JPS59153098A - Heat exchanger - Google Patents
Heat exchangerInfo
- Publication number
- JPS59153098A JPS59153098A JP2792483A JP2792483A JPS59153098A JP S59153098 A JPS59153098 A JP S59153098A JP 2792483 A JP2792483 A JP 2792483A JP 2792483 A JP2792483 A JP 2792483A JP S59153098 A JPS59153098 A JP S59153098A
- Authority
- JP
- Japan
- Prior art keywords
- coating layer
- heat transfer
- plating layer
- copper
- organic binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は温水器、湯沸器などに使用され、銅製伝熱部材
を有する熱交換器に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a heat exchanger used in water heaters, water heaters, etc., and having a copper heat transfer member.
従来例の構成とその問題点
従来より、この種の熱交換器の伝熱部材は加工性、熱伝
導性が良好で、かつ一般の水道水に対して耐食的である
銅を用いることが多い。しかし地下水のようにＰＨ（水
素イオン濃度）が７以下で２ ｌ−〕′
遊離炭酸（水中に溶解した炭酸ガス）や塩素イオン、硝
酸イオンが多量に存在する水質環境下では銅が腐食され
、腐食によって溶出した銅イオンが石けんなどの脂肪酸
塩と反応し、青色の銅錯塩を形成する。その結果熱交換
を通過した水が銅錯塩によって青く発色したり、風呂等
で使用するタオルにそれが吸着し、タオルが青く変色す
るなどの問題が発生しており、この問題を解決するため
に前記銅製伝熱部材表面に、ニッケル、スズなどの金属
メッキ層や有機系、無機系バインダーのコーティング層
を形成するなどの表面処理を施す手段がとられてきた。Conventional structure and its problems Conventionally, the heat transfer members of this type of heat exchanger have often been made of copper, which has good workability and thermal conductivity, and is resistant to corrosion against ordinary tap water. . However, in water environments such as groundwater where the pH (hydrogen ion concentration) is 7 or less and there are large amounts of free carbon dioxide (carbon dioxide gas dissolved in water), chlorine ions, and nitrate ions, copper corrodes. Copper ions eluted by corrosion react with fatty acid salts such as soap, forming blue copper complex salts. As a result, problems such as the water passing through the heat exchange turning blue due to the copper complex salts, and the towels used in baths etc. adsorbing this, causing the towels to turn blue, are occurring. Measures have been taken to perform surface treatment on the surface of the copper heat transfer member, such as forming a metal plating layer of nickel, tin, etc., or a coating layer of an organic or inorganic binder.
しかし、ニッケル、スズなどの金属メッキは、銅よりも
電位的に卑な金属であるから、前述の水質環境下ではメ
ッキ層が短期間で腐食し、メッキ層の剥離、消耗により
、母機である銅が露出し、その結果、銅も腐食するとい
う欠点を有し、また、有機系、無機系バインダーのコー
ティングは、コーティング層自身に多数のピンホールが
存在するため、ピンホールを介して銅が腐食するという
欠３、＋−ジ
点を有し、いずれも短期間で銅が腐食する以」二、前述
の問題解決とはならなかった。However, since metal plating such as nickel and tin is a metal with a lower potential than copper, the plating layer corrodes in a short period of time in the water quality environment mentioned above, and the plating layer peels off and wears out, causing the base metal to deteriorate. The disadvantage is that the copper is exposed and as a result, the copper is also corroded.Also, coatings using organic and inorganic binders have many pinholes in the coating layer itself, so the copper may be corroded through the pinholes. The above-mentioned problem could not be solved because copper had corrosion points in both cases, and the copper corroded in a short period of time.
発明の目的
本発明はかかる従来の欠点を解消するもので、長期にわ
たり、銅製伝熱部材を有する熱交換器の腐食を防止し、
機器としての耐久性、信頼性の向上を図ることを目的と
する。OBJECTS OF THE INVENTION The present invention overcomes the drawbacks of the prior art and provides long-term protection against corrosion of heat exchangers having copper heat transfer members.
The purpose is to improve the durability and reliability of the device.
発明の構成
本発明は銅製伝熱部材の表面に、有機系バインダーと標
準電極電位がｏＶ（零ボルト）以下の金属粉末を主成分
とするコーティング層あるいは標準電極電位が○■以下
の金属を主成分とするメッキ層を形成し、さらにこの表
面に有機系バインダーからなるコーティング層を形成し
たものである。Structure of the Invention The present invention provides a coating layer on the surface of a copper heat transfer member, the main components of which are an organic binder and a metal powder with a standard electrode potential of oV (zero volts) or less, or a coating layer containing a metal with a standard electrode potential of ○■ or less. A plating layer is formed as a component, and a coating layer made of an organic binder is further formed on the surface of this plating layer.
この構成により、地下水のような水質の悪い環境下で使
用されても銅製伝熱部材の腐食を著しく抑制することが
でき、腐食によって発生する水やタオルの青色化を防止
することができる。With this configuration, even if the copper heat transfer member is used in an environment with poor water quality such as groundwater, corrosion of the copper heat transfer member can be significantly suppressed, and water and towels can be prevented from turning blue due to corrosion.
実施例の説明
以下本発明の実施例について、図面に基づいて説明する
。DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described based on the drawings.
第１図、第２図は本発明の第１および第２の実施例を示
す熱交換器の一部断面図である。図において、１は銅製
伝熱部材であり、この水制の表面に有機系バインダー５
と標準電極電位がｏＶ以下の金属粉末６を主成分とする
コーティング層２（第１図）あるいは標準電極電位がＯ
Ｖ以下の金属を主成分とするメッキ層３（第２図）が形
成され、さらにこのコーティング層２あるいはメッキ層
３の表面に有機系バインダーからなるコーティング層４
が形成される。1 and 2 are partial sectional views of heat exchangers showing first and second embodiments of the present invention. In the figure, 1 is a copper heat transfer member, and an organic binder 5 is coated on the surface of this water pipe.
A coating layer 2 (Fig. 1) mainly composed of metal powder 6 whose standard electrode potential is oV or less or a coating layer 2 whose standard electrode potential is OV or less
A plating layer 3 (Fig. 2) whose main component is a metal of V or less is formed, and a coating layer 4 made of an organic binder is further formed on the surface of this coating layer 2 or plating layer 3.
is formed.
上記構成において、コーティング層４とコーティング層
２あるいはメッキ層３の存在により、地下水などに多量
に存在する腐食因子の銅製伝熱部材１への侵入は大部分
阻止されるが、これらいずれの層もピンホールを完全に
除去することは不可能であるために、このピンホールを
介しての前記腐食因子の侵入はさけられない。In the above configuration, the presence of the coating layer 4 and the coating layer 2 or the plating layer 3 prevents most of the corrosive factors that exist in large quantities in groundwater etc. from entering the copper heat transfer member 1, but any of these layers Since it is impossible to completely remove pinholes, intrusion of the corrosion factors through these pinholes is unavoidable.
しかし、コーティング層４を通過した前記腐食因子はコ
ーティング層２に存在する金属粉末６あ５／・−ジ
るいはメッキ層３の標準電極電位がｏＶ以下であり、母
機である銅製伝熱部材１よりも電位的に卑であるのでコ
ーティング層２あるいはメッキ層３にピンホールがあっ
ても選択的に金属粉末６あるいはメッキ層３が腐食反応
を起こし、前記腐食因子がこのコーティング層２あるい
はメッキ層３で消費されることになり、銅製伝熱部材１
の腐食は防止され、銅イオンとして水中に溶出してくる
ことはなくなる。また、コーティング層４が存在するた
めにとのコーティング層４を通過してくる前記腐食因子
の量はわずかなものであるから、コーティング層２に存
在する金属粉末６あるいはメッキ層３の腐食による損失
はわずかなものであり、長期に渡り、銅製伝熱部材１の
腐食および水中への銅イオンの溶出を防止することがで
きる。However, the corrosion factors that have passed through the coating layer 4 are present in the coating layer 2 due to the metal powder 6A5/... - dilue, or the standard electrode potential of the plating layer 3 is below oV, and the copper heat transfer member 1 which is the base machine Since the metal powder 6 or the plating layer 3 selectively causes a corrosion reaction even if there is a pinhole in the coating layer 2 or the plating layer 3, the corrosion factor causes the corrosion of the coating layer 2 or the plating layer 3. 3, copper heat transfer member 1
Corrosion is prevented and copper ions are no longer leached into water. Further, since the amount of the corrosion factor passing through the coating layer 4 is small due to the presence of the coating layer 4, there is a loss due to the corrosion of the metal powder 6 existing in the coating layer 2 or the plating layer 3. is small, and corrosion of the copper heat transfer member 1 and elution of copper ions into water can be prevented for a long period of time.
本発明のコーティング層４に用いる有機系バインダーと
しては、長期にわたり熱水環境で使用されるために、水
分子の侵入によるコーティング層の劣化や水中に存在す
る腐食因子の侵入による銅製伝熱部材の腐食を防止する
必要があることから、６・ミ・
分子構造が三次元の密な網目構造を造り得り、コーティ
ング層中のピンホールを極めて少なくすることのできる
有機系樹脂が望ましく、その観点から、エポキシ樹脂を
添加したメラミン・アクリル樹脂、エポキシ変性シリコ
ン樹脂が挙げられる。The organic binder used in the coating layer 4 of the present invention is used in a hot water environment for a long period of time, so the coating layer may deteriorate due to the intrusion of water molecules or the copper heat transfer member may deteriorate due to the intrusion of corrosive factors present in water. Since it is necessary to prevent corrosion, it is desirable to use an organic resin whose molecular structure can form a three-dimensional dense network structure and which can minimize pinholes in the coating layer. Examples include melamine/acrylic resin with added epoxy resin, and epoxy-modified silicone resin.
一方、標準電極電位がｏＶ以下のコーティング層２に使
用する金属粉末６およびメッキ層３の金属としてはアル
ミニウム、亜鉛、スズ、ニンケルが挙げられ、中でも特
に耐食性の良好なニッケル。On the other hand, the metal powder 6 used for the coating layer 2 and the metal of the plating layer 3 whose standard electrode potential is oV or less include aluminum, zinc, tin, and nickel, among which nickel has particularly good corrosion resistance.
スズが良い。またコーティング層２の形成に用いる有機
系バインダーとしては、コーティング層４と同一のもの
を適用してもかまわない。Tin is good. Further, as the organic binder used for forming the coating layer 2, the same organic binder as that for the coating layer 4 may be used.
発明の効果
本発明の熱交換器によれば、伝熱部材である銅の腐食を
抑制し、銅イオンの溶出を防止することができるので、
銅イオンが原因で起こる水やタオルの青色化を防止する
ことができるとともに、銅製伝熱部材の腐食を長期にわ
たり防止できるという点からは、熱交換器としての大幅
な耐久性、信頼性の向上が期待できるものである。Effects of the Invention According to the heat exchanger of the present invention, corrosion of copper, which is a heat transfer member, can be suppressed and elution of copper ions can be prevented.
In addition to preventing water and towels from turning blue due to copper ions, it also prevents corrosion of copper heat transfer members over a long period of time, significantly improving durability and reliability as a heat exchanger. can be expected.
７／−シ7/-shi
第１図は本発明の一実施例である熱交換器を示す一部断
面図、第２図は本発明の他の実施例を示す一部断面図で
ある。
２・・・・・・コーティング層、５・・・・有機系バイ
ンダー、６・・・・・金属粉末、４・・・・コーティン
グ層、３・・・・メッキ層。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第２図FIG. 1 is a partially sectional view showing a heat exchanger according to an embodiment of the present invention, and FIG. 2 is a partially sectional view showing another embodiment of the present invention. 2... Coating layer, 5... Organic binder, 6... Metal powder, 4... Coating layer, 3... Plating layer. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2
Claims (1)
ダーと標準電極電位が零ボルト以下の金属粉末を主成分
とするコーティング層あるいは標準電極電位が零ボルト
以下の金属を主成分とするメッキ層を形成し、さらにこ
の表面に有機系バインダーからなるコーティング層を形
成しだ熱交換器。On the surface of the copper heat transfer member that comes into contact with water, there is a coating layer whose main components are an organic binder and a metal powder whose standard electrode potential is below zero volts, or a coating whose main components are metal whose standard electrode potential is below zero volts. A heat exchanger that has a plated layer and then a coating layer made of an organic binder on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2792483A JPS59153098A (en) | 1983-02-22 | 1983-02-22 | Heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2792483A JPS59153098A (en) | 1983-02-22 | 1983-02-22 | Heat exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59153098A true JPS59153098A (en) | 1984-08-31 |
Family
ID=12234430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2792483A Pending JPS59153098A (en) | 1983-02-22 | 1983-02-22 | Heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59153098A (en) |
-
1983
- 1983-02-22 JP JP2792483A patent/JPS59153098A/en active Pending
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