JPS59147023A - Preparation of thin film of metal - Google Patents

Abstract

PURPOSE:In vacuum metallizing, to form rapidly a stable thin film of metal without making a substrate consisting of a high polymer material develop heat distortion, thermal decomposition, and wrinkle, by applying a potential difference to the space between the thin film of metal to be formed and a cylindrical can. CONSTITUTION:In forming directly a thin film of metal on the substrate 1 consisting of a high polymer material running along the outer peripheral face of the cylindrical can 2 by vacuum metallizing, for example, the metal roller 7 is set between the cylindrical can 2 and the winding roll 4, a potential difference is applied to a space between the formed thin film 6 of metal and the cylindrical can 2 by the electric source 8, to form a thin film of metal. EFFECT:The substrate 6 is stuck on the cylindrical can 2 by electrostatic attraction, and protected from thermal damage. A metallized thin film of metal can be used as an electode, and the surface of substrate is not required to have electrical conductivity previously.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a manufacturing method for forming a metal thin film on a substrate made of a polymeric material.

Conventional structure and problems The best way to form a metal thin film on a substrate made of polymeric material by vacuum evaporation is to deposit it while moving the substrate along a cylindrical can. .

FIG. 1 schematically shows the internal structure of a vacuum evaporation apparatus using such a method. A substrate 1 made of a polymeric material runs along the circumferential side of a cylindrical can 2 in the direction of the arrow. A thin metal film is formed on the substrate 1 by the evaporation source 6 . 1st
In the figure, 3 is a supply roll, and 4 is a take-up roll. When forming a metal thin film on a substrate made of a polymeric material using such a vacuum evaporation apparatus, the thickness of the metal thin film is as thin as several hundreds of nanometers.
8 or less, a stable metal thin film is formed, but when forming a metal thin film with a thickness of several 100 Å or more at a high deposition rate of several 100 Å or more, radiant heat from the evaporation source and evaporated atoms The heat of condensation causes thermal deformation and thermal decomposition of the substrate, making it impossible to form a stable metal thin film.

Therefore, when forming a metal thin film with a thickness of several hundred or more, certain measures must be taken to avoid such thermal damage. Conventionally, one of the countermeasures was to deposit a thin metal film with a thickness of less than 100 cm to avoid thermal damage, and then create a potential difference between this thin metal film and the cylindrical can. A method of forming a metal thin film with a thickness of several hundred eights or more at a high deposition rate of several hundred eights per second or more has been considered. FIG. 2 schematically shows the internal structure of a vacuum evaporation apparatus using such a method. A substrate 6 made of a polymeric material on which a metal thin film is deposited runs on its metal surface in contact with a metal roller 7, and through this metal roller 7 a potential difference is applied between it and the grounded cylindrical can 2 by a power source 8. . In this way, the board 6 and the cylindrical can 2 are
If a 1-position difference is provided between them, the substrate 6 will stick to the cylindrical can 2 due to electrostatic attraction. If a metal thin film is formed by the evaporation source 5 while the substrate 6 is stuck to the cylindrical can 2, the substrate will be Heat such as radiant heat from the evaporation source and condensation heat of evaporated atoms received by the can 6 can be diffused to the cylindrical can 2 by thermal conduction, and the substrate 6 does not undergo thermal deformation or thermal decomposition.

As described above, by creating a potential difference between the cylindrical can and the substrate, it is possible to form a stable film, but in the method shown in Figure 2, a thin metal film is vapor-deposited on the substrate in advance. A conductive layer must be formed in advance, and the film thickness is several hundreds of nanometers directly on the substrate made of polymer material.
It is not possible to deposit stable metal thin films of 8 or more at high deposition rates of more than a few 100 8/sec.

OBJECTS OF THE INVENTION An object of the present invention is to provide a method for producing a metal thin film using a vacuum evaporation method without causing thermal deformation, thermal decomposition, or wrinkles on a substrate.

Structure of the Invention The present invention is directed to forming a metal thin film directly on a substrate made of a polymeric material running along the circumferential side of a cylindrical can by a vacuum evaporation method. This is a method for producing a metal thin film, characterized by providing a potential difference between the metal thin films, and the method of the present invention makes it possible to form a metal thin film on a substrate made of a polymeric material without causing thermal deformation, thermal decomposition, or wrinkles. It is possible.

DESCRIPTION OF EMBODIMENTS FIG. 3 schematically shows the internal structure of a vacuum evaporation apparatus using the method of the present invention. FIG. 1 in FIG.

Components that are the same as those in FIG. 2 are given the same numbers and their explanations will be omitted. A feature of the device shown in FIG. 3 is that the position of the metal roller 7 has been moved from between the supply roll 3 and the cylindrical can 2 shown in FIG. 2 to between the cylindrical can 2 and the take-up roll 4. It is. When forming a metal thin film directly on a substrate made of a polymer material, the conventional method shown in Figure 2 creates a potential difference between the cylindrical cap and the cylindrical cap because there is no conductive layer on the substrate. It was impossible to protect the substrate from thermal damage by attaching it with electrostatic attraction. However, in the method according to the present invention shown in FIG. 3, since the metal roller 7 is located between the cylindrical can 2 and the take-up roll 4, the deposited metal thin film is present on the substrate, so the metal roller 7 passes through the substrate. A potential difference can be provided between the upper metal thin film and the cylindrical can, and the substrate 6 can be stuck to the cylindrical can by electrostatic attraction to protect it from thermal damage. In the method of the present invention, a potential difference is provided through the metal layer formed by the evaporation source, so the substrate sticks to the cylindrical can in the right side of the straight line connecting the center of the cylindrical can and the evaporation source in FIG. It is only the part on the take-up roll side where the substrate 6 is in contact with the cylindrical can 2,
Since the metal layer does not yet exist on the left side of the straight line, that is, on the supply roll side, it is not possible to create a potential difference between the metal layer and the cylindrical can, and the metal layer does not stick to the cylindrical can. However, since the heat that the substrate 6 receives is mainly radiant heat from the heat generation source 5 and condensation heat of evaporated atoms, the substrate 6 on the supply roll 3 side from the evaporation source 6 receives thermal heat even if it is not attached to the cylindrical can 2. Take no damage.

If precautions are not taken, thermal damage will occur. On the side from the evaporation source 5 to the take-up roll 4, the substrate 6 is stuck to the cylindrical can 2 and can be protected from thermal damage, so the method of the present invention protects the substrate 6 from thermal damage during vacuum evaporation. I can do it.

Next, a specific embodiment of the present invention will be described using FIG. 3. A voltage of 100V is applied to the metal roller 7 by a power source 8. Although a DC power source is shown in Figure 3, an AC power source may also be used. The cylindrical can 2 is grounded. Using such a device, a metal thin film with a thickness of 1000 was applied to a polyethylene terephthalate substrate with a film thickness of 12 μVt.
The i-film was formed at a deposition rate of 4000Δ/sec. The produced membrane was very stable and showed no thermoelectricity or wrinkles. On the other hand, when no voltage was applied to the metal roller, thermal decomposition occurred in the substrate and holes were formed.

Effects of the Invention As described above, the method of the present invention makes it possible to attach a substrate to a cylindrical can by electrostatic attraction, thereby forming a stable metal thin film that is free from heat buildup, wrinkles, etc. Furthermore, since the deposited metal thin film can be used as an electrode, there is no need to make the surface of the substrate conductive in advance.

[Brief explanation of drawings]

1 and 2 are schematic diagrams of the internal structure of a vacuum evaporation apparatus in a conventional method for producing a metal thin film, respectively, and FIG. 3 is a schematic diagram of an internal structure of a vacuum evaporation apparatus in a method for producing a metal thin film according to the present invention. It is. 1... Board, 2... Cylindrical can, 3...
...Supply roll, 4...Take-up roll 6
...Evaporation source, 6...Substrate on which a metal thin film is evaporated, 7...Metal roller, 8...
A power supply that applies voltage to the board. Name of agent: Patent attorney Toshio Nakao (1st person)
Figure 3

Claims (1)

[Claims] When forming a metal thin film directly on a substrate made of a polymeric material running along the circumferential side of a cylindrical can by vacuum evaporation, a potential difference is created between the formed metal thin film and the cylindrical can. A method for manufacturing a metal thin film, comprising: providing a metal thin film.