る工程の説明略図である
。
A、B・・・a[するゴム・プラスチックケーブルIa
・・・ケーブル接続部1の近傍
2・・・半導電性組成物あるいは絶縁性組成物δ・・・
成形金型
4・・・成形金型8で覆われた空間部分5・・・ケーブ
ル絶縁体 6・・・ケーブル導体7・・・内・外部半
導電層 8・・・導体接続部9・・・ペンシリング部
10・・・押出様11・・・樹脂注入口。
特許出願人 古河電気工業株式会社FIG. 1 is a schematic diagram illustrating a process according to an embodiment of the present invention. A, B...a [rubber/plastic cable Ia
... Near the cable connection part 1 2 ... Semiconductive composition or insulating composition δ ...
Molding mold 4...Space covered by molding die 8 5...Cable insulator 6...Cable conductor 7...Inner and outer semiconducting layers 8...Conductor connection portion 9...・Penciling section
10...Extrusion state 11...Resin injection port. Patent applicant Furukawa Electric Co., Ltd.
Claims (1)
性組成物あるいは絶縁性組成物によって被覆繰続部を成
形するに当り、 ケーブル導体接続部及びその近傍上に所望の成形金型を
覆った後、該成形金型中に半導電性組成物あるいは絶縁
性組成物を注入する前、及び注入時に、前記成形金型で
覆われた空間部分を相対湿度100%未満に乾燥させる
ことを特徴とTるゴム−プラスチックケーブル接続部の
成形方法。 区 所望の成形金型にて覆うべき空間部分のケーブル絶
縁体、ケーブル導体、内・外部牛導亀層を温度90°C
以下に加熱した後、直ちに、成形金型を覆い、該成形金
型中に半導電性組成物あるいは絶縁性組成物を注入する
ことをプラスチックケーブル接続部の成形方法。 & ケーブル導体接続部及びその近傍上に所望の成形金
型を覆った後、該成形金型中を乾燥した気体で交換した
後、直ちに、前記成形金型中に半導電性組成物あるいは
絶縁性組成物を注入することを特徴とする特許請求の範
囲第1項記載のゴム・プラスチックケーブル接続部の成
形方法。 表 ケーブル導体接続部及びその近傍上に所望の成形金
型を覆った後、該成形金型中に乾燥剤を含有せしめ、半
導電性組成物あるいは絶縁性組成物を前記成形金型中に
注入することを特徴とする特許請求の範囲第1項記載の
ゴム−プラスチックケーブル接続部の成形方法〇五 内
部の空気と外気との交換が容易である一部が外気と連通
する所望の成形金型を、・ケーブル接続部及びその近傍
上に覆った麦、前記の成形金型中に半導電性組成物ある
いは絶縁性組成物を注入することを特徴とする特許藺−
プル接続部の成形方法。[Claims] L: When molding a continuous part of a four-piece connecting part of a rubber/plastic cable with a semiconductive composition or an insulating composition, a desired molding is performed on the cable conductor joint part and its vicinity. After covering the mold, before and during injection of the semiconductive composition or insulating composition into the mold, dry the space covered by the mold to a relative humidity of less than 100%. A method for molding a rubber-plastic cable connection part characterized by: Warm the cable insulator, cable conductor, and inner and outer cable layers in the space to be covered with the desired mold at a temperature of 90°C.
A method for molding a plastic cable connection part includes heating the mold, immediately covering the mold, and injecting a semiconductive composition or an insulating composition into the mold. & After covering the cable conductor connection portion and its vicinity with a desired mold, and after replacing the inside of the mold with dry gas, immediately fill the mold with a semiconductive composition or an insulating composition. A method for molding a rubber/plastic cable connection part according to claim 1, characterized in that the composition is injected. Table: After covering the cable conductor connection portion and its vicinity with a desired mold, a desiccant is contained in the mold, and a semiconducting composition or an insulating composition is injected into the mold. Method for molding a rubber-plastic cable connection section according to claim 1, characterized in that: (5) a desired molding die in which a part communicates with the outside air so that the internal air can easily be exchanged with the outside air; A patent characterized in that a semiconducting composition or an insulating composition is injected into the forming mold by covering the cable connection portion and its vicinity.
How to form a pull connection.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58041502A JPS59169307A (en) | 1983-03-15 | 1983-03-15 | Method of forming rubber/plastic cable connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58041502A JPS59169307A (en) | 1983-03-15 | 1983-03-15 | Method of forming rubber/plastic cable connector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59169307A true JPS59169307A (en) | 1984-09-25 |
Family
ID=12610127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58041502A Pending JPS59169307A (en) | 1983-03-15 | 1983-03-15 | Method of forming rubber/plastic cable connector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59169307A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS627322A (en) * | 1985-07-03 | 1987-01-14 | 住友電気工業株式会社 | Formation of extrusion molded type connection for rubber or plastic insulated power cable |
-
1983
- 1983-03-15 JP JP58041502A patent/JPS59169307A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS627322A (en) * | 1985-07-03 | 1987-01-14 | 住友電気工業株式会社 | Formation of extrusion molded type connection for rubber or plastic insulated power cable |
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