JPS59151449U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS59151449U
JPS59151449U JP4550383U JP4550383U JPS59151449U JP S59151449 U JPS59151449 U JP S59151449U JP 4550383 U JP4550383 U JP 4550383U JP 4550383 U JP4550383 U JP 4550383U JP S59151449 U JPS59151449 U JP S59151449U
Authority
JP
Japan
Prior art keywords
metal substrate
box
semiconductor equipment
semiconductor device
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4550383U
Other languages
Japanese (ja)
Inventor
亮一 小林
嘉彦 中島
植川　淳哉
Original Assignee
株式会社三社電機製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社三社電機製作所 filed Critical 株式会社三社電機製作所
Priority to JP4550383U priority Critical patent/JPS59151449U/en
Publication of JPS59151449U publication Critical patent/JPS59151449U/en
Pending legal-status Critical Current

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体装置の部分波断側面図、第２図は
別の従来の半導体装置の部分破断側面図、第３図はこの
考案による半導体装置の縦断側面図である。 １・・・金属基板、２・・・箱体、３・・・接着剤、５
・・・半導体素子、９・・・接着剤広がり防止用の溝。FIG. 1 is a partially cutaway side view of a conventional semiconductor device, FIG. 2 is a partially cutaway side view of another conventional semiconductor device, and FIG. 3 is a longitudinal side view of a semiconductor device according to this invention. 1... Metal substrate, 2... Box, 3... Adhesive, 5
...Semiconductor element, 9...Groove for preventing adhesive from spreading.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属基板上に、絶縁体製の箱体を接着剤で接着し、上記
箱体で囲んだ上記金属基板の上面に半導体素子を取付け
、上記箱体の外周縁部近傍の上記金属基板に接着剤広が
り防止用の溝を凹設してなる半導体装置。A box made of an insulator is glued onto a metal substrate, a semiconductor element is mounted on the top surface of the metal substrate surrounded by the box, and an adhesive is applied to the metal substrate near the outer periphery of the box. A semiconductor device with a recessed groove to prevent spreading.
JP4550383U 1983-03-28 1983-03-28 semiconductor equipment Pending JPS59151449U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4550383U JPS59151449U (en) 1983-03-28 1983-03-28 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4550383U JPS59151449U (en) 1983-03-28 1983-03-28 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS59151449U true JPS59151449U (en) 1984-10-11

Family

ID=30176018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4550383U Pending JPS59151449U (en) 1983-03-28 1983-03-28 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS59151449U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5812446U (en) * 1981-07-16 1983-01-26 天竜精機株式会社 Roll attachment/detachment mechanism of small rotary printing press

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5812446U (en) * 1981-07-16 1983-01-26 天竜精機株式会社 Roll attachment/detachment mechanism of small rotary printing press

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