JPS59145009U - Laminated chip coil - Google Patents
Laminated chip coilInfo
- Publication number
- JPS59145009U JPS59145009U JP3787783U JP3787783U JPS59145009U JP S59145009 U JPS59145009 U JP S59145009U JP 3787783 U JP3787783 U JP 3787783U JP 3787783 U JP3787783 U JP 3787783U JP S59145009 U JPS59145009 U JP S59145009U
- Authority
- JP
- Japan
- Prior art keywords
- chip coil
- laminated chip
- coil
- multilayer chip
- magnetic layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はこの考案の興味ある先行技術となる積層型チッ
プコイルを構成する各磁性体層を分解して示す斜視図で
ある。第2図は第1図の磁性体層を積層して得られた積
層型チップコイルを示す。
第3図はこの考案の一実施例を構成する各磁性体層を分
解して示す斜視図である。第4図は第3図の各磁性体層
を積層して得られた積層型チップコイルを示す。
図において、21〜28は磁性体層、29〜35は導電
パターン、36〜41はスルーホールである。FIG. 1 is an exploded perspective view showing each magnetic layer constituting a laminated chip coil, which is an interesting prior art of this invention. FIG. 2 shows a laminated chip coil obtained by laminating the magnetic layers shown in FIG. 1. FIG. 3 is an exploded perspective view showing each magnetic layer constituting an embodiment of this invention. FIG. 4 shows a laminated chip coil obtained by laminating the magnetic layers shown in FIG. 3. In the figure, 21 to 28 are magnetic layers, 29 to 35 are conductive patterns, and 36 to 41 are through holes.
Claims (1)
ンス形成のための導電パターンが形成され、各導電パタ
ーンの端部が各磁性体層にそれぞれ設けられたスルーホ
ールを介して電気的に接続されて複数個の導電パターン
がコイル状に延びる状態とされる積層型チップコイルに
おいて、前記各スルーホールの磁性体層上での位置が、
この積層型チッチコイル全体として、分散されているこ
とを特徴とする、積層型チップコイル。A conductive pattern for forming inductance is formed on one side of each of the multiple magnetic layers stacked, and the ends of each conductive pattern are electrically connected through through holes provided in each magnetic layer. In a stacked chip coil in which a plurality of conductive patterns are connected and extend in a coil shape, the position of each through hole on the magnetic layer is
This multilayer chip coil is characterized in that the multilayer chip coil is dispersed throughout the entire multilayer chip coil.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3787783U JPS59145009U (en) | 1983-03-16 | 1983-03-16 | Laminated chip coil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3787783U JPS59145009U (en) | 1983-03-16 | 1983-03-16 | Laminated chip coil |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59145009U true JPS59145009U (en) | 1984-09-28 |
Family
ID=30168565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3787783U Pending JPS59145009U (en) | 1983-03-16 | 1983-03-16 | Laminated chip coil |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59145009U (en) |
-
1983
- 1983-03-16 JP JP3787783U patent/JPS59145009U/en active Pending
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