JPS59135170U - 超精密用デイスペンサ− - Google Patents

超精密用デイスペンサ−

Info

Publication number
JPS59135170U
JPS59135170U JP1983027093U JP2709383U JPS59135170U JP S59135170 U JPS59135170 U JP S59135170U JP 1983027093 U JP1983027093 U JP 1983027093U JP 2709383 U JP2709383 U JP 2709383U JP S59135170 U JPS59135170 U JP S59135170U
Authority
JP
Japan
Prior art keywords
dispensing
solenoid valve
dispenser
volume
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983027093U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0215588Y2 (enExample
Inventor
和正 生島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Musashi Engineering Inc
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Priority to JP1983027093U priority Critical patent/JPS59135170U/ja
Publication of JPS59135170U publication Critical patent/JPS59135170U/ja
Application granted granted Critical
Publication of JPH0215588Y2 publication Critical patent/JPH0215588Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)
JP1983027093U 1983-02-28 1983-02-28 超精密用デイスペンサ− Granted JPS59135170U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983027093U JPS59135170U (ja) 1983-02-28 1983-02-28 超精密用デイスペンサ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983027093U JPS59135170U (ja) 1983-02-28 1983-02-28 超精密用デイスペンサ−

Publications (2)

Publication Number Publication Date
JPS59135170U true JPS59135170U (ja) 1984-09-10
JPH0215588Y2 JPH0215588Y2 (enExample) 1990-04-26

Family

ID=30157988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983027093U Granted JPS59135170U (ja) 1983-02-28 1983-02-28 超精密用デイスペンサ−

Country Status (1)

Country Link
JP (1) JPS59135170U (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120028967A (ko) * 2009-06-03 2012-03-23 무사시 엔지니어링 가부시키가이샤 액체 정량 토출 방법 및 장치
JP2012129288A (ja) * 2010-12-14 2012-07-05 Canon Machinery Inc 液体供給装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795269U (enExample) * 1980-12-02 1982-06-11
JPS57161465U (enExample) * 1981-04-02 1982-10-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795269U (enExample) * 1980-12-02 1982-06-11
JPS57161465U (enExample) * 1981-04-02 1982-10-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120028967A (ko) * 2009-06-03 2012-03-23 무사시 엔지니어링 가부시키가이샤 액체 정량 토출 방법 및 장치
JP2012129288A (ja) * 2010-12-14 2012-07-05 Canon Machinery Inc 液体供給装置

Also Published As

Publication number Publication date
JPH0215588Y2 (enExample) 1990-04-26

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