JPS59165315A - Lead switch - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is characterized in that a metal plating layer mainly composed of rhodium or ruthenium is attached on at least the free end of a lead body made of a magnetic material mainly composed of iron and nickel. The present invention relates to an improvement in a reed switch having a configuration in which at least the free ends of the pair of leads are enclosed in a container in a state in which they are closely opposed to each other.

In a reed switch having such a configuration, when a magnetic field is applied from outside the container, the free ends of the pair of leads come into contact with each other through a pair of contacts, and the pair of leads is turned on. is obtained, and when the magnetic field is removed from this state, the free ends of the pair of leads return to the state in which they are closely facing each other, and an OFF state is obtained between the pair of leads.
This switch operation is performed.

Therefore, the reed switch having the above-mentioned configuration is widely used in various telecommunication equipment and peripheral equipment thereof.

The reed switch having the above-mentioned configuration apparently has a first
As shown in the figure, it has a pair of leads 1A and 1B whose free ends are flat, and the free ends of the pair of leads 1A and 1B are placed in a vacuum in a container 2 with the free ends of the leads 1A and 1B facing each other closely. It is common to have an enclosed structure.

In a reed switch having such an apparent configuration, in a conventional reed switch, each of the pair of leads 1A and 1B is made of a magnetic material mainly composed of iron and nickel, as shown in FIG. In a configuration in which a plating layer 4 of a metal containing rhodium or ruthenium as a main component is attached at least on the end portion of the lead main body 3, the lead main body 3 is made of a magnetic material mainly containing iron and nickel;
Usually, the structure has a plating layer 4 of a metal mainly composed of gold, silver, or copper interposed between a plating layer 4 of a metal mainly composed of rhodium or ruthenium. .

In the case of a conventional reed switch with such a configuration,
In the pair of leads 1A and 1B, the plating layer 4 of a metal mainly composed of rhodium or ruthenium attached on at least the free end of the lead body 3 made of a magnetic material mainly composed of iron and nickel is It acts as the surface layer of the free end portions of the pair of leads 1A and 1B, and therefore the surface layer of the pair of contacts.

The plating layer 4 of metal mainly composed of rhodium or ruthenium, which is applied on at least the end portion of the lead body 3 of the pair of leads 1A and 1B and acts as such a surface layer, is made of iron and nickel. A plating layer 5 of a metal mainly composed of gold, silver, or copper is interposed between a lead body 3 made of a magnetic material as a main component and a plating layer 4 of a metal mainly composed of rhodium or ruthenium. It has higher hardness compared to

Therefore, the free ends of the pair of glue heads 1A and 1B, therefore,
A pair of contacts has high wear resistance.

Also, a pair of glue dots 1 act as the above-mentioned surface layer.
In A and 1B, the plating layer 4 of metal mainly composed of rhodium or ruthenium attached on at least the free end of the lead body 3 made of a magnetic material mainly composed of iron and nickel is made of iron and nickel. A plating layer 5 of a metal mainly composed of gold, silver, or copper is interposed between the lead body 3 made of a magnetic material mainly composed of and a plating layer 4 of a metal mainly composed of rhodium or ruthenium It has a higher melting point than that of

Therefore, when the above-described switching operation is continuously repeated between the free ends of the pair of leads 1A and 1B, and therefore between the pair of contacts, the free ends of the pair of leads 1A and 1B, and therefore the pair of contacts. Even if relatively high temperature heat is generated at the contacts, the free ends of the pair of leads 1A and 1B, and therefore the surfaces of the pair of contacts, do not melt, and therefore the free ends of the pair of leads 1A and 1B do not melt. The materials constituting the surface layers of the end portions, and thus the surface layers of the pair of contacts, do not transfer to each other, and therefore, the surfaces of the roadside portions of the pair of roadways 1A and 1B,
Therefore, the surfaces of the pair of contacts do not deteriorate.

Therefore, in the case of the conventional reed switch shown in FIGS. 1 and 2, rhodium or ruthenium is the main component in the pair of leads 1A and 1B. When considering a reed switch having the same configuration as the conventional reed switch shown in FIGS. 1 and 2, except that it does not have the plating layer 4 made of metal, compared to that reed switch,
The cumulative failure rate of the switch operation with respect to the number of switch operations described above is sufficiently low, and the pair of boards 1A and 1
The contact resistance between the free ends of B, and hence the contacts, is sufficiently low when they come into contact with each other.

Furthermore, in the case of the conventional reed switch described above in FIGS. 1 and 2, in the pair of leads 1A and 1B, the plating layer 5 of a metal mainly composed of gold, silver, or copper is made of iron and nickel as a main component. It is formed on and in contact with the lead body 3 made of a magnetic material, and is formed on the plating layer 5 of a metal mainly composed of gold, silver, or copper, in contact with it, and is formed with rhodium or It has a structure in which a plating layer 4 of a metal mainly composed of ruthenium is formed, and the plating layer 4 of a metal mainly composed of rhodium or ruthenium is plated with a metal mainly composed of gold, silver, or copper. layer 5
It has high conductivity close to that of .

Therefore, in the case of the conventional reed switch shown in FIGS. 1 and 2, while having the above-mentioned features, a pair of leads 1A
When the free ends of leads IA and 1B come into contact with each other and an on state is obtained between the pair of leads IA and 1B, the resistance seen between the pair of leads IA and 1B is low by "-". have

Furthermore, in the conventional reed switch described above with reference to FIGS. 1 and 2, the plating layer 4 of metal mainly composed of rhodium or ruthenium on the pair of leads 1A and 1B is Relatively high temperature heat is generated at the free end of 1B, and based on this, the plating layer 5 of a metal mainly composed of gold, silver, or copper is heated. From the plating layer 5 made of metal as the main component, the metal mainly made of gold, silver or copper passes through the plating layer 4 of metal mainly made of rhodium or ruthenium. Or, even if heat is not diffused to the surface side of the metal plating layer 4 mainly composed of ruthenium, therefore to the surface side of the free end portions of the pair of glueds 1A and 1B, and therefore to the surface side of the pair of contacts,
It has the property of preventing this.

Therefore, even if relatively high temperature heat is generated at the free ends of the pair of leads 1A and 1B as described above, based on this, the plating layer 5. is heated, and the metal mainly composed of gold, silver, or copper that constitutes it is deposited on the surface of the free end of the pair of adhesives 1A and 1B, and therefore on the surface of the pair of contacts, and Since the metal mainly composed of gold, silver, or copper has a relatively high viscosity, a pair of leads 1
There is no mutual transfer between the free ends of A and 1B, and therefore between the pair of contacts, and therefore the pair of glue contacts 1
The surfaces of the free ends A and 1B, and therefore the surfaces of the pair of contacts, will not deteriorate.

Therefore, in the case of the conventional reed switch shown in Figs. 1 and 2, when the end portions of the pair of leads 1A and 1B, and hence the pair of contacts, come into contact with each other, the contact resistance between them is said to be low. Therefore, the state of low resistance between the pair of leads 1A and 1B is maintained over a long period of use.

However, in the case of the conventional reed switch shown in FIGS. 1 and 2, the free ends of the pair of leads 1A and 1B, and therefore the pair of contacts, are in contact with each other in a magnetic field having a desired strength; In other words, the distance between the pair of leads 1A and 1B when viewed from the lead body 3 made of a magnetic material mainly composed of iron and nickel is adjusted so that the pair of leads 1A and 1B are in an on state. , to get the desired value,
When increasing the thickness excluding the thickness of the lead body 3 at the free end of a pair of glue leads 1A and 1B, 1. The thickness of the plating layer 4 of a metal mainly composed of rhodium or ruthenium is 5 μm. When the thickness is increased above, cranks are likely to occur in the metal plating layer 4 mainly composed of rhodium or ruthenium due to internal stress.

- Therefore, for the reasons mentioned above, a pair of leads 1A
And when increasing the thickness excluding the thickness of the lead body 3 at the free end of 1B, when increasing the thickness of the metal plating layer 4 containing rhodium or ruthenium as a component, the rhodium or ruthenium Since cracks have occurred in the plating layer 4 of metal whose main component is gold, silver, or copper, when relatively high temperature heat is generated at the free ends of the pair of glueds 1A and 1B as described above, From the plating layer 5 of a metal mainly composed of, the metal mainly composed of gold, silver, or copper is transferred through the plating layer 4 of a metal mainly composed of rhodium or ruthenium to its surface, thus A plating layer of a metal mainly composed of rhodium or ruthenium is deposited on the surfaces of the free ends of the pair of leads 1A and 1B, and thus on the surfaces of the pair of contacts, and a metal mainly composed of gold, silver, or copper A pair of leads 1A and 1B has higher adhesiveness than the metal mainly composed of rhodium or ruthenium that constitutes lead 4.
As a result, the surfaces of the free ends of the pair of leads 1A and 1B, and therefore the surfaces of the pair of contacts, deteriorate.

Furthermore, as mentioned above, relatively high temperature heat is generated at the free ends of the pair of leads 1A and 1B, and based on this,
When the plating layer 5 of a metal mainly composed of gold, silver, or copper is heated, the plating layer 5 of a metal mainly composed of gold, silver, or copper is plated with a metal mainly composed of rhodium or ruthenium. Since it has a lower melting point than layer 4, pits are likely to occur in the metal plating N5 whose main component is gold, silver, or copper.

Therefore, for the above-mentioned reason, when increasing the thickness of the pair of leads 1A and 1B excluding the thickness of the lead body 3 at the end of the road, it is necessary to use a metal whose main component is rhodium or ruthenium. When the thickness of the plating layer 4 is increased, as described above, when relatively high temperature heat is generated at the ends of the pair of leads 1A and 1Ba')'Ti, plating with a metal mainly composed of rhodium or ruthenium occurs. Cracks have occurred in the layer 4, and pinholes have occurred in the plating layer 5, which is a metal whose main component is gold, silver, or copper.
The lead body 3 is made of a magnetic material mainly composed of iron and nickel, and has a lower conductivity than the metal containing gold, silver, or copper as a main component, and the metal containing rhodium or ruthenium as a main component. A magnetic material mainly composed of iron and nickel, which only has the properties , metal plating layer 5 containing rhodium or ruthenium as the main component
, the surfaces of the free ends of the pair of leads 1A and 1B, and therefore the surfaces of the pair of contacts.

Therefore, in the case of the conventional reed switch shown in FIGS. 1 and 2, the thickness of the pair of leads 1A and 1B excluding the thickness of the lead body 3 at the end of the road is increased for the above-mentioned reason. In this case, when the thickness of the plating layer 4 of metal mainly composed of rhodium or ruthenium is increased, when the free ends of the pair of leads 1A and 1B, and therefore the pair of contacts, contact each other, The contact resistance between the pair of leads 1A and 1B increases, and the conductivity between the pair of leads 1A and 1B decreases accordingly when an on state is obtained between the pair of leads 1A and 1B. It had drawbacks.

In addition, in the case of the conventional reed switch shown in FIGS. 1 and 2, for the reason mentioned above, a pair of leads 1A and 1
When increasing the thickness excluding the thickness of the lead body 3 at the free end of B, when increasing the thickness of the plating layer 4 of metal mainly composed of rhodium or ruthenium, expensive rhodium or ruthenium is used. Requires a large amount of metal, the main component of which is

Therefore, in the case of the conventional glued switch shown in FIGS. 1 and 2, for the reason mentioned above, the thickness of the pair of leads 1A and 1B excluding the thickness of the lead body 3 at the free end portion When increasing the thickness of the metal plating layer 4 mainly composed of rhodium or ruthenium,
It had the disadvantage that it could not be provided at a low price.

Therefore, the present invention aims to propose a novel reed switch free of the above-mentioned drawbacks, which will become clear from the detailed description below.

The first embodiment of the reed switch according to the present invention is apparently similar to a conventional reed switch, and has a pair of reeds 1A and 1B with flat free ends, as shown in FIG. However, the free ends of the pair of adhesives 1A and 1B are vacuum-sealed in the container 2 in a state in which they are closely opposed to each other.

However, in the first embodiment of the reed switch according to the present invention, each of the pair of reeds 1A and 1B has a third
It has the configuration described below with accompanying figures.

In FIG. 3, parts corresponding to those in FIG. 2 are designated by the same reference numerals.

Each of the pair of leads 1A and 1B in the first embodiment of the reed switch according to the present invention shown in FIG.
In each of the pair of leads 1A and 1B of the conventional reed switch described above in FIG. Palladium is interposed between the plating layer 5 of a metal mainly composed of gold, silver, or copper, and the plating layer 4 of a metal mainly composed of rhodium or ruthenium. It has the same structure as each of the pair of boards 1A and 1B of the conventional reed switch described above in FIG. 2, except that a plating layer 6 of palladium alloy, which is the main component, is inserted.

In this case, the palladium alloy mainly composed of palladium constituting the plating layer 6 of the palladium alloy mainly composed of palladium is
), CU, Ail, Au, Zn, Cd, In, 3u
, Pb, V, As, Bi, Cr, Mo, Fe, Co, N
It can be an alloy with one or more dissimilar metals selected from i, Ru, pt, 1r1Qs, especially P'd,
It is possible to form an alloy with a different metal consisting of CO.

Further, the composition of the palladium alloy mainly composed of palladium constituting the plating layer 6 of the palladium alloy mainly composed of palladium, that is, the ratio of palladium (Pd) to different metals is 99.95. :0.05% by weight to 40:60% by weight. In particular, palladium alloys containing palladium as the main component may range from 0.05 to 40:60% by weight.
and a dissimilar metal consisting of CO, pd and,
The ratio with different metals is 99°5:0.5% by weight.
may range from a ratio of 70:30 by weight.

Furthermore, the plating layer 16 of palladium alloy mainly composed of palladium has a thickness of 0.01 to 10 μm, and in particular,
The palladium alloy containing palladium as the main component, which constitutes the plating layer 6 of the palladium alloy containing palladium as the main component, is an alloy of palladium (Pd) as the main component and a dissimilar metal consisting of Pd and CO. If so, 0°05～
It is possible to have a thickness in the range of 5 μm.

Further, a metal plating layer 4 containing rhodium or ruthenium as a main component has a thickness of 0.1 to 5 μm.

The above is the configuration of the first embodiment of the reed switch according to the present invention.

In the reed switch according to the present invention having such a configuration, specific examples of each of the leads 1A and 1B are as follows.

The lead body 3 made of a magnetic material mainly composed of iron and nickel is made of 52 alloy mainly composed of iron and nickel, degreased at 800°C and then heated to 800°C to 100°C in a reducing atmosphere.
It was obtained by heat treatment at a temperature of 000°C.

Further, a plating layer 5 of a metal mainly composed of gold, silver, or copper is placed on the free end portion of the lead body 3 made of the magnetic material mainly composed of iron and nickel obtained in the above-mentioned method. It was obtained by electrolytic degreasing in advance, acid activation, and then plating with a metal mainly composed of gold, silver, or copper to a thickness of 0.25 μm.

Furthermore, a plating layer 6 of a palladium alloy containing palladium as a main component is formed on the plating layer 5 of a metal containing gold, silver, or copper as a main component obtained as described above. CO), which were obtained by plating a palladium alloy mainly composed of palladium in a proportion of 99:1 by weight to a thickness of o, oi μm. Palladium (Pl)
and cobalt (Co) in the form of ethylene diamine salt and cobalt sulfate, respectively, in the ratio of 1/fL and 1/4, respectively, and the pH is 3.0 to 3.5.
0.5A using a liquid whose temperature is adjusted to 55-60℃
It was performed at a current density of /cm.

Further, a plating layer 4 of a metal mainly composed of rhodium or ruthenium is formed on a plating layer 6 of a palladium alloy mainly composed of palladium obtained as described above.
It was obtained by plating the plating layer of R11') to a thickness of 3 μm.

The configuration of the first embodiment of the reed switch according to the present invention has been clarified above.

The reed switch according to the present invention shown in FIGS. 1 and 3 is different from the conventional reed switch described above in FIGS.
A plating layer 5 of a metal mainly composed of gold, silver, or copper is provided between the lead body 3 made of a magnetic material mainly composed of iron and nickel and the plating layer 4 of a metal mainly composed of rhodium or ruthenium. and a plating layer 4 of a metal containing rhodium or ruthenium as a main component; - A plating layer 6 of a palladium alloy containing palladium as a main component is interposed; Alternatively, the plating layer 4 of a metal containing ruthenium as a main component has a thickness of 0.1 to 5 μm, and the plating layer 6 of a palladium alloy containing palladium as a main component has a thickness of 0.01 to 10 μm. The reed switch has the same configuration as the conventional reed switch described above in FIGS. 1 and 2, except that

Therefore, in the case of the reed switch according to the present invention shown in FIGS. 1 and 3, as well as in the case of the conventional reed switch described above in FIGS.
In B, the metal plating layer 4 mainly composed of rhodium or ruthenium, which is formed on at least the free ends of the lead body 3, is the surface layer of the free ends of the pair of leads 1A and 1B. Acts as the surface layer of the contact.

Then, a metal mainly composed of rhodium or ruthenium is applied to at least the free end of the lead body 3, which acts as such a surface layer and is applied to the pair of leads 1A and 1B. As described above with reference to FIGS. 1 and 2, the plating layer 4 has a higher hardness than the plating m5 made of a metal mainly composed of gold, silver, or copper.

Therefore, the i-ends of the pair of glue leads 1A and 1B, and hence the pair of contacts, have high wear resistance.

Also, a pair of glue dots 1 act as the above-mentioned surface layer.
In A and 1B, the metal plating H4 mainly composed of rhodium or ruthenium applied on at least the free end of the moenide main body 3 is gold or ruthenium, as described above in FIGS. 1 and 2. Metal plating layer 5 whose main component is silver or copper
It has a high ε) melting point compared to .

Therefore, if the switching operation described above in FIGS. 1 and 2 is repeatedly performed with discharge between the free ends of the pair of nodes 1A and 1B, and therefore between the pair of junctions, , even if relatively high temperature heat is generated at the free ends of the pair of glue leads 1A and 1B, and therefore the pair of contacts, the free ends of the pair of glue leads 1A and 1B, and therefore the surfaces of the pair of contacts, will melt. As a result, the materials constituting the surface layer of the roadside portion of the pair of glue sticks 1A and 1B, and the surface layer of the contact point between them, did not transfer to each other. Therefore, the surfaces of the free ends of the pair of glue leads 1A and 1B, and hence the surfaces of the pair of contacts, will not deteriorate.

Therefore, in the case of the reed switch according to the present invention shown in FIGS. 1 and 3, as well as in the case of the conventional reed switch shown in FIGS. The conventional reed switch shown in FIGS. 1 and 2 is different from the conventional reed switch shown in FIGS. Considering a reed switch having the same configuration as the conventional reed switch shown in FIG. It is characterized in that when the free ends of 1B, and thus one contact, come into contact with each other, the contact resistance between them is sufficiently low.

Further, in the case of the reed switch according to the present invention shown in FIGS. 1 and 3, the plating layer 5 of a metal mainly composed of gold, silver, or copper is formed on the pair of leads 1A and 1B as shown in FIGS. 1 and 2. As in the case of the conventional reed switch described above in the figure, it is formed on and in contact with the reed body 3 made of a magnetic material mainly composed of iron and nickel, and is also made of gold, silver or copper. A plating layer 6 of a palladium alloy containing palladium as a main component is formed on and in contact with the plating layer 5 of a metal whose main component is palladium. , has a structure in which a metal plating layer 4 mainly composed of rhodium or ruthenium is formed in contact with this, and “C
, a plating layer 6 of palladium alloy containing palladium as the main component
The plating layer 4 made of a metal mainly composed of rhodium or ruthenium has a high conductivity close to that of the plating layer 5 made of a metal mainly composed of gold, silver, or copper.

Therefore, the reed switch according to the present invention shown in FIGS. 1 and 3 also has the above-mentioned features, as in the case of the conventional reed switch shown in FIGS. 1 and 2.
When the free ends of a pair of glue leads 1A and 1B touch each other and an on state is obtained between the pair of glue leads 1A and 1B, the resistance between the pair of glue leads 1A and 1B is sufficient. It has the characteristic of being low.

In addition, in the reed switch according to the present invention shown in FIGS. 1 and 3, the plating layer 6 of the palladium alloy containing palladium as a main component in the pair of glue leads 1A and 1B is as follows:
Similar to the plating layer 4 of metal mainly composed of rhodium or ruthenium, relatively high temperature heat is generated at the free ends of the pair of adhesives 1A and 1B. The plating layer 5 of the metal as a component is heated, and from the plating layer 5 of the metal mainly composed of gold, silver, or copper, the metal mainly composed of gold, silver, or copper constituting the plating layer 5 is heated. Thermal diffusion t! passes through the plating layer 6 of palladium alloy containing palladium as the main component and onto the surface side of the plating layer 6 of palladium alloy containing palladium as the main component.
/υIt has the property of preventing it no matter what.

Therefore, even if relatively high temperature heat is generated at the free ends of the pair of leads 1A and 1B as described above, the plating layer of metal mainly composed of gold, silver, or copper is applied. 5 is heated, and the metal mainly composed of gold, silver or copper is heated, and the surface of the free end of the pair of glues 1△ and IB, and therefore the surface of the pair of contacts t. Due to the relatively high viscosity of this precipitated gold, silver, or copper-based metal, the metal is mutually transferred between the free ends of the pair of leads 1Δ and 1B, and therefore between the pair of contacts. Therefore, the surfaces of the free end portions of the pair of adhesives 1A and 1B, and therefore the surfaces of the pair of contacts, will not deteriorate.

Therefore, in the case of the reed switch according to the present invention shown in FIGS. 1 and 3, as well as in the case of the conventional reed switch not shown in FIGS. Therefore, the state in which the contact resistance between the pair of contacts is low when they come into contact with each other is maintained over a long period of use, and therefore the resistance between the pair of nodes 1A and 1B is It has the characteristic of maintaining a low level over a long period of use.

However, the present invention shown in FIGS.
In the case of a switch, a plating layer of a palladium alloy containing palladium as a main component is provided between a plating layer 5 of a metal mainly composed of gold, silver, or copper and a plating layer 4 of a metal mainly containing rhodium or ruthenium. 6 is inserted, so
A pair of leads 1A and 1B with a magnetic field of desired strength.
the free end of the , and therefore the pair of contacts are in contact with each other,
That is, in order to set the distance between the lead bodies 3 of the pair of glue leads 1A and 1B to a required value so that the pair of leads 1A and 1B are in the on state, the pair of glue is turned on. In the case of the conventional reed switch described above in FIG. 1 and FIG. When the thickness of the plating layer 4 of a metal mainly composed of rhodium or ruthenium is made thicker, the thickness of the plating layer 4 of a metal mainly composed of rhodium or ruthenium becomes thicker. The thickness of the plating layer 6 made of palladium alloy as a component is reduced by the thickness of the plating layer 6 made of a palladium alloy as a component. I can do it.

On the other hand, even when the plating layer 6 is made of a palladium alloy containing palladium as its main component, even if the thickness thereof is increased, it is more likely to crack than the plating layer 4 made of a metal containing rhodium or ruthenium as its main component.

Therefore, for the above-mentioned reason, even if the thickness of the pair of glue leads 1A and 1B excluding the thickness of the lead body 3 at the free end is increased, the metal plating mainly composed of rhodium or ruthenium will not be applied. Crank due to internal stress is unlikely to occur in the layer 4 or in the plating layer 6 made of a palladium alloy containing palladium as a main component.

Therefore, for the above-mentioned reason, even if the thickness of the pair of leads 1A and 1B excluding the thickness of the lead body 3 at the free ends is increased, the metal plating mainly composed of rhodium or ruthenium will not be applied. Since the layer 4 and the plating layer 6 of palladium alloy containing palladium as a main component can be made crack-free, the pair of adhesives 1 can be used as described above.
Even if relatively high temperature heat is generated at the free ends of A and 1B, the plating layer 5 of a metal mainly composed of gold, silver, or copper will be removed. The metal as a component passes through the plating layer 6 of a palladium alloy mainly composed of palladium and the plating layer 4 of a metal mainly composed of rhodium or ruthenium. The surface, that is, the surface of the free ends of the pair of leads 1A and 1B, J: is deposited on the surface of the pair of contacts, and a metal mainly composed of gold, silver, or copper is deposited on the surface of the free ends of the pair of leads 1A and 1B, and a metal mainly composed of gold, silver, or copper is deposited on the surface of the free ends of the pair of leads 1A and 1B. Compared to the metal whose main component is rhodium or ruthenium, which constitutes the plating layer 4, the metal has higher adhesiveness, so that the adhesive between the free ends of the pair of glue leads 1A and 1B, and therefore It is understood that the particles are mutually transferred between the pair of contacts, and as a result, the surfaces of the free ends of the pair of leads 1A and 1B, and therefore the surfaces of the pair of contacts, deteriorate.
This can be effectively avoided.

Furthermore, as mentioned above, relatively high temperature heat is generated at the free ends of the pair of glueds 1A and 1B, and based on this,
When the plating layer 5 of a metal mainly composed of gold, silver, or copper is heated, the plating layer 5 of a metal mainly composed of gold, silver, or copper is heated. Even though pits are likely to occur in the plating layer 5 made of a metal mainly composed of gold, silver, or copper because it has a lower melting point than the plating layer 4, for the reasons mentioned above, the pair of leads 1A and Even if the thickness excluding the thickness of the lead body 3 at the free end of 1B is increased, as mentioned above, the plating layer 6 of palladium alloy containing palladium as the main component also has rhodium or ruthenium as the main component. Since cracks are unlikely to occur in the plating layer 4 made of metal as a component, the lead body 3 made of a magnetic material mainly composed of iron and nickel is replaced with a plating layer 4 made of a metal mainly composed of gold, silver, or copper. A magnetic material mainly composed of iron and nickel, which has lower electrical conductivity than metals mainly composed of rhodium or ruthenium, is coated with a plating layer 6 of a palladium alloy mainly composed of palladium, and a plated layer 6 of a palladium alloy mainly composed of palladium. Alternatively, the surface of the plating layer 5 of a metal mainly composed of rhodium or ruthenium, and thus the surface of the free end portions of the pair of leads 1A and 1B, and the surface of the pair of contacts through the plating layer 4 of a metal mainly composed of ruanium. Precipitation on the surface can be effectively avoided.

Accordingly, in the case of the reed switch according to the present invention shown in C1 and FIG. Even if the thickness is increased, a pair of glue boards 1A and IB (7)
When the M ends, and therefore the pair of contacts, come into contact with each other, the contact resistance between them becomes high, and accordingly, when an on state is obtained between the pair of leads 1A and 1B,
It is characterized in that it is possible to effectively avoid the drawback that the 3# electrical conductivity between the pair of glues 1A and 1B is reduced.

The above-mentioned features of the present invention are that the metal plating layer 4 mainly composed of rhodium or ruthenium has a thickness of 0.1 to 5 μm, and the plating layer 6 of a palladium alloy mainly containing palladium has a thickness of 0.1 to 5 μm. This can be reliably obtained by having a thickness of 0.01 to 10 μm.

Incidentally, in the conventional reed switch described above in FIGS. 1 and 2, the plating layer 5 of a metal mainly composed of gold, silver, or copper, which falls on each of the leads 1A and 1B, has a thickness of 0.25 μm. In addition, the metal plating layer 4 mainly composed of rhodium or ruthenium has a thickness of 3 μm.
, the cumulative failure rate (%) of the switch operation is obtained as shown by the dotted line in FIG. When an on state is obtained between the pair of leads 1A and 1B, the pair of leads 1A and 1B
While the resistance (Ω) seen between A and 1B was obtained as shown by the dotted line in FIG. 5, in the first embodiment of the reed switch according to the present invention shown in FIGS. When each of the leads 1A and 1B has the specific example described above, the cumulative failure rate of the switch operation with respect to the number of switch operations is obtained as shown by the solid line in FIG. 4,
Also, a pair of leads 1A for the number of switch operations.
When an on state was obtained between the two electrodes 1A and 1B, the resistance seen between the pair of glues 1A and 1B was obtained as shown by the solid line in FIG.

From these facts, it is clear that the reed switch according to the present invention shown in FIGS. 1 and 3 is significantly superior to the conventional reed switch described above in FIGS. 1 and 2. Furthermore, in the case of the reed switch according to the present invention shown in FIGS. 1 and 3, since the plated layer 6 is made of a palladium alloy mainly composed of palladium, the pair of leads 1A and 1'B are Even when the thickness excluding the thickness of the lead body 3 at the free end is increased, the metal plating layer 4 mainly composed of rhodium or ruthenium is
Since there is no need to increase the thickness, a large amount of expensive rhodium or ruthenium-based metal is not required to form the plating layer 4 of rhodium- or ruthenium-based metal.

On the other hand, palladium is mainly composed of palladium.

A palladium alloy whose main component is palladium, which constitutes the plating layer 6 of the alloy, is a metal whose main component is rhodium or ruthenium, which constitutes the plating layer 4, which is a metal whose main component is rhodium or ruthenium. It is relatively inexpensive.

Therefore, in the case of the reed switch according to the present invention shown in FIGS. 1 and 3, the thickness of the pair of leads 1A and 1B excluding the thickness of the lead body 3 at the free end portion is It has characteristics such as being able to be provided at a low price even when it is thick.

Next, a second embodiment of the reed switch according to the present invention will be described.

The second embodiment of the reed switch according to the invention is similar in appearance to the first embodiment of the reed switch according to the invention described above in FIGS. 1 and 3. It has various configurations.

However, in a second embodiment of the reed switch according to the present invention, each of the pair of reed switches 1A and 1B has the configuration described below with reference to FIG.

In FIG. 6, parts corresponding to those in FIG. 3 are designated by the same reference numerals.

As shown in FIG. 6, each of the pair of leads 1Δ and 1B of the reed switch according to the present invention is different from the pair of leads 1A and 1B of the first embodiment of the reed switch according to the present invention described above in FIG. Or, except that the plating layer 4 of metal mainly composed of silver or copper is omitted,
It has the same structure as the pair of leads 1A and 1B of the first embodiment of the reed switch according to the present invention described above with reference to FIG.

The above is the configuration of the second embodiment of the reed switch according to the present invention.

In the reed switch according to the present invention having such a configuration, specific examples of each of the leads 1A and 1B are as follows.

A reed body 3 made of a magnetic material mainly composed of iron and nickel was obtained in the same manner as in the specific example of the first embodiment of the reed switch of the present invention described above in FIGS. 1 and 2. It is something.

Further, a plating layer 6 of a palladium alloy mainly composed of palladium is coated on the lead body 3 made of a magnetic material mainly composed of iron and nickel obtained as described above. CO) and which have the proportions (wt%) shown in Examples 1 to 10 in Table 1, a palladium alloy mainly composed of palladium was prepared as Example 1 in Table 1.
It was obtained by plating to a thickness of ~10 μm. This plating is made of palladium (Pd'') and cobalt (Co), as in the specific example of the first embodiment of the reed switch of the present invention described above in FIGS. 1 and 3.
and in the form of ethylene diamine salt and cobalt sulfate, respectively, at 10 o /L and 0.1 to 1.0 g, respectively.
/L ratio, pH is 3.0 to 3°5, temperature is 5.
Using a liquid adjusted to 5 to 60°C, 0.2 to 2. OA
The current density was /cm'. Furthermore, the plating layer 4 of a metal containing rhodium or ruthenium as a main component is formed by applying a plating layer of rhodium (Rh') on the plating layer 6 of a palladium alloy containing palladium as a main component obtained as described above. Those obtained by plating ruthenium (Ru) to the thicknesses shown in Examples 1 to 4.7 and 8 of Table 1 and to the thicknesses shown in Examples 5.6.9 and 10 of Table 1, respectively. be.

The configuration of the second embodiment of the reed switch according to the present invention has been clarified above.

The reed switch according to the invention shown in FIGS. 1 and 6 is similar to the reed switch according to the invention described above in FIGS. Alternatively, the plating layer 5 of a metal containing copper as a main component and the plating layer 6 of a palladium alloy containing palladium as a main component are replaced with a plating layer 6 of a palladium alloy containing palladium as a main component. There is. Each of the pair of leads 1A and 1B includes a lead body 3 made of a magnetic material mainly composed of iron and nickel;
It has a plating layer 6 of a palladium alloy containing palladium as a main component, which is interposed between a plating layer 4 of a metal containing rhodium or ruthenium as a main component.

Therefore, the reed switch according to the present invention shown in FIGS. 1 and 6 has the same excellent features as the reed switch according to the present invention described above in FIGS. 1 and 3, although detailed explanation is omitted. have

Incidentally, in the conventional reed switch described above in FIGS. 1 and 2, the plating layer 5 of a metal mainly composed of gold, silver, or copper on each of the leads 1A and 1B has a thickness of 0°25 μm. In addition, the metal plating layer 4 mainly composed of rhodium or ruthenium is
In the case of a thickness of μm, the cumulative failure rate (%
) is obtained as shown by the dotted line A in Fig. 7, and the first
In the conventional reed switch described above with reference to FIG. 2 and FIG.
．． It has a thickness of 25 μm and is plated with metal containing rhodium or ruthenium as the main component W! 14 has a thickness of 5 μm, the number of switch operations described above (
The cumulative failure rate (%) of switch operation for the seventh
The results are obtained as shown by the dotted line in the figure, and the relationship between the pair of leads 1A and 1B when the on state is obtained between the pair of leads 1A and 1B with respect to the number of switch operations (times). The resistance (Ω) is J indicated by the dotted line in Figure 8:
In the second embodiment of the reed switch according to the present invention, which is not shown in FIGS. 1 and 6, each of the leads 1A and 1B is as shown in Example 1.1 shown in Table 1 above. 2.5 to 7.9 and 1o, the cumulative failure rate of the switch operation with respect to the number of switch operations is obtained as shown by the solid line in FIG. 7, and is also shown in Table 1 above. In the case of specific examples 2.5 and 10, the resistance seen between the pair of leads 1A and 1B when an on state is obtained between the pair of leads 1A and 1B with respect to the number of switch operations is the 8th The results were obtained as shown by the solid line in the figure.

From these facts, it is clear that the reed switch according to the present invention shown in FIGS. 1 and 6 is significantly superior to the conventional reed switch described above in FIGS. 1 and 2. Will.

Next, a third embodiment of the reed switch according to the present invention will be described.

The third embodiment of the reed switch according to the present invention is similar to the first and second embodiments of the reed switch according to the present invention described above in FIGS. 1 and 3 and FIGS. 1 and 6. Similarly, it has an apparently similar configuration to that described above in FIG.

However, the third embodiment of the reed switch according to the present invention is such that each of the pair of glue leads 1A and 1B has a ninth
It has the configuration described below with accompanying figures.

Each of the pair of leads 1A and 1B of the reed switch according to the invention shown in FIG.
The reed switch according to the present invention described above in FIG. 6, except that in A and 1B, a metal plating layer 4 mainly composed of rhodium or ruthenium is attached only to the free end portions that serve as the contact points. The structure is similar to that of the pair of leads 1A and 1B of the second embodiment.

The above is the configuration of the third embodiment of the reed switch according to the present invention.

In the reed switch according to the present invention having such a configuration, specific examples of each of the leads 1A and 1B are as follows.

A reed body 3 made of a magnetic material mainly composed of iron and nickel was obtained in the same manner as in the specific example of the first embodiment of the reed switch of the present invention described above in FIGS. 1 and 3. It is something.

Further, a plating layer 6 of a palladium alloy mainly composed of palladium is coated on the lead body 3 made of a magnetic material mainly composed of iron and nickel obtained as described above. CO), each of which has the proportions (wt%) shown in Examples 11 to 14 in Table 2, containing palladium as the main component, and the thickness shown in Examples 11 to 14 in Table 2 (μm) It was obtained by plating.

Table 2 Furthermore, a plating layer 6 of a palladium alloy mainly composed of palladium is formed on the lead body 3 made of a magnetic material mainly composed of iron and nickel obtained as described above. , nickel (Ni'), in the proportions (wt%) shown in Examples 15 to 1.6 of Table 3.
These were obtained by plating a palladium alloy containing palladium as a main component to the thickness shown in Examples 15 to 16 in the same table.

Table 3 further shows that a plating layer 6 of a palladium alloy mainly composed of palladium is formed on the lead body 3 made of a magnetic material mainly composed of iron and nickel obtained as described above. and Rudenium (Ru), etc., and these have the proportions (wt%) shown in Examples 17 to 20 of Table 4. μm).

Table 4 In addition, a plating layer 6 of a palladium alloy containing palladium as a main component is formed on the lead body 3 made of a magnetic material containing iron and nickel as a main component obtained as described above. , silver (Ao), and they are
A palladium alloy mainly composed of palladium having the proportions (wt%) shown in Examples 21 to 22 of Table 5 was prepared in Example 2 of the same table.
It was obtained by plating to a thickness of 1 to 22 μm).

Table 5 The plating described above was carried out in accordance with the specific example of the first embodiment of the reed switch of the present invention described above in FIGS. 1 and 3.

Further, a plating layer 4 of a metal mainly composed of rhodium or ruthenium is formed on a plating layer 6 of a palladium alloy mainly composed of palladium obtained as described above.
The plating layer of h) was prepared using Examples 11, 13, and 15 in Tables 2 to 5.
17. Ruthenium (R
U) in Examples 12.14.16.18.2 of Tables 2 to 5.
These were obtained by plating to the thicknesses shown in 0 and 22, respectively.

The configuration of the third embodiment of the reed switch according to the present invention has been clarified above.

A reed switch according to the present invention not shown in FIGS. 1 and 9 is a reed switch according to the present invention described above in FIGS. 1 and 6, except that the plating layer 4 made of metal as the main component is applied only to the free end portions of the pair of leads 1A and 1B that constitute the contact points. It has a similar configuration to the reed switch according to the invention described above in the figures.

Therefore, the reed switch according to the present invention shown in FIGS. 1 and 9 has the same excellent characteristics as the reed switch according to the present invention described above in FIGS. 1 and 3, although detailed explanation is omitted. .

Incidentally, in the conventional reed switch described above in FIGS. 1 and 2, the plating layer 5 of a metal mainly composed of gold, silver, or copper on each of the leads 1A and 1B has a thickness of 0.25 μm. In addition, the metal plating layer 4 mainly composed of rhodium or ruthenium has a thickness of 3 μm.
When the thickness of m is minus 4, the cumulative failure rate (%) of the switch operation with respect to the number of switch operations (times) mentioned above is
) is obtained as shown by the dotted line in FIG. 10, and the first
In the conventional reed switch described above with reference to FIG. 2 and FIG.
When the thickness is 25 μm and the metal plating layer 4 mainly composed of rhodium or ruthenium has a thickness of 6 μm, the number of switch operations (times) is
A pair of leads 1A and IBI! ! ] When the on state is obtained, the resistance (Ω〉) between the pair of glued wires 1A and 1B is obtained as shown by the dotted line in FIG. In a third embodiment of the reed switch according to the invention shown in the figure, leads 1A and 1B thereof
have the above-mentioned specific examples 12.15 and 16, the cumulative failure rate of the switch operation with respect to the number of switch operations is obtained as shown by the solid line in FIG. Pair of leads 1 for the number of operations
The resistance across the pair of leads 1A and 1B when an on state was obtained between leads A and 1B was obtained as shown by the solid line in FIG.

From this fact, it is clear that the reed switch according to the present invention shown in FIGS. 1 and 9 is significantly superior to the conventional reed switch described above in FIGS. 1 and 2. Will.

Next, a fourth embodiment of the reed switch according to the present invention will be described.

The fourth embodiment of the reed switch according to the invention is similar in appearance to the first embodiment of the reed switch according to the invention described above in FIGS. 1 and 3. It has a similar configuration.

However, in a fourth embodiment of the reed switch according to the present invention, each of the pair of reed switches 1A and 1B has the configuration described below with reference to FIG.

In Fig. 12, the same reference numerals are used for parts corresponding to those in Fig. 9.
and show.

Each of the pair of reeds 1A and 1B of the reed switch according to the invention shown in FIG. 12 is made of palladium. Between the plating layer 6 of a palladium alloy containing as a main component and the plating layer 4 of a metal containing rhodium or ruthenium as a main component, a plating layer 6 containing palladium as a main component, similar to the plating layer 6 of a palladium alloy containing palladium as a main component, is provided. The pair of reed switches 1A and 1 of the third embodiment of the reed switch according to the invention described above in FIG.
It has the same configuration as B.

The above is the configuration of the fourth embodiment of the reed switch according to the present invention.

In the reed switch according to the present invention having such a configuration, specific examples of each of the leads 1A and 1B are as follows.

The reed main body 3 made of a magnetic material mainly composed of iron and nickel is obtained in the same manner as in the specific example of the first embodiment of the reed switch of the present invention described above in FIGS. 1 and 3. It is something that was given.

Further, a plating layer 6 of a palladium alloy mainly composed of palladium is coated on the lead body 3 made of a magnetic material mainly composed of iron and nickel obtained as described above. Go >, which were obtained by plating a palladium alloy mainly composed of palladium having a ratio (mold mouth %) of 75:25 to a thickness of 22 μm.

Further, a plating layer 16 of a palladium alloy mainly composed of palladium is formed on the plating layer 6 of a palladium alloy mainly composed of palladium obtained as described above. These are obtained by plating a palladium alloy mainly composed of palladium having a weight ω% ratio of 95:5 to a thickness of 0.2 μm.

Further, the plating layer 4 of a metal containing rhodium or ruthenium as a main component is added to the plating layer 16 of a palladium alloy containing palladium as a main component obtained as described above.
It was obtained by plating a (Rh) plating layer to a thickness of 1.5 μm.

The structure of the fourth embodiment of the Nyorori switch of the present invention has been clarified above.

The reed switch according to the present invention shown in FIGS. 1 and 12 is the reed switch according to the present invention described above in FIGS. A plating layer 16 of a palladium alloy mainly composed of palladium is interposed between a plating layer 6 of a palladium alloy mainly composed of palladium and a plating layer 4 of a metal mainly composed of rhodium or ruthenium. Except for this, it has a similar construction to the reed switch according to the invention described above in FIGS. 1 and 9.

Therefore, the reed switch according to the present invention shown in FIGS. 1 and 12 has the same excellent features as the reed switch according to the present invention described above in FIGS. 1 and 9, although detailed explanation is omitted. has.

Next, a fifth embodiment of the reed switch according to the present invention will be described.

The fifth embodiment of the reed switch according to the invention is similar in appearance to the first embodiment of the reed switch according to the invention described above in FIGS. 1 and 3. It has a similar configuration.

However, in a fifth embodiment of the reed switch according to the present invention, each of the pair of reed switches IA and 1B has the configuration described below with reference to FIG.

In FIG. 13, parts corresponding to those in FIG. 9 are designated by the same reference numerals.

Each of the pair of leads 1A and 1B of the reed switch according to the invention shown in FIG. 13 is made of iron and Between the lead body 3 made of a magnetic material mainly composed of nickel and the plating layer 6 of a palladium alloy mainly composed of palladium, palladium is applied, similar to the plating layer 6 of a palladium alloy mainly composed of palladium. The structure is similar to that of the pair of leads 1A and 1B of the third embodiment of the reed switch according to the present invention described above in FIG. 9, except that a plating layer 26 of palladium alloy as the main component is inserted. Turn right.

The above is the configuration of the second embodiment of the reed switch according to the present invention.

In the reed switch according to the present invention having such a configuration, specific examples of each of the leads 1A and 1B are as follows.

A reed body 3 made of a magnetic material mainly composed of iron and nickel was obtained in the same manner as in the specific example of the first embodiment of the reed switch of the present invention described above in FIGS. 1 and 3. It is something.

Further, a plating layer 26 of a palladium alloy mainly composed of palladium is coated on the lead body 3 made of a magnetic material mainly composed of iron and nickel obtained as described above. 1 to (CO), which were obtained by plating a palladium alloy mainly composed of palladium in a ratio of 95:5 by weight to a thickness of 0.2 μm.

Further, the plating layer 6 of a palladium alloy mainly composed of palladium is formed by plating the lead body 3 made of a magnetic material mainly composed of iron and nickel obtained as described above and the plating layer 6 of a palladium alloy mainly composed of palladium. On the layer 26, a palladium alloy made of palladium (P'd>, cobalt (GO), W=, in a weight percent ratio of 75:25) is plated to a thickness of 2 μm. This is what was obtained.

Further, a plating layer 4 of a metal mainly composed of rhodium or ruthenium is formed on a plating layer 6 of a palladium alloy mainly composed of palladium obtained as described above.
It was obtained by plating the plating layer (h") to a thickness of 1.5 μm.

The configuration of the fifth embodiment of the reed switch according to the present invention has been clarified above.

The reed switch according to the present invention shown in FIGS. 1 and 13 is a reed switch according to the present invention shown in FIGS. At the free screw part of the lead body 3, and
1 and 9 except that a plating layer 2G of a palladium alloy containing palladium as a main component is interposed between a plating layer 6 of a palladium alloy containing palladium as a main component. It has the same configuration as the reed switch according to the present invention described above.

Therefore, the reed switch according to the present invention shown in FIGS. 1 and 13 is similar to the one shown in FIGS.
It has the same excellent features as the single-domain switch according to the invention described above in the figures.

Note that the above description merely shows a few embodiments of the present invention, and various modifications and changes may be made without departing from the spirit of the present invention.

[Brief explanation of drawings]

FIG. 1 is a line sectional view showing the apparent structure of a conventional reed switch and a two-control switch according to the present invention. FIG. 2 is a sectional view showing the free ends of a pair of leads in a conventional reed switch. FIG. 3 is a cross-sectional view showing the free ends of a pair of leads in the first embodiment of the reed switch according to the present invention. FIG. 4 shows the number of switch operations (times) of the first embodiment of the reed switch according to the present invention shown in FIGS. 1 and 3.
FIG. 3 is a diagram showing the relationship between the cumulative defective rate (%) of switch operation and the switch operation. FIG. 5 shows the number of switch operations (times) of the first embodiment of the reed switch according to the present invention shown in FIGS. 1 and 3.
FIG. 3 is a diagram showing the relationship between resistance (Ω) between a pair of leads when the pair of leads are in an on state. FIG. 6 is a cross-sectional view showing the free ends of a pair of leads in a second embodiment of the reed switch according to the present invention. FIG. 7 shows the number of switch operations (times) of the second embodiment of the reed switch according to the present invention shown in FIGS. 1 and 6.
FIG. 3 is a diagram showing the relationship between the cumulative defective rate (%) of switch operation and the switch operation. FIG. 8 shows the on state between a pair of leads with respect to the number of switch operations (times) of the second embodiment of the reed switch according to the present invention shown in FIGS. 1 and 6. This is a microcosm showing the relationship in resistance (Ω) between the pair of leads when FIG. 9 is a linear sectional view showing the free ends of a pair of leads in a third embodiment of the reed switch according to the present invention. FIG. 10 is a line showing the relationship between the cumulative failure rate (%) of switch operations and the number of switch operations (times) for the third embodiment of the reed switch according to the present invention shown in FIGS. 1 and 9. It is a diagram. FIG. 11 shows the number of switch operations (times) of the third embodiment of the reed switch according to the present invention shown in FIGS. 1 and 9 when the pair of leads is in the on state. It is a diagram showing the relationship of resistance (Ω) between the pair of leads. FIG. 12 is a line sectional view showing the free ends of a pair of leads in a fourth embodiment of the reed switch according to the present invention. FIG. 13 is a linear sectional view showing free ends of a pair of leads in a fifth embodiment of the reed switch according to the present invention. IA, IB...Lead 2...Container 3...
・・・・・・・・・・・・Lead body 4・・・・
・・・・・・・・・・・・・・・Metal plating layer 5 mainly composed of rhodium or ruthenium・・・・・・・・・・・・・・・・・・ Gold, silver or copper Plating layer of metal whose main component is 6.1G, 26... Plating layer of palladium alloy whose main component is palladium Applicant Ikuno Seisakusho Co., Ltd. No. 12 Figure 1A 1B 13th round A IB

Claims (1)

[Claims] 1. A pair of lead bodies made of a magnetic material mainly composed of iron and nickel, and at least on the free end thereof, a plating layer of a metal mainly composed of rhodium or ruthenium is attached. In a reed switch having a structure in which at least the free ends of the pair of leads are enclosed in a container with the free ends of the pair of leads closely facing each other, at least one of the pair of leads is , inserted between the lead body made of a magnetic material mainly composed of iron and nickel and the plating layer of a metal mainly composed of rhodium or ruthenium,
The palladium alloy has a plating layer containing palladium as a main component, and the plating layer of a metal containing rhodium or ruthenium as a main component has a thickness of 0.1 to 5 μm, and the palladium alloy mainly contains palladium. The alloy plating layer is 0.0
A reed switch having a thickness of 1 to 10 μm. 2. The reed switch according to claim 1, wherein the plating layer of the palladium alloy containing palladium as a main component is made of an alloy of palladium and cobalt.