JPS5915497Y2 - Radiator for semiconductor devices - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a radiator for semiconductor elements such as integrated circuit ICs and transistors.

As shown in FIG. 1, a conventional radiator for semiconductor devices is constructed by providing a semiconductor device insertion portion 1, a slotted portion 2, and a heat radiation portion 3 in a heat radiation material such as metal.

To hold semiconductor elements such as ICs and transistors,
The insertion portion 1 is provided with a strong spring force.

Therefore, when inserting a semiconductor element into this insertion section 1,
It is necessary to push open the slotted portion 2 using a tool or the like and insert it.

Therefore, in various testing and aging processes for ICs, transistors, etc., the above-mentioned conventional radiator has problems in that it damages these elements when they are attached and detached, and that it takes time to attach and detach them.

An object of the present invention is to solve such problems and provide a radiator for a semiconductor device that is easy to attach and detach without impairing the adhesion to the semiconductor device and has excellent workability.

According to the present invention, a heat dissipation member is constructed by combining a heat dissipation member divided into two in the axial direction with a rod-shaped support member sandwiched between them, and a ring-shaped spring member that presses a semiconductor element inserted into the heat dissipation member. A radiator for semiconductor devices attached to the axial end is obtained.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a side view showing an embodiment of the present invention.

The heat dissipating parts 4 and 4', which are divided into two in the axial direction, are combined with a fulcrum bar 5 sandwiched therebetween.

This combined heat dissipation section 4 and 4' has an axial end (
The bottom part) is pressed by a ring spring 6, and is in the state shown in Fig. 2 when not in use.

When inserting a semiconductor device such as an IC or a transistor into the insertion section 11, press the ends (heads) of the heat dissipation sections 4 and 4' opposite to the ring spring 6 from the outside, and press the fulcrum bar as shown in FIG. Open the insertion section 11 using 5 as a fulcrum.

In this state, the semiconductor element 7 is inserted from the direction of the arrow and the pressing force of the heads of the heat radiating parts 4 and 4' is released, so that the element 7 is held by the spring force of the ring spring 6.

The spring force of the ring spring 6 is selected to be an appropriate magnitude to maintain good adhesion between the element 7 and the heat radiation parts 4 and 4'.

In addition, the ring spring 6 is fixed to the heat radiating parts 4 and 4' by falling into the heat radiating grooves of the heat radiating parts 4 and 4' to the extent that the outer diameter of the ring spring 6 is divided by the outer diameter of the ring spring 6.
and 4' to prevent misalignment.

When the semiconductor element 7 is inserted and held in the insertion portion 11, the heat radiating portions 4 and 4' are opened in parallel due to the action of the fulcrum bar 5 and the spring 6, as shown in FIG.

The fulcrum bar 5 has a wire diameter smaller than the width of the heat radiation grooves of the heat radiation parts 4 and 4', and has a bent shape at both ends as shown in FIG. By being locked in the groove, they are prevented from coming off from the heat radiating parts 4 and 4'.

FIG. 6 is a perspective view showing another embodiment of the present invention.

The heat dissipating sections shown in FIGS. 2 to 4 have heat dissipating grooves cut in the horizontal direction, but the heat dissipating sections 24 and 24' shown in FIG. 6 have heat dissipating grooves cut in the vertical direction.

The basic movements of the fulcrum bar 25 and the ring spring 26 are as follows:
Although they are the same as the fulcrum bar 5 and the spring 6 explained in FIGS. 5 to 5, they cannot be locked in the heat radiation groove, so it is impossible to prevent displacement.

As described above, according to the present invention, a radiator for semiconductor devices can be obtained that has excellent workability in attaching and detaching semiconductor devices such as ICs and transistors, and does not damage the semiconductor devices.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a conventional radiator, FIG. 2 is a side view showing an embodiment of the present invention, FIG. 3 is a state diagram of the radiator shown in FIG. 2 when a semiconductor element is inserted, and FIG. 2 is a perspective view of the radiator in use, FIG. 5 is a perspective view of the fulcrum bar of FIG. 2, and FIG. 6 is a perspective view of another embodiment of the present invention. In the figure, 1, 11... insertion section, 2...
・・Suriwari part, 3.4.4′, 24.24′・・・・
・・Heat dissipation part, 5, 25 ・・Fulcrum bar, 6゜26
. . . Ring spring, 7 . . . Semiconductor element.

Claims (1)

[Scope of utility model registration request] A heat dissipation member split in two in the axial direction is assembled with a rod-shaped fulcrum member sandwiched between them, and a ring-shaped spring member that presses a semiconductor element inserted into the heat dissipation member is attached to the axial end of the combined heat dissipation member. A radiator for semiconductor devices characterized by being attached.