JPS59156573A - Soldering method - Google Patents

Abstract

PURPOSE:To prevent sticking of a flux at the contact point of a relay and to prevent the defective contact of the contact point by dipping a relay body in a liquid on which a flux is floated, and projecting terminals from the liquid surface thereby soldering the terminals. CONSTITUTION:A relay body 1 having terminals 2 on one side is put in a vessel 3 having about the depth at which the terminals 2 project from the top edge and the body 1 can be thoroughly dipped and after water 4 is filled in the vessel 3, the terminals 2 projecting from the water surface are stuck thereon with solder 5. The solder flux generated in the stage of soldering does not dissolve in the water 4 and since the flux has roughly the same specific gravity as the specific gravity of the water 4, the flux floats like oil on the water surface owing partly to the surface tension of the water. The water 4 is then poured into the vessel 3 so that the top surface of the water 4 contg. the floating flux overflows from the edge of the vessel 3. The floating flux is thus removed. The relay body 1 is removed from the inside of the water.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for soldering relays and the like.

[Background technology]

When soldering a relay terminal 1, a conductive wire is usually applied to the terminal and soldering is performed in air using a soldering iron. Furthermore, when applying solder to the terminals during the process, the soldering process was performed in air.

However, there is a problem in that soldering sometimes generates a large amount of solder flux as gas, which adheres to the contacts and other parts of the relay. Usually, the relay is cleaned after soldering. However, the flux components are often not sufficiently removed from the contacts, resulting in contact failure.

[Purpose of the invention]

An object of the present invention is to provide a soldering method that prevents solder flux from adhering to contacts and the like when soldering the ends of a relay.

[Disclosure of the invention]

The soldering method of this invention uses a liquid (such as water) that does not dissolve the solder flux but suspends the flux on the liquid surface.
After immersing the relay body in the liquid and letting the terminals attached to the relay body protrude above the liquid surface, soldering the terminals, and removing the fuwax floating on the liquid, The method includes the step of taking out the tray body from the liquid.

The component in the solder flux that particularly causes contact failure is abietic acid, and by using a liquid that does not dissolve this abietic acid and makes it float on the liquid surface, solder flux can be applied to the contacts of the relay body in the liquid. can be prevented from adhering.

Water is the most suitable such liquid.

An embodiment of the present invention will be described with reference to the drawings (N to C1). In the drawings, 1 is a relay main body, and this relay main body 1 has a terminal 2 on one side.

This relay main body 1 is placed in a container 3 whose terminal 2 protrudes from the upper edge and has a depth sufficient to immerse the main body 1, and after filling the container 3 to the full with water 4, Solder 5 is attached to the protruding terminal 2 (see drawings (N and Q3)).

The solder wax generated during soldering does not dissolve in water 4, and has almost the same specific gravity as water 4, so it floats as an oil on the water surface due to the surface tension of the water.

Next, as shown in the drawing (C1), water 4 is poured into the container 3, and the upper surface of the water 4 on which the fuwax is floating overflows from the edge of the container 3 to remove the floating fuwax.

Ru. After removing the fuwax, the relay main body 1 is removed from the water.

The amount of abietic acid adhering to the contacts of the relay soldered by this method (Example) and the conventional relay soldered in air (Comparative Examples 1 and 2) was investigated by mass spectrometry. The results are shown in the table below.

In Comparative Example 1, a cover was soldered to the relay body without being attached, and in Comparative Example 2, a cover was attached and soldered without being sealed.

In addition, when the soldered relays of Comparative Examples 1 and 2 are used without cleaning, the contact resistance is 1Ω after opening and closing approximately 400,000 times.
There was one piece that was defective. On the other hand, in the example, the relay did not cause contact failure.

〔Effect of the invention〕

According to this invention, solder flux does not adhere to the contacts of the relay, and the occurrence of poor contact at the contacts can be prevented.

[Brief explanation of the drawing]

Drawings (AI to FCL are explanatory diagrams of one embodiment of the present invention. 1... Relay body, 2... Terminal, 4... Water, 5...
・Solder 4

Claims (1)

[Claims] (1) The process of immersing the relay body in a liquid that does not dissolve the solder flux and making it float on the flags t-i surface, and causing the terminal attached to the relay body to protrude from the liquid surface, and soldering the terminal. After removing the flux floating on the liquid. A soldering method including the step of removing the relay body from a liquid. (2) The soldering method according to claim (1), wherein the liquid is water.