JPS59159586A - Metal base printed circuit laminated board and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention The present invention uses a metal plate having perforations as a paste, and a cross-linked polyolefin resin is placed on the surface of the metal plate as an insulating layer necessary for circuit formation, and the resin is filled up to the holes. The present invention relates to a laminate for a metal-based printed circuit, which is made of a metal-based printed circuit and is adhered to a metal foil.

Conventionally, metal paste printed circuit laminates used as hybrid integrated circuit boards and general circuit wiring circuit boards have used aluminum, iron, etc. as the metal paste.
When loading parts onto a tower, there is a drawback that radial parts, axial parts, etc. cannot be mounted as they are because their lead wires come into contact with the metal paste part. For this reason,
In the case of post-processing or pre-processing, in the case of post-processing, after drilling, the part is filled with insulating resin and after it hardens, the hole is drilled again, or in the case of pre-processing, the hole is filled in advance and then the hole is filled with insulating resin. Methods such as pasting a charm on the cloth have been used, but all of these methods were time-consuming and insufficient in terms of quality.

The present invention uses a cross-linked polyolefin resin in the form of a film to fill the holes in a metal plate having perforations with the cross-linked polyolefin resin before cross-linking, and at the same time uses the resin as an insulating layer to form perforations. metal plate, insulation layer,
This solves the drawbacks of the conventional method by integrating metal foil, insulating the hole walls at the same time as molding, and crosslinking and curing.

To explain the present invention in more detail, the type of metal plate used is not limited, and examples include iron, aluminum,
Zinc, brass, galvanized iron, etc. can be used, but the thickness of the metal plate must be less than 2m+n. The holes in the metal plate can be made by punching, drilling, or other methods, but the diameter of the holes must be up to 3.0 mm. It is preferable to remove it by the following method. More preferably, the periphery of the hole is tapered or arcuated at an angle of 30 to 60 degrees with respect to the horizontal plane of the metal plate.

The insulating layer is a film with a thickness of 150μ or less, preferably 50 to 150μ, with a total thickness of 300μ to obtain uniform electrical characteristics.
One of the features is that two or more films are overlaid so that the thickness is less than μ, preferably 100 to 200μ, and by overlapping thin films in this way, pinholes are prevented and the insulation layer is Because it is balanced,
It is characterized by the ability to obtain uniform electrical characteristics.

In this case, if the total thickness of the insulating layer is 300 μm or more, there is a tendency for unevenness to occur on the circuit due to external pressure sometimes applied during soldering.

Furthermore, the cross-linked polyolefin resin that forms the insulating layer is a cross-linked one such as an ethylene-vinyl acetate copolymer/incyanate cross-linking aid composition, which provides strong adhesive strength and excellent electrical properties. In addition, during the bonding process, the flow of the resin before crosslinking fills the υ perforations with the resin, and after that, the crosslinking reaction is completed, resulting in strong adhesion and excellent adhesive strength even inside the holes. It is possible to obtain good electrical characteristics.

Examples of the metal foil used include copper foil, aluminum foil, iron foil, and copper-plated iron foil, but not only electrolytic foil but also rolled foil can be used as the copper foil. in this case,
This configuration can be applied to one or both sides.
Therefore, the characteristics of the metal-based printed circuit laminate obtained by the method of the present invention are that there are no pinholes in the insulating layer because two or more thin films are stacked together, and the thickness is uniform, which improves electrical properties. In particular, it is possible to obtain uniformity of withstand voltage, which is affected by the thickness of the insulating layer.

Furthermore, another feature a is that the cross-linked polyolefin resin is filled in the perforations made in the metal plate at the same time as the lamination before cross-linking, and after that, in order to cross-link, the insides of the holes are insulated by the filled resin. , and has strong adhesive strength.

Another feature is that cross-linked polyolefin resin is used as the insulating layer, so it has good heat resistance, so it does not swell or peel when exposed to heat during the processing process, and soldering when mounting the parts can be done during the process. is also highly commendable. In addition, it is stable against acids and alkaline chemicals, so it can maintain strong adhesive strength and high electrical properties without any deterioration of properties even when treated during the processing process. It is in.

Other features include the fact that no reinforcing material is used in the insulating layer, and since it has elongation properties even after crosslinking, the integrated laminate can be bent and bent.

The manufacturing method takes advantage of the fact that the melting point of crosslinked polyolefin resin is low before crosslinking, and short-time bonding is possible, so in addition to press molding, roll molding, double belt molding, etc. can be used. However, it is desirable to apply a pressure of 10 edges/- or more to fill the perforated portion with the resin. It is also possible to further perform heating after-baking after the bonding and integration to complete the crosslinking reaction. Further, as for the heating method, in addition to steam heating and electric heating, methods using high frequency heating and the like are also possible.

In the metal-based printed circuit laminate manufactured according to the example of the present invention, the perforations of the metal plate are filled with an insulating layer, making it possible to attach parts with lead wires, thereby expanding the range of use. It is something. Furthermore, it has excellent heat dissipation, dimensional stability, heat resistance, adhesiveness, and electrical properties.
- It has a wide range of uses as a membrane circuit wiring board and a hybrid integrated circuit board.

Examples are shown below.

Example 1 Thickness: 1.6 mm with drilled holes of diameter 1.0 mm
An iron plate is degreased with Triclean, and a cross-linked polyolefin resin (Takemelt C!-251 manufactured by Takeda Pharmaceutical @) is placed on top of it.
) Three sheets of ■μ film and Aμ electrolytic copper foil were stacked together and press-molded at 170°C with a pressure of 30Ky/- during addition to obtain a metal-based printed circuit board in which the perforations were filled with the resin. Ta.

Example 2 Thickness 0.6 mm with drilled holes 3.0 diameter
The iron plate was degreased with trichlorene, and three cross-linked polyolefin resin films and 35μ electrolytic copper foil were stacked on top of it, and press molding was performed at 170°C for 3 minutes at a pressure of 30 and 9/d to form perforations. A metal paste printed circuit board was obtained in which the resin was filled to the inside.

Example 3 Two μ films of cross-linked polyolefin resin were laminated with 35μ electrolytic steel foil on top and bottom of an 8% thick aluminum plate having holes with a diameter of 2.0 mm. 1
Press molding was performed at a pressure of 50 K9/d during an addition period at 60°C, followed by after-baking at 160°C for 40 minutes to obtain a metal paste printed circuit board in which the perforations were filled with the resin.

Example 4 A layer of cross-linked polyolefin resin was placed on the top and bottom of an aluminum plate with a thickness of 1.2 mm and having holes with a diameter of 2.0 mm.
Layer 3 sheets of 00μ film with Aμ electrolytic foil at 180mm
Press molding was carried out at a pressure of 50 Kg/- during addition at ℃,
A metal paste printed circuit board in which the perforations were filled with the resin was obtained.

Next, Table 1 shows the characteristic values of the metal paste printed circuit laminates obtained in these Examples. In all cases, it was confirmed that the perforations were filled with an insulating layer, the adhesive strength was strong, the electrical properties were stable and excellent9, and the properties were excellent in heat resistance and chemical resistance.

[Brief explanation of drawings]

Figure 1 is an explanatory cross-sectional view of the state in which multiple film-like insulating layers are set on both sides, and Figure 2 is an explanatory cross-sectional view of the state after integral molding. foil, 2
is an insulating layer, and 3 is a metal body. Patent applicant: Sumitomo Bakelite Co., Ltd.
Koro: Ko 3 Figure 2

Claims (3)

[Claims] (1) Thickness 1.2 with perforations of diameter 3 or less
A metal paste characterized in that a metal plate having a thickness of 300 μm or less and a conductive metal foil are bonded to each other through a crosslinked polyolefin resin insulating layer having a thickness of 300 μm or less, and the resin fills the pores. Single-sided or double-sided printed circuit laminates. (2) When attaching a metal plate with a thickness of 1.2 or less and a conductive metal foil having perforations with a diameter of 3 or less, a thickness of insulating crosslinked polyolefin resin is inserted between them. A metal paste single-sided or double-sided printed circuit characterized by sandwiching two or more films of 150 μm or less to have a total thickness of 300 μm or less and integrating the resin so as to fill the hole. A method for producing a laminate for use. (3) The metal-pasted single-sided or double-sided printed circuit laminate according to claim 1 or 2), wherein the conductive metal foil is aluminum foil, copper foil, iron foil, or copper-plated iron foil, or the laminated board thereof. Production method.