JPS59145504A - Method of producing resistor circuit board with terminal - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a resistive circuit board with terminals used in various electrical appliances.

Conventional Structures and Problems Conventionally, as shown in FIGS. 1 and 2, a conventional method for forming such a resistor circuit board with terminals is to form electrodes and ÷turns on a substrate 1 such as a phenol laminate. 2゜2′ is formed,
Resistor pattern 3. is connected to these electrode patterns 2, 2'.
Then, the base 1 is punched out into a predetermined shape, metal terminals 4, 4' are fixed to the electrode pattern 2° 2' portion, and metal terminals 4, 4' are fixed on the terminals 4, 4' and the resistor patterns 3, 3'. The most commonly used method is to obtain an arbitrary resistance change curve between the metal brush or carbon brush 5 that slides. range.

However, in the conventional method (d), as shown in Fig. 1, a terminal fixing part for leading out to the outside is required, and the size is considerably larger than the actual sliding part (between lines D and D'). There were drawbacks.

The common method for fixing metal terminals is the so-called caulking method, in which the metal terminal is deformed under pressure and fixed, but since it is only in mechanical contact, it is difficult to maintain electrical contact under various environmental conditions. Not only is it stable, but when soldering to metal terminals, the insulating flax rises along the terminal and in some cases reaches the brush sliding area, causing noise when the brush slides. There were drawbacks.

Furthermore, electrode pattern 2 and resistance pattern 3 shown in FIG.
Contact with N33111 Similarly, since there are steps at the joint 3b between the electrode pattern 2' and the resistor pattern 3' and at the joint 30 between the resistor patterns 3 and 3', the sliding feeling is not only bad when the brush is sliding. This also causes noise generation, and the step portions of the joints 3a, 3b, and 3c are likely to be scraped, resulting in a shortened sliding life.

Furthermore, silver paint is commonly used for the electrode patterns 2゜2' shown in Figures 1 and 2 in order to maintain electrical conductivity and stability of electrical contact with the terminals. When this happens, silver migration occurs, leading to short-circuit accidents and burn-out accidents.

For this reason, a method has been devised to overcoat the electrode pattern on the sliding part with carbon resin paint, etc. However, overcoating is impossible on the fixed part of the terminal because it impairs the contact stability of the terminal. There are still no measures to prevent migration.

In order to eliminate the various drawbacks mentioned above, a conventional method is known in which, for example, an insulating adhesive is used to transfer the patterns (electrodes, resistors) on a temporary substrate to another rigid substrate. Not only could the drawbacks not be improved, but additional materials such as an insulating adhesive were required, and the cost was high due to the addition of a transfer process.

OBJECTS OF THE INVENTION It is an object of the present invention to provide a resistor circuit board with terminals that can eliminate all of the above-mentioned defects. Therefore, it is possible to prevent noise caused by the flux increase during soldering A/1, and the resistance circuit has no unevenness, so the sliding feel is extremely good, and there is no brush sliding noise, resulting in a long sliding life. It is possible to provide a resistor circuit board with terminals which can also prevent silver migration, can be manufactured at low cost, is mass-producible, and is extremely useful in the industrial field.

Structure of the Invention According to the present invention, an electrode pattern and a resistance pattern are formed on a temporary substrate having the shape of a resistance circuit board with an end-r, and a metal layer is bonded onto the electrode pattern via a conductive adhesive. This is a method for manufacturing a resistor circuit board with a terminal, which is obtained by inserting the board into a mold, molding an electrode pattern, a resistor pattern, and a part of the metal terminal, and then temporarily removing the base. Miniaturization is possible because the pattern or resistor pattern and terminal can be arranged three-dimensionally, and the terminal contact part is molded into the base, so the electrical contact is stable, and the resistor pattern after temporarily removing the base Since the electrode pattern is smooth, it has an extremely good sliding feel and has a long sliding life.When silver paint is used for the electrode pattern, the entire surface of the electrode pattern can be overcoated with a resistive pattern, making it possible to completely prevent silver migration. , since it becomes a single circuit board with integrated terminals, there is no need to worry about fixing the terminals separately in the subsequent process, which simplifies assembly, and also (d) lowers the cost. It is.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to FIGS. 3 and 4. First, FIGS. 3A, B, and C are conceptual diagrams of the manufacturing method of the present invention, and FIG. 3A shows resistor patterns 7 , 7 / and electrode patterns 8 , 8 for overcoating on a temporary substrate 6 that has been subjected to mold release treatment. ', shows a state in which a resistor pattern 9.9' is formed.

As the temporary substrate 6, a synthetic resin film such as a polyester film or a polyimide film whose surface has been treated with silicon or acrylic, or a metal foil such as stainless steel is used.

Further, the overcoat resistor patterns 7, Y' and the resistor patterns 9, 9' are formed with carbon resin paint, and the electrode patterns 8, 8' are formed with resin paint using gold powder such as silver. 31 1B forms the above-mentioned patterns and applies conductive adhesive 10, 10' on the electrode patterns 8, 8' of the temporary base 6 to external lead terminals 11.11''4.
7 is shown inserted into the molding die 12 from the adhering sheet 7. After the insertion, molding resin is poured through the nozzle 13. FIG. 3C shows the molding die 12 after the molding resin 14 has solidified.
The state after the temporary base 6 has been removed and the top and bottom have been turned over is shown.

4A and 4B show an embodiment in which a plurality of external lead-out terminals 11a to 11d are molded. FIG. 4A is a cross-sectional view of the IJF plane, and FIG. Yes, brush 1 is applied over electrode patterns 8 and 8' and resistance patterns 9 and 9'.
5 slides. The line DD' in the figure shows the sliding range of the plate-r-15.

Effects of the Invention As described above, according to the terminal resistor circuit board manufactured by the manufacturing method of the present invention, the shape can be miniaturized, the electrical contact state of the terminal is extremely stable, and it is easy to solder. There is no flux contamination during the process, the sliding feel is good, there is no noise, and the sliding life is long. By overcoating the entire surface of the electrode pattern with carbon or resin paint, silver migration can be completely prevented, resulting in extremely stable quality and eliminating terminal fixation, which was previously done in the post-process. It is easy to assemble, requires no parts, and can be made at low cost. Since trench molded bodies can be molded into any shape, three-dimensional shapes that were impossible with conventional methods are also possible, so the degree of freedom in design is greatly improved.

[Brief explanation of the drawing]

Figure 1 is a front view of a resistor circuit board in a conventional example, Figure 2 is a sectional view of a resistor circuit board in a conventional example, and Figures 3A, B, and C.
are cross-sectional views at each step of the manufacturing process according to the present invention, FIG. 4A
, B are a front view and a sectional view of an embodiment according to the present invention. 6...1 o'clock base, finished, finished', 9.9'...-
Resistance pattern, 8, 8'... Electrode pattern, 10
, 10'... Conductive adhesive, 11.11'...
...Metal terminal (external lead-out terminal), 14...
Molding resin. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure pv' Figure 3 Figure 4

Claims (1)

[Claims] An electrode pattern is formed on a temporary base that has been subjected to mold release treatment,
Connecting to the electrode pattern to form a resistance pattern, applying a conductive adhesive on the electrode pattern or opposing metal terminals, and connecting the electrode pattern and the metal terminal via the conductive adhesive. Manufacturing a resistor circuit board with a terminal, which is bonded and inserted into a molding die, molded with the electrode pattern, the resistor pattern, and at least a part of the pre-elimination terminal, and then temporarily removed from the base. Method.