JPS59152688A - Method of producing printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Jin's invention relates to #porosity of printed circuit boards.

Conventionally, on printed circuit boards, it is often the case that the circuit is over-circuited by thermal compression bonding to increase reflection and concealment of the circuit.At this time, the circuit is formed.
Cut into foot lengths and process into Fyr rhinoceros shape Overlay 2
Ile A? For pasting, apply heat and pressure with a heat press, and then apply heat and pressure to the overlay film with the heat-curing glue applied to the glint substrate. However, the company says that the former has inferior productivity, and in the latter case, the productivity is much higher than the previous one. There were a lot of air bubbles, and the characteristics of each yuzu after use were deteriorated. (2) When the adhesive applied to the overlay film was pressurized, stains appeared from the edges and the stains appeared. The coating agent is deposited on the roll surface and transferred to the next product.If it is 1%, there are defects such as poor plating layering properties, etc.If it is raw, 1k (5) is refined. Lazy overlay film or heat roll EE lump #iH? ：、[It has drawbacks such as poor sliding and poor dimensional accuracy, and it is difficult to continuously manufacture products using the hot roll method that have physical properties similar to those of hot pressed products.

The present invention has been made in view of these points, in which one circuit is formed on the circuit of a printed circuit board, the overlay film is placed on the circuit surface, and a thermally plastic film is placed on the overlay film. It is characterized by applying an overlay film to the circuitry of the printed circuit board with a hot roll.

That is, in the present invention, in order to solve the drawbacks of the conventional hot roll pressing method, a thermoplastic film is placed between the overlay film and the hot roll. An additional layer? (2) The present invention will be explained below based on specific examples.

'E f s known #! A predetermined circuit board is formed using a manufacturing method such as the Ottenck method or additive method, which has overproduction properties.Next, it is processed into a predetermined shape.
Z! Solved pasting @ Printed circuit board r by hot pressing with Zetsu roll
obtain.

In this heat-pressing step, the overlay film is pressed onto the #1 plastic film r by passing it through a hot roll to obtain a printed circuit board r.

The overlay film that can be used in the present invention is a common overlay film for printed circuit boards. Examples are polyester, polyimide, FEP (fluorinated ethylene), TEE (tetrafluoroethylene), CTFE.
(pentafluorochloroethylene), fluorinated vinyl, polyamide.

It is a film made of polyethylene, etc., and is used as a viewing material.
Preferred are skin adhesives made of Js epoxy thread 4-yen fat and nitrile rubber, town tax epoxy anti-lipidizing agents, and acrylic adhesives.

It is known that it is desirable to have a thickness of about 20 to 50 microns in the hot press method, but the lifting platform of the hot roll method is generally used to completely remove air bubbles.

It is normal to apply the film thicker than 7L, but when the thermoplastic film according to the present invention is applied and the thermal roll pressure is gradually increased, the optimum value is around 20 to 60μ. , thermoplastic film material for overlaying the overlay film - polyimide, polyester, biriacetate, etc. are suitable, and their thickness IrL, 20-150
μ is too much. The heat roll used for the heating power is 200°C)'E, and the roll is flat + 1 #1 surface treated with hard chrome plating.
It is preferable to use a pair of rubber rolls τ coated uniformly with silicone rubber for 2 innings δn.

The silicone rubber lining N is in the range of 5 to 13 mm, and the speed of the heat roll is equipped with a drive device that can be set arbitrarily from 0 to 5 m/min, and the force pressure can be adjusted to a maximum of 60 kg/min. The axial pressure of Cm can be tolerated at will.
When the linear pressure is 50 to 60 kg/Cm, and when processing in multiple stages, σ, for example, 5 to 15 kg/Cm in the first stage.
cm 12th row 1120~5 (1kg/cm, 5
The desired pressing force is 050 to 60 kg/Cm.
It is more effective if the roll speed is slow, n is 5J even in one stage, or multiple rolls τ are used, and the pressure is gradually increased. It may be effective just between the overlay film and the heat roll, but especially if the substrate is flexible (such as a flexible board), under the IfCr11% flexible insulating base film (between the heath film and the heat roll)
It is also effective to interpose a thermoplastic film.

Next, let's talk about the overlay film of the present invention and the f8j5 method of applying a Benko/b heat 0J plastic film on the overlay film.

There are two methods for forming the overlay film into a τ=W shape: a method of punching out small pieces that fit the product size, and a method of continuously punching a long sheet.

In this way, the overlay film rL*,t is pasted on the printed circuit board in the forming place n6, and in the present invention, it is also possible to use the process f:, especially in the latter case. In addition, the thermal 0J plastic film that is placed on top of the more efficient 0J overlay film is also 1k, and due to its function, it can be processed into the required size and can be continuously made into a long sheet even if it is placed in a 2ft or 50m space. Even if an overlay film, which is a bonded product, is rolled onto a glued substrate and supplied to a hot roll, sufficient dj performance is achieved.

According to the present invention, the circuit pattern is 4J! Even if it is a rough product, the first stage of low-pressure heat rolls will remove any air bubbles, and the overlay film will be laminated smoothly to the extent that no sliding occurs within the heat rolls. Since a contact layer of 1 degree is obtained, the Oni Valley film 1 i W 2 Shu yb is then heated with a hot roll under high pressure.
This makes it possible to remove any remaining air bubbles.

Place the overlay film on top of the overlay film in the casing, and fill the thermoplastic film with 4 pieces of overlay film. Historically, the shear force generated from the sliding of the opposite roll and rubber roll causes the adhesive layer of the overlay film to slip. By placing it in between, it is effective to prevent the line from shifting.
〈Can be bonded by thermocompression.

As a result, the short poem was continuously overlaid with film without the need for long-term pressure pressing using a heat press.

Example 1 A circuit was formed using an etching method on a single-sided steel-clad polyester film consisting of a 55 μm thick electrical cable and a 75 μm thick polyester film, and then a 20 μm thick epoxy 4 resin was applied to a 38 μm thick polyester film. An overlay film made by applying a two-component layer agent made of nitrile gel was processed into the desired shape and attached to the circuit board.Next, the overlay film was coated with a 58 μm polyester film. -Flexible wiring was manufactured by thermocompression bonding using a molding method.

In Table 1, the number is 〇

Claims (1)

[Claims] 1. When a circuit is formed n'ft, an overlay film K[L is applied to a film having thermoplastic γ on the surface of the overlay film, and a roll is applied to the circuit of the printed circuit board. A method of manufacturing a printed circuit board using an overlay film. 2. Printed board p-manufacturability as described in item 1 of the permissible eyelid range when the heat stroke is multi-stage.