JPS59145097U - Carrier tape for taping - Google Patents

Carrier tape for taping

Info

Publication number
JPS59145097U
JPS59145097U JP3896183U JP3896183U JPS59145097U JP S59145097 U JPS59145097 U JP S59145097U JP 3896183 U JP3896183 U JP 3896183U JP 3896183 U JP3896183 U JP 3896183U JP S59145097 U JPS59145097 U JP S59145097U
Authority
JP
Japan
Prior art keywords
tape
taping
carrier tape
semiconductor device
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3896183U
Other languages
Japanese (ja)
Inventor
明石 進一
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP3896183U priority Critical patent/JPS59145097U/en
Publication of JPS59145097U publication Critical patent/JPS59145097U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のテーピング用キャリアテープの斜視図、
第2図は第1図のキャリアテープに半導体装置を固定し
た状態の断面図、第3図は、第2図の状態のキャリアテ
ープをリールに巻き付けた状態を示す斜視図、第4図は
本考案の一実施例の斜視図、第5図は本考案の一実施例
に半導体装置を固定した状態を示す断面図である。 1.11・・・支持テープ、la、lla・・・半導体
装置固定部穴、2・・・粘着テープ、3・・・半導体装
置、4・・・キャリアテープ、5・・・リール、6・・
・導電膜。
Figure 1 is a perspective view of a conventional taping carrier tape.
2 is a cross-sectional view of a semiconductor device fixed to the carrier tape of FIG. 1, FIG. 3 is a perspective view of the carrier tape of FIG. 2 wound around a reel, and FIG. FIG. 5 is a perspective view of an embodiment of the invention, and FIG. 5 is a sectional view showing a state in which a semiconductor device is fixed to an embodiment of the invention. 1.11... Support tape, la, lla... Semiconductor device fixing part hole, 2... Adhesive tape, 3... Semiconductor device, 4... Carrier tape, 5... Reel, 6...・
・Conductive film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体装置を固着する位置に穴のあけられた支持テープ
と、この支持テープの裏面に貼り付けられると共に前記
支持テープの穴のところに置かれた半導体装置を固定す
る粘着テープとを備えたテーピング用キャリアテープに
おいて、前記支持テープの表面に導電性材料が被着され
ていることを特徴とするテーピング用¥ヤリアテープ。
A tape for taping comprising a supporting tape with holes drilled at positions for fixing the semiconductor device, and an adhesive tape attached to the back side of the supporting tape and fixing the semiconductor device placed at the holes of the supporting tape. A carrier tape for taping, characterized in that a conductive material is adhered to the surface of the support tape.
JP3896183U 1983-03-17 1983-03-17 Carrier tape for taping Pending JPS59145097U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3896183U JPS59145097U (en) 1983-03-17 1983-03-17 Carrier tape for taping

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3896183U JPS59145097U (en) 1983-03-17 1983-03-17 Carrier tape for taping

Publications (1)

Publication Number Publication Date
JPS59145097U true JPS59145097U (en) 1984-09-28

Family

ID=30169622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3896183U Pending JPS59145097U (en) 1983-03-17 1983-03-17 Carrier tape for taping

Country Status (1)

Country Link
JP (1) JPS59145097U (en)

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