JPS59138081A - Connector - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a connector consisting of, for example, an IC lead terminal and an IC socket contact that can be electrically connected to and separated from each other, and particularly relates to a connector with improved contact portions.

1st. For connectors in which the second contacts can be electrically connected to and separated from each other, except for combinations of contact parts made of precious metals (% gold), combinations of contact parts made of other metals are subject to surface deterioration over time. It is necessary to pay attention to the deterioration of contact performance due to such factors.

Contacts whose contact parts are plated with tin, for example,
When a contact whose contact portion is plated with gold, for example, is fitted into a contact state, the contact resistance value may suddenly increase. This is thought to be due to the fact that the contact area between the two periodically causes small relative movements due to external factors such as photography or temperature changes, which significantly accelerates oxidation corrosion. This phenomenon is called micro-sliding wear.

Micro-sliding wear occurs especially in IC connectors (IC sockets). In other words, there are currently lead terminals for IC/packages that are electrically connected to and separated from IC socket contacts, and are plated with gold, silver, tin, etc., and it is difficult to limit the suitability of these over time. It is difficult in terms of both gender and economic efficiency.

The present invention was made in view of these circumstances.
The purpose is to provide a highly reliable connector that has good workability and is economically advantageous.

Hereinafter, the present invention will be explained with reference to the drawings. Although an IC connector (IC socket) will be explained here as an example, any other card connector or terminal block connector can be applied. FIG. 1 is a perspective view of a contact for an IC connector showing a first embodiment of the present invention, which shows a contact portion 1a and a leg portion that come into pressure contact when an IC connector (not shown) is inserted. 1b, and the contact portion 1a consists of a contact piece 1a1 in the shape of an inverted U-shape and a contact piece 1a2 in the shape of an inverted U-shape facing the contact piece 1a2. As shown in FIG. 2(a)+(b)r(c), an IC is installed on the opposing surfaces of both contact pieces 1a1 and 1a2, respectively.
A surface treatment portion having a predetermined width, such as a silver plating layer 1a3 and a tin plating layer 1a4, is provided in a direction perpendicular to the insertion direction of the lead terminal. Figures 2(a) and 1(b) show a copper alloy material with silver plating layers 1a3 and 1a4 applied to the front and back surfaces, respectively, and Figure 2(c) shows IC connector contacts made from this copper alloy material. It shows the state in which a piece is cut out and molded into a contact. Hiko, it goes without saying that, for example, a nickel base plating layer is applied as the base plating layer of the contact.

As described above, the contact 1 for an IC connector according to the first embodiment of the present invention has a silver plating layer 1a3 and a silver plating layer 1a4 on the contact surface portions that the I CIJ-17 terminal contacts in the opposing contact pieces 1a1 and 1a2. Since the surface treatment is applied, the above-mentioned slight sliding wear can be prevented if the lead terminals of the IC package are plated with silver or tin, for example. This makes it easier to use than conventional ones, especially when replacing IC packages and cages.
Since there is no need to worry so much about the plating of the lead terminals of the cage, work efficiency is improved, and it is advantageous in terms of economy and practicality.

FIG. 3 is a perspective view showing a second embodiment of the present invention, in which a pair of contact pieces 2al and 2th2 of a contact 2 for an IC connector is shown.
have the same shape and are formed almost in a dogleg shape, and the contact surfaces that come into direct contact with the lead terminals of the bent IC package have different surface treatment parts as shown in Figures 4(a) and (b). For example, a silver plating layer 2a3 and a tin plating layer 2a4 are applied. In addition, 2b is a leg part. In this case as well, effects similar to those of the first embodiment described above can be obtained.

FIGS. 5(a), (b), (c), and (d) show a third embodiment of the present invention, in which the contact portion 3a of the contact 3 for an IC connector includes three contact pieces 3al, 3a
From 2.3a3, for example, a slit 3a4 is formed in the longitudinal direction only on the 10,000 side of the contact piece of a contact having the shape as shown in FIG. Surface treatment parts, such as a silver plating layer 3a5 and a tin plating layer 3h6, are applied to the contact surfaces that come into contact with the lead terminals of an IC bag (not shown), respectively. Note that 3b is an arm. In this case as well, effects similar to those of the first embodiment described above can be obtained.

FIGS. 6(a) and 6(b) show a fourth embodiment of the present invention, in which the silver plating layer 3a5, which is the surface treatment part in FIG.
and a hot plating layer 3a7 in place of the tin plating layer 3a6.
, 3a8. In this case as well, effects similar to those of the first embodiment described above can be obtained.

In addition to the above-described embodiments, the present invention can be implemented with the following modifications. In the above-mentioned embodiments, different surface treatments were applied to the IC connector contacts, but instead of this, different surface treatments may be applied to the IC connector terminal side. Different surface treatments may be applied. The surface treatment method described above may be plating, a method of vapor depositing a conductive material in place of spot plating, a method of applying a conductive paint, or a method of pasting a conductive tape.

According to the present invention described above, workability is good, standardization can be achieved, and it is also advantageous in terms of economy, making it possible to provide a highly reliable connector.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a first embodiment of the present invention, and FIG.
a)! (b) I (c) is a diagram for explaining the method of manufacturing the contact shown in FIG. 1, FIG. 3 is a perspective view showing the second embodiment of the present invention, and FIGS. 4(a) and (b) is a diagram for explaining the method of manufacturing the contact shown in Figure 3, and Figure 5 (
a), (b), (c), and (d) are a top view, a front view, a side view, and a fifth embodiment showing the third embodiment of the present invention.
A sectional view taken along line D-D in the figure, FIG.
) and (b) are a perspective view showing a fourth embodiment of the present invention and a front view showing only essential parts. 1... Contact for IC connector, la... Contact part, 1b... Leg part, IFtl, 1 & 2... Contact piece, J
a,? ...Silver plating layer, 1a4...Tin plating layer, 2...Contact for IC connector, 2a/Contact part,
2al, 2a2... contact piece, 2a3... silver plating layer,
2a4...Tin plating layer, 2b...Legs, 3a...
Contact part, 3b, Leg part, Ja 1.31h2.3a
3. Contact piece, 3a4...Slit, 3a5...Silver plating layer, 3a6...Tin plating layer, 3117...Silver tin,
f! 3a8... tin spot plating layer. Figure 1 Figure 2 ■ Third Ward a3 \ 2a+ 2a4 b b az /2a4 Figure 5 (a) Figure 6 (a) (b)

Claims (1)

[Claims] Connecting part of printed circuit board, first part of ICIJ-de terminal, etc.
w, in a connector consisting of a contact body and a second contact body such as a connector contact that can be electrically connected to and separated from the first contact body, a contact surface portion of the first contact body and the second contact body in direct contact with each other; A connector with a different surface treatment applied to the iron side of one side to increase conductivity.