JPS5859030A - Method of forming power cable joined section insulated with rubber or plastics - Google Patents
Method of forming power cable joined section insulated with rubber or plasticsInfo
- Publication number
- JPS5859030A JPS5859030A JP56154337A JP15433781A JPS5859030A JP S5859030 A JPS5859030 A JP S5859030A JP 56154337 A JP56154337 A JP 56154337A JP 15433781 A JP15433781 A JP 15433781A JP S5859030 A JPS5859030 A JP S5859030A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductive
- polyolefin
- rubber
- molded
- molds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
- H02G1/14—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for joining or terminating cables
- H02G1/145—Moulds
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Processing Of Terminals (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はゴノ、或はプラスチック絶縁型カケープルの接
続部形成方法、特に押出装置を用いた押出型モールド接
続片1(形成方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming a connecting portion of a gono or a plastic insulated capeple, and particularly to a method for forming an extrusion molded connecting piece 1 using an extrusion device.
ゴム・プラスチック絶縁型カケープル特に架橋ポリオレ
ノイン唯縁電カケープルは154KV。Rubber/plastic insulation type cables, especially cross-linked polyolenoin electric cables, are rated at 154KV.
275KV線路に適用さ■ており、長尺線路への適用も
されることから、これにともなって直線接続部が必要と
される。超高圧架橋ポリオレフィン絶縁型カケ−プル用
直線接続部は、ケーブル本体と同材質のポリオレフィン
絶縁体を用いて加熱モ一式
ルドするモールド式が最適である。モールド接続部
部はポリオレフィン絶縁テープあるいはシートを積層巻
きして加熱モールドする方式、あらかじめ成形したポリ
オレフィン絶縁ブロックを適用して加熱モールドする方
式、ケーブル本体の製造と同様に押出装置を用いて押出
して加熱モールドする方式がある。押出装置を用いて押
出成形する押出型モールド接続部は異物混入もなく信頼
性の点からすぐれている。押出型モールド接続部は外部
半導電層の処理が重要であるが、特に電気性能上から接
続部立上り部の外部半導電層処理について信頼性のすぐ
れた工法を確立する必要がある。Since it is applied to 275KV lines and also to long lines, a straight connection part is required accordingly. The most suitable linear connection for an ultra-high voltage cross-linked polyolefin insulated cable cable is a molded type in which heat molding is performed using a polyolefin insulator made of the same material as the cable body. For the mold connection part, polyolefin insulating tape or sheet is laminated and rolled and heat molded, a pre-formed polyolefin insulating block is applied and heat molded, and the same method used to manufacture the cable body is extruded using an extrusion device and heated. There is a method of molding. The extrusion-type mold connection part, which is extrusion-molded using an extrusion device, is free from foreign matter and has excellent reliability. For extrusion-type molded connections, treatment of the outer semiconductive layer is important, and in particular, from the viewpoint of electrical performance, it is necessary to establish a highly reliable method for treating the outer semiconductive layer of the rising portion of the connection.
本発明の1]的は押出型モールド接続部の外部半導電層
を適切に処理することができる信頼性が高く、確実なる
工法を提供することにある。1] The object of the present invention is to provide a highly reliable and reliable construction method capable of appropriately treating the outer semiconducting layer of an extrusion mold connection.
本発明の要旨は、押1」4装晴を用いて、ゴム・プラス
チック絶縁ケーブル接続部をおおっている金型内に溶融
ポリオレフィン絶縁物を押出充填する場合、金型内の接
続部の立上りr’dI (り−−プルの外部半導電層の
端末部伺近に位置するところに、あらかじめ成形された
半導電性ポリオレフィンユニットあるいは半導電性ゴl
、ユニットを配置した後、前記の溶融ポリオレフィン絶
縁物を充填し、成形することにより押出型モールド接鼾
ノド部を成形することにある。The gist of the present invention is that when a molten polyolefin insulation material is extruded and filled into a mold covering a rubber/plastic insulated cable connection part using a pusher 1"4, the rising r of the connection part in the mold 'dI (pre-formed semiconducting polyolefin unit or semiconducting rubber located near the end of the outer semiconducting layer of the re-pull)
After arranging the unit, the above molten polyolefin insulation is filled and molded to form an extrusion mold joint nod part.
本発明の一実施例を添旬図面を引)11シ説明する。An embodiment of the present invention will be described with reference to the accompanying drawings.
接続すべき両側の架橋ポリエチレン絶縁ケーブル11を
ペンシリンダ処理し、導体1妄続管2によりケーブル導
体接続後、内部半導電層6を設ける。The cross-linked polyethylene insulated cables 11 on both sides to be connected are subjected to pen cylinder treatment, and after the cable conductors are connected by the conductor 1 and the connecting pipe 2, the internal semiconductive layer 6 is provided.
内部半導電層6は半導電外熱収納ポリオレフィンチュー
ブもしくけ半導電性熱収縮コノ、ナ」−−ブを用いる。The inner semiconductive layer 6 is made of a semiconductive heat-shrinkable tube or a semiconductive external heat storage polyolefin tube.
ケーブル接続部をお」すつて金型5を取り句けるが、接
続都立」二り部(ケーブルの外jilt Y−導電層の
端末部イ」近)に位置するところの金ノ(q5の内面に
、あらかじめ成形した半導電性:]−ニフッl−4を配
性しておく。半導電性ユニット4は半導電性ポリオレフ
ィンもしくは半導電性ゴムで成形したものである。The mold 5 can be removed by lowering the cable connection part, but the inner surface of the metal hole (q5) located at the connecting part (near the outer part of the cable - the terminal part of the conductive layer) A pre-molded semiconductive unit 4 is disposed on the unit.The semiconductive unit 4 is molded from semiconductive polyolefin or semiconductive rubber.
しかる後、金型5を所定Y品度に予熱し、押出装置1よ
り所定温度に溶融したポリオレフイノ絶縁物9を押出充
填し、成形する。Thereafter, the mold 5 is preheated to a predetermined Y quality, and the extrusion device 1 extrudes and fills the polyolefin insulator 9 melted to a predetermined temperature to form the mold.
この場合、金型5と半導電性ユニット4との間に加圧媒
体(空気、N、!ガス、Sli’6ガス、シリコ−油な
と)を封入し加圧するか、もしくは金型5に半導電性ユ
ニット4を加圧する加圧装、1を内蔵させ刀日田するこ
とを行ってもよい。In this case, a pressurized medium (air, N gas, Sli'6 gas, silicone oil, etc.) is sealed between the mold 5 and the semiconductive unit 4, or the mold 5 is pressurized. A pressurizing device 1 for pressurizing the semiconductive unit 4 may be built-in.
さらに、両側の半導電性ユニット間の絶縁物9上には、
半導電性熱収縮ポリオレフィンチューブもしくは架橋タ
イプの半導電性塗料あるいは半導電性ポリオレフィンを
施し、加熱モールド成形して外部半導電層を形成する。Furthermore, on the insulator 9 between the semiconductive units on both sides,
A semiconductive heat-shrinkable polyolefin tube or cross-linked semiconductive paint or semiconductive polyolefin is applied and hot molded to form an external semiconductive layer.
なお、押出装@1より溶融ポリオレフィン絶縁物9(i
−充填する場合、金型5の中をあらかじめ脱気して溶融
ポリオレフィン絶縁物9を充填してもよい。In addition, the molten polyolefin insulator 9 (i
- When filling, the inside of the mold 5 may be evacuated in advance and filled with the molten polyolefin insulator 9.
6は加圧装置兼脱気装置、7はラム兼オーバー)3− ロ一孔、8及び1oは加熱ヒーターである。6 is a pressurizing device/deaerator, 7 is a ram/over) 3- Holes 8 and 1o are heaters.
本発明によれば、次の効果が1;Iられる。According to the present invention, the following effects can be achieved.
1、 金型構造を複雑にせずに実施でき、作業性にすぐ
れている。1. It can be carried out without complicating the mold structure and has excellent workability.
2、 あらかじめ成型されている半導電性ユニットを用
いて、押出型モールド1妾続部の立−Lり邪の外部半導
電層を適甲ノにf’i7i成できる。2. By using a pre-molded semiconductive unit, the external semiconductive layer of the standing portion of the extrusion mold 1 can be formed in a suitable manner.
図は本発明の一実施例を示す゛16縦断説明図である。
1:押出装置、2:導体接続管、3:内部半導電層、4
:半導電性ユニット、5:金型、9:ポリオレフィン絶
縁物、
11:架橋ポリエチレン絶縁ケーブル。
4−The figure is a 16 longitudinal cross-sectional explanatory diagram showing one embodiment of the present invention. 1: Extrusion device, 2: Conductor connection tube, 3: Internal semiconductive layer, 4
: Semi-conductive unit, 5: Mold, 9: Polyolefin insulator, 11: Cross-linked polyethylene insulated cable. 4-
Claims (1)
続部をおおっている金型内に、溶融ポリオレフィン絶縁
物を充填する場合、金型内の接続部立上り部に位置する
ところに、あらかじめ成型された半導電性ポリオレフィ
ンユニット或は半導電性ゴムユニットを配置した後、前
記溶融ポリオレフィン絶縁物を充填し、成形することを
特徴とするゴム・グラスチック絶縁ケーブル接続部の形
成方法。When filling a mold with molten polyolefin insulation covering the joints of rubber-plastic insulated cables on both sides to be connected, place a pre-formed semi-conductor in the mold at the rising edge of the joint. 1. A method of forming a rubber/glass insulated cable connection part, which comprises arranging a conductive polyolefin unit or a semiconductive rubber unit, and then filling the molten polyolefin insulator and molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56154337A JPS5859030A (en) | 1981-09-29 | 1981-09-29 | Method of forming power cable joined section insulated with rubber or plastics |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56154337A JPS5859030A (en) | 1981-09-29 | 1981-09-29 | Method of forming power cable joined section insulated with rubber or plastics |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5859030A true JPS5859030A (en) | 1983-04-07 |
JPS6131597B2 JPS6131597B2 (en) | 1986-07-21 |
Family
ID=15581941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56154337A Granted JPS5859030A (en) | 1981-09-29 | 1981-09-29 | Method of forming power cable joined section insulated with rubber or plastics |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5859030A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6260415A (en) * | 1985-09-06 | 1987-03-17 | 東京電力株式会社 | Extruding, molding and connecting method for cable |
JPH069316U (en) * | 1992-06-30 | 1994-02-04 | 古河電気工業株式会社 | Molded body for connection part or terminal part of electric cable |
-
1981
- 1981-09-29 JP JP56154337A patent/JPS5859030A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6260415A (en) * | 1985-09-06 | 1987-03-17 | 東京電力株式会社 | Extruding, molding and connecting method for cable |
JPH069316U (en) * | 1992-06-30 | 1994-02-04 | 古河電気工業株式会社 | Molded body for connection part or terminal part of electric cable |
Also Published As
Publication number | Publication date |
---|---|
JPS6131597B2 (en) | 1986-07-21 |
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