JPS59153B2 - Cooling structure for electronic equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a structure for efficiently cooling electronic devices such as electronic automatic telephone exchanges and electronic computers.

2. Description of the Related Art In recent years, the miniaturization of various electronic devices, typified by computers and the like, has been significantly promoted, and the density of electronic components housed inside these devices has also become extremely high.

Therefore, one of the important issues is to efficiently dissipate heat from these electronic components and prevent performance deterioration due to heat generation. However, conventional electronic devices simply have an air inlet and an air outlet located on the front or rear side of both upper and lower ends, and air circulation cannot be performed efficiently within the highly dense device. As a result, the air surrounding the electronic components, which has become hot due to the heat generated by the electronic components, tends to stagnate inside the device, making it impossible to sufficiently cool the inside of the device.

The present invention solves the drawbacks of the cooling mechanism in conventional electronic devices, and provides a cooling structure that can improve the cooling efficiency of the device by improving air circulation within the device without using any power. The purpose of this system is to provide an air inlet at the bottom end of an electronic device that houses a large number of mounting boards each having a large number of electronic components attached thereto, and an air inlet at the top end of the electronic device. An air outlet is provided for discharging the air that is introduced from the air inlet and cools the electronic components when passing between the mounting boards, while an exhaust duct extending upward from the air outlet is used to discharge the air. It is characterized by being connected to an outlet.

Hereinafter, one embodiment of a cooling structure for an electronic device according to the present invention will be described in detail with reference to FIGS. 1 and 2.

As shown in FIG. 1a showing the front view of this embodiment and FIG. They are stored in a row inside.

An air inlet 4 for introducing cooling air into the device main body 3 is formed on the front surface of the lower end of the device main body 3.
Inside this air inlet 4, there is a lower convection guide plate 5 which is inclined so that cooling air can evenly spread over the entire mounting board 2.
is fixed. Further, an air exhaust port 6 is formed on the rear surface of the upper end of the device main body 3 for discharging the air introduced from the air introduction port 4 and passing between the mounting boards 2. An upper convection guide plate 7 similar to the lower convection guide plate 5 is fixed thereto, which quickly guides air to the air outlet 6 in the main body 3 of the apparatus. Furthermore, this air outlet 6 is connected to the lower end of an exhaust duct 8 that guides the air discharged from the air outlet 6 vertically. The released air flows from the air outlet 6 to the exhaust duct 8 as shown by the two-dot chain arrow in FIG. 1b.
It passes through the inside and is emitted into the atmosphere from an opening 9 formed at its upper end. In this embodiment, the air inlet 4 is formed on the front surface of the lower end of the device main body 3, and the air outlet 6 is formed on the rear surface of the upper end of the device main body 3. In many cases, there is no distinction, and the aisle side is generally the front side.

However, it is naturally possible to form the air inlet 4 on the rear surface of the lower end of the device main body 3, and to form the air outlet 6 on the front surface of the soil end of the device main body 3. In short, the conventional method Similarly, the air inlet 4 only needs to be located at the lower end of the device main body 3, and the air outlet 6 only needs to be located at the bottom end of the device main body 3. When the electronic component 1 supported by the mounting board 2 in the device main body 3 generates heat, the air located between the mounting boards 2 is warmed and expands, and its specific weight decreases, causing it to receive buoyancy and close the air outlet. 6 to the exhaust duct 8, but with this air flow, new air from the atmosphere is introduced from the air inlet 4 into the device main body 3, so there is fresh air between the mounting board 2. The air absorbs the heat emitted from the electronic component 1 and flows from the air outlet 6 to the exhaust duct 8 under the influence of buoyancy.

In this way, the heat exchange force is mutually performed between the air in the atmosphere and the electronic component 1, but the buoyancy force exerted on the air located inside the device main body 3, which is heated by the heat generated by the electronic component 1, is Since the height is proportional to the height from the lower end of the mounting board 2 to the opening 9 at the upper end of the exhaust duct 8, the length of the exhaust duct 8 is However, in the case of the illustrated embodiment, the mounting board size can be more than doubled. The flow velocity of the air passing through and rising between the parts 2 and 2 is more than double, and the air cooling efficiency of the electronic components 1 can be greatly improved. Figure 2 shows an example of the comparison. The relationship between power consumption and temperature is shown in which the broken line is the conventional one and the solid line is the one according to the present invention.

As can be seen from this, according to the present invention, the temperature can be lowered by about 10 degrees or more compared to the conventional method, and the effect becomes more pronounced as the power consumption of the mounting board increases.
As described above, according to the cooling structure for an electronic device of the present invention, since the exhaust duct is connected to the air outlet and increases the buoyancy of the air inside the device body, the flow velocity of the air flowing inside the device body is increased and the electronic device It is possible to improve the cooling efficiency of parts.

Moreover, if there is no exhaust duct, there is a risk that the horizontally flowing air for air conditioning will flow in from the air outlet as a headwind, and the warmed air inside the device body will not be exhausted efficiently. By providing an exhaust duct, this risk is completely eliminated, and conversely, the flow of air for air conditioning is used to increase the exhaust speed of the air in the exhaust duct, which in turn increases the air inside the equipment body. This increases the flow rate of the air, making it possible to further improve the cooling efficiency of electronic components.

[Brief explanation of drawings]

FIG. 1a is a front view showing one embodiment of a cooling structure for an electronic device according to the present invention, and FIG. 1b is a right side view showing its cross-sectional structure.

Claims (1)

[Claims] 1. An air inlet is provided at the lower end of an electronic device that accommodates a large number of mounting boards each having a large number of electronic components attached thereto, and the air is introduced from the air inlet into the upper end of the electronic device between the mounting boards. A cooling structure for an electronic device including an air outlet for discharging air that cools the electronic components when passing through the air outlet, characterized in that an exhaust duct extending upward from the air outlet is connected to the air outlet. Cooling structure for electronic equipment.