JPS59153B2 - Cooling structure for electronic equipment - Google Patents
Cooling structure for electronic equipmentInfo
- Publication number
- JPS59153B2 JPS59153B2 JP6890678A JP6890678A JPS59153B2 JP S59153 B2 JPS59153 B2 JP S59153B2 JP 6890678 A JP6890678 A JP 6890678A JP 6890678 A JP6890678 A JP 6890678A JP S59153 B2 JPS59153 B2 JP S59153B2
- Authority
- JP
- Japan
- Prior art keywords
- air
- air outlet
- electronic
- cooling structure
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【発明の詳細な説明】
本発明は、電子式自動電話交換機や電子計算機等の電子
装置を効率よく冷却するための構造に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a structure for efficiently cooling electronic devices such as electronic automatic telephone exchanges and electronic computers.
近年、電子計算機等に代表される各種電子装置は、その
小形化が著しく促進されており、この装置内部に収納さ
れる電子部品の密度も非常に高いものとなつて来ている
。2. Description of the Related Art In recent years, the miniaturization of various electronic devices, typified by computers and the like, has been significantly promoted, and the density of electronic components housed inside these devices has also become extremely high.
従つて、これら電子部品の放熱を効率良く行なつてその
発熱に伴う性能低下を防止することが重要な課題の一つ
となつている。ところが、従来の電子装置は単なる空気
導入口と空気排出口とがその上下両端部の前面や或いは
後面に設けられているにすぎず、しかも高密度化した装
置内では空気の流通が効率良く行なわれにくかつたため
、電子部品の発熱により高温化したこの電子部品の周囲
の空気が装置内によどみやすく、従つて装置内を充分に
冷却することができなかつた。Therefore, one of the important issues is to efficiently dissipate heat from these electronic components and prevent performance deterioration due to heat generation. However, conventional electronic devices simply have an air inlet and an air outlet located on the front or rear side of both upper and lower ends, and air circulation cannot be performed efficiently within the highly dense device. As a result, the air surrounding the electronic components, which has become hot due to the heat generated by the electronic components, tends to stagnate inside the device, making it impossible to sufficiently cool the inside of the device.
本発明は、このような従来の電子装置における冷却機構
の欠点を解決し、何ら動力を使用せずに装置内の空気の
流通を良くすることによつてその冷却効率を向上させ得
る冷却構造を提供することを目的とするもので、その構
成は、それぞれ多数の電子部品が取り付けられた多数の
搭載基板を収納する電子装置の下端部に空気導入口を設
け、更にこの電子装置の上端部に前記空気導入口から導
入されて前記搭載基板の間を通過する際に前記電子部品
の冷却を行なう空気を排出する空気排出口を設ける一方
、、この空気排出口から上方に延びる排気ダクトを当該
空気排出口に接続したことを特徴とするものである。The present invention solves the drawbacks of the cooling mechanism in conventional electronic devices, and provides a cooling structure that can improve the cooling efficiency of the device by improving air circulation within the device without using any power. The purpose of this system is to provide an air inlet at the bottom end of an electronic device that houses a large number of mounting boards each having a large number of electronic components attached thereto, and an air inlet at the top end of the electronic device. An air outlet is provided for discharging the air that is introduced from the air inlet and cools the electronic components when passing between the mounting boards, while an exhaust duct extending upward from the air outlet is used to discharge the air. It is characterized by being connected to an outlet.
以下、本発明による電子装置の冷却構造の一実施例を第
1図及び第2図を参照しながら詳細に説明する。Hereinafter, one embodiment of a cooling structure for an electronic device according to the present invention will be described in detail with reference to FIGS. 1 and 2.
本実施例の正面を表わす第1図a及ひその右側面の断面
構造を表わす第1図bに示すように、それぞれ多数の電
子部品1が取り付けられた多数の搭載基板2は、装置本
体3内に整列状態で収納されている。As shown in FIG. 1a showing the front view of this embodiment and FIG. They are stored in a row inside.
この装置本体3の下端部の前面には、装置本体3内に冷
却用の空気を導入する空気導入口4が形成されており、
この空気導入口4内には、搭載基板2全体にむらなく冷
却用の空気が行き渡るように傾斜した下部対流誘導板5
が固定されている。又、装置本体3の上端部の後面には
、空気導入口4から導入されて搭載基板2の間を通過す
る空気を排出する空気排出口6が形成されており、この
空気排出口6内には、装置本体3内の空気排出口6へ速
やかに導く前記下部対流誘導板5同様の上部対流誘導板
7が固定されている。更に、この空気排出口6には、空
気排出口6から排出される空気を垂直土方へ導く排気ダ
クト8の下端部が接続しており、従つて空気導入口4か
ら装置本体3内に導人された空気は、第1図b中、二点
鎖線の矢印で示すように空気排出口6から排気ダクト8
内を通つてその上端に形成された開口部9から大気中に
放散される。なお、本実施例では空気導入口4を装置本
体3の下端部の前面に形成すると共に空気排出口6を装
置本体3の上端部の後面に形成したが、元来、電子装置
には前後の区別がないものが多く、通路側を前面とする
ことが一般である。An air inlet 4 for introducing cooling air into the device main body 3 is formed on the front surface of the lower end of the device main body 3.
Inside this air inlet 4, there is a lower convection guide plate 5 which is inclined so that cooling air can evenly spread over the entire mounting board 2.
is fixed. Further, an air exhaust port 6 is formed on the rear surface of the upper end of the device main body 3 for discharging the air introduced from the air introduction port 4 and passing between the mounting boards 2. An upper convection guide plate 7 similar to the lower convection guide plate 5 is fixed thereto, which quickly guides air to the air outlet 6 in the main body 3 of the apparatus. Furthermore, this air outlet 6 is connected to the lower end of an exhaust duct 8 that guides the air discharged from the air outlet 6 vertically. The released air flows from the air outlet 6 to the exhaust duct 8 as shown by the two-dot chain arrow in FIG. 1b.
It passes through the inside and is emitted into the atmosphere from an opening 9 formed at its upper end. In this embodiment, the air inlet 4 is formed on the front surface of the lower end of the device main body 3, and the air outlet 6 is formed on the rear surface of the upper end of the device main body 3. In many cases, there is no distinction, and the aisle side is generally the front side.
しかし、空気導入口4を装置本体3の下端部の後面に形
成したり、空気排出口6を装置本体3の土端部の前面に
形成したりすることも当然可能であり、要するに従来の
ものと同様に空気導入口4は装置本体3の下端部にあれ
ば良く、又、空気排出口6は装置本体3の土端部にあり
さえすれば良い。装置本体3内の搭載基板2に支持され
た電子部品1が発熱すると、搭載基板2の間に位置する
空気が暖められて膨張し、その比重量が小さくなるため
これが浮力を受けて空気排出口6から排気ダクト8へと
流れてゆくが、この空気の流れに伴つて空気導入口4か
ら装置本体3内へ大気中の新たな空気が導入されるため
、搭載基板・2の間には新鮮な空気が介在することとな
り、これが電子部品1から発せられる熱を吸収し、再び
浮力を受けて空気排出口6から排気ダクト8へと流れて
ゆく。However, it is naturally possible to form the air inlet 4 on the rear surface of the lower end of the device main body 3, and to form the air outlet 6 on the front surface of the soil end of the device main body 3. In short, the conventional method Similarly, the air inlet 4 only needs to be located at the lower end of the device main body 3, and the air outlet 6 only needs to be located at the bottom end of the device main body 3. When the electronic component 1 supported by the mounting board 2 in the device main body 3 generates heat, the air located between the mounting boards 2 is warmed and expands, and its specific weight decreases, causing it to receive buoyancy and close the air outlet. 6 to the exhaust duct 8, but with this air flow, new air from the atmosphere is introduced from the air inlet 4 into the device main body 3, so there is fresh air between the mounting board 2. The air absorbs the heat emitted from the electronic component 1 and flows from the air outlet 6 to the exhaust duct 8 under the influence of buoyancy.
このようにして大気中の空気と電子部品1との間で熱交
換力相動的に行なわれてゆくが、電子部品1の発熱によ
り暖められる装置本体3内に位置す空気が受ける浮力は
、搭載基板2の下端部から排気ダクト8の上端の開口部
9までの高さに比例するため、従来のように排気ダクト
8を全く設けない場合と比較すると、排気ダクト8の長
さによつても異なるが図示実施例の場合では二倍以上に
することができるため、搭載基板.2の間を通過土昇す
る空気の流速も}よそ二倍以上となり、電子部品1の空
冷効率を大幅に向上させることができるO第2図はその
比較の一例を示すもので、搭載基板の消費電力と温度と
の関係を表わし、破線が従来のもので実線が本発明によ
るものである。In this way, the heat exchange force is mutually performed between the air in the atmosphere and the electronic component 1, but the buoyancy force exerted on the air located inside the device main body 3, which is heated by the heat generated by the electronic component 1, is Since the height is proportional to the height from the lower end of the mounting board 2 to the opening 9 at the upper end of the exhaust duct 8, the length of the exhaust duct 8 is However, in the case of the illustrated embodiment, the mounting board size can be more than doubled. The flow velocity of the air passing through and rising between the parts 2 and 2 is more than double, and the air cooling efficiency of the electronic components 1 can be greatly improved. Figure 2 shows an example of the comparison. The relationship between power consumption and temperature is shown in which the broken line is the conventional one and the solid line is the one according to the present invention.
これからも判るように、本発明によると従来のものより
約10度以上も温度を下げることができ、しかも搭載基
板の消費電力が大きいほどその効果が大きく表われる。
このように本発明の電子装置の冷却構造によると、空気
排出口に接続して装置本体内の空気の浮力を増大する排
気ダクトを設けたので、装置本体内を流れる空気の流速
が増し、電子部品の冷却効率を向上させることが可能で
ある。As can be seen from this, according to the present invention, the temperature can be lowered by about 10 degrees or more compared to the conventional method, and the effect becomes more pronounced as the power consumption of the mounting board increases.
As described above, according to the cooling structure for an electronic device of the present invention, since the exhaust duct is connected to the air outlet and increases the buoyancy of the air inside the device body, the flow velocity of the air flowing inside the device body is increased and the electronic device It is possible to improve the cooling efficiency of parts.
しかも、排気ダクトがない場合には水平に流れる空調用
の空気が空気排出口から逆風となつて流れこみ、装置本
体内の暖められた空気が効率よく排気されなくなる虞れ
があるが、本発明では排気ダクトを設けたことによつて
このような虞れが全くなくなり、逆にこの空調用の空気
の流れを利用して排気ダクト内の空気の排気速度を向上
させ、これが装置本体内の空気の流速を上昇することに
なるため、電子部品の冷却効率を一層高めることが可能
である。Moreover, if there is no exhaust duct, there is a risk that the horizontally flowing air for air conditioning will flow in from the air outlet as a headwind, and the warmed air inside the device body will not be exhausted efficiently. By providing an exhaust duct, this risk is completely eliminated, and conversely, the flow of air for air conditioning is used to increase the exhaust speed of the air in the exhaust duct, which in turn increases the air inside the equipment body. This increases the flow rate of the air, making it possible to further improve the cooling efficiency of electronic components.
第1図aは本発明による電子装置の冷却構造の一実施例
を表わす正面図であり、第1図bはその断面構造を表わ
す右側面図である。FIG. 1a is a front view showing one embodiment of a cooling structure for an electronic device according to the present invention, and FIG. 1b is a right side view showing its cross-sectional structure.
Claims (1)
載基板を収納する電子装置の下端部に空気導入口を設け
、更にこの電子装置の上端部に前記空気導入口から導入
されて前記搭載基板の間を通過する際に前記電子部品の
冷却を行なう空気を排出する空気排出口を設けた電子装
置の冷却構造において、前記空気排出口から上方に延び
る排気ダクトをこの空気排出口に接続したことを特徴と
する電子装置の冷却構造。1. An air inlet is provided at the lower end of an electronic device that accommodates a large number of mounting boards each having a large number of electronic components attached thereto, and the air is introduced from the air inlet into the upper end of the electronic device between the mounting boards. A cooling structure for an electronic device including an air outlet for discharging air that cools the electronic components when passing through the air outlet, characterized in that an exhaust duct extending upward from the air outlet is connected to the air outlet. Cooling structure for electronic equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6890678A JPS59153B2 (en) | 1978-06-09 | 1978-06-09 | Cooling structure for electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6890678A JPS59153B2 (en) | 1978-06-09 | 1978-06-09 | Cooling structure for electronic equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54161060A JPS54161060A (en) | 1979-12-20 |
JPS59153B2 true JPS59153B2 (en) | 1984-01-05 |
Family
ID=13387156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6890678A Expired JPS59153B2 (en) | 1978-06-09 | 1978-06-09 | Cooling structure for electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59153B2 (en) |
-
1978
- 1978-06-09 JP JP6890678A patent/JPS59153B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS54161060A (en) | 1979-12-20 |
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