JPS5820537U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5820537U
JPS5820537U JP6424582U JP6424582U JPS5820537U JP S5820537 U JPS5820537 U JP S5820537U JP 6424582 U JP6424582 U JP 6424582U JP 6424582 U JP6424582 U JP 6424582U JP S5820537 U JPS5820537 U JP S5820537U
Authority
JP
Japan
Prior art keywords
surface side
fixed
peripheral edge
semiconductor equipment
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6424582U
Other languages
Japanese (ja)
Inventor
薦田　孝一
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP6424582U priority Critical patent/JPS5820537U/en
Publication of JPS5820537U publication Critical patent/JPS5820537U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はキャン封止型半導体装置の一例の縦断面図、第
２図は金属板を打抜いて製作したステム基板の縦断面図
、第３図は従来の半導体装置の縦断面図、第４図および
第５図は本考案による異る実施例の半導体装置の縦断面
図である。 乏・・・・・・ステム基板、２Ａ・・・・・・周縁２ａ
が丸味を有する主面、２Ｂ・・・・・・周縁２ｂが角張
っている主面、３．　４．　１３．　１４・・・・・・
取付孔、８，１５・・・・・・半導体素子、１０・・・
・・・金属キャップ、１１゜１２・・・・・・素子取付
基板、１２Ａ・・・・・・周縁１２ａが丸味を有する主
面、１２Ｂ・・・・・・周縁１２ｂが角張っている主面
、２０・・・・・・合成樹脂。FIG. 1 is a vertical cross-sectional view of an example of a can-sealed semiconductor device, FIG. 2 is a vertical cross-sectional view of a stem substrate manufactured by punching a metal plate, and FIG. 3 is a vertical cross-sectional view of a conventional semiconductor device. 4 and 5 are longitudinal cross-sectional views of semiconductor devices of different embodiments according to the present invention. Poor... Stem board, 2A... Periphery 2a
2B... The main surface has a rounded edge 2b, 3. 4. 13. 14...
Mounting hole, 8, 15... Semiconductor element, 10...
...Metal cap, 11°12...Element mounting board, 12A...Main surface with rounded edge 12a, 12B...Main surface with angular edge 12b , 20...Synthetic resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一主面側の周縁が丸味を有し他主面側の周縁が角張って
いる素子取付基板上に半導体素子を固着してなる半導体
装置において、前記半導体素子を素子取付基板の周縁が
丸味を有する他主面側に固着したことを特徴とする半導
体装置。In a semiconductor device in which a semiconductor element is fixed to an element mounting substrate having a rounded peripheral edge on one principal surface side and an angular peripheral edge on the other principal surface side, the semiconductor element is fixed to an element mounting substrate having a rounded peripheral edge. A semiconductor device characterized by being fixed to the other main surface side.
JP6424582U 1982-04-30 1982-04-30 semiconductor equipment Pending JPS5820537U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6424582U JPS5820537U (en) 1982-04-30 1982-04-30 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6424582U JPS5820537U (en) 1982-04-30 1982-04-30 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5820537U true JPS5820537U (en) 1983-02-08

Family

ID=29860330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6424582U Pending JPS5820537U (en) 1982-04-30 1982-04-30 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5820537U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6065244U (en) * 1983-10-11 1985-05-09 株式会社吉野工業所 container with cap
JPS6065243U (en) * 1983-10-11 1985-05-09 株式会社吉野工業所 container with cap
JPS6065245U (en) * 1983-10-12 1985-05-09 株式会社吉野工業所 container with cap
JPS6068042U (en) * 1983-10-14 1985-05-14 株式会社吉野工業所 container with cap
JPS6068044U (en) * 1983-10-18 1985-05-14 株式会社吉野工業所 container with cap
JPS60120937U (en) * 1984-01-25 1985-08-15 吉田工業株式会社 container with cap
JPS60120938U (en) * 1984-01-25 1985-08-15 吉田工業株式会社 container with cap
JPS60131535U (en) * 1984-02-15 1985-09-03 吉田工業株式会社 container cap

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0232595Y2 (en) * 1983-10-11 1990-09-04
JPS6065243U (en) * 1983-10-11 1985-05-09 株式会社吉野工業所 container with cap
JPS6065244U (en) * 1983-10-11 1985-05-09 株式会社吉野工業所 container with cap
JPH033483Y2 (en) * 1983-10-11 1991-01-29
JPS6065245U (en) * 1983-10-12 1985-05-09 株式会社吉野工業所 container with cap
JPH0320301Y2 (en) * 1983-10-12 1991-05-01
JPS6068042U (en) * 1983-10-14 1985-05-14 株式会社吉野工業所 container with cap
JPH0232590Y2 (en) * 1983-10-14 1990-09-04
JPS6068044U (en) * 1983-10-18 1985-05-14 株式会社吉野工業所 container with cap
JPH0232591Y2 (en) * 1983-10-18 1990-09-04
JPH0228202Y2 (en) * 1984-01-25 1990-07-30
JPH0226840Y2 (en) * 1984-01-25 1990-07-20
JPS60120938U (en) * 1984-01-25 1985-08-15 吉田工業株式会社 container with cap
JPS60120937U (en) * 1984-01-25 1985-08-15 吉田工業株式会社 container with cap
JPH0226841Y2 (en) * 1984-02-15 1990-07-20
JPS60131535U (en) * 1984-02-15 1985-09-03 吉田工業株式会社 container cap

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