JPS59130675A - Solder tank - Google Patents

Abstract

PURPOSE:To improve additionally soldering performance by providing two jet ports in the upper part of a solder tank to generate jet waves and further forming rugged waves in the jet waves. CONSTITUTION:The solder melt 5 in a solder tank 4 is pressurized as an impeller 12 rotates. The pressurized solder melt flows through a flow pipe 11 and enters a jet tank 6, where the solder asends in jet ports 7, 8 and arrives at jet bodies 13, 14. The solder is ejected from respective through-holes 17, 18 in an arrow D direction and forms jet waves 5a, 5b; it also forms many rugged waves 5c, 5d. More specifically, the solder melt 5 gushes out at the through-holes 17, 18 of the jet bodies 13, 14 and flows circumferentially and therefore the height of the melt 5 increases and many rugged waves 5c, 5d are formed on the peaks of the waves 5a, 5b in the direction intersecting with the traveling direction of a printed circuit board 1.

Description

DETAILED DESCRIPTION OF THE INVENTION This invention provides a first jet port and a second jet port arranged in a t+m-order arrangement with respect to the running direction of a printed circuit board above a jet tank of a solder bath.
Two jet ports are formed, and a large number of uneven waves are formed on the top surface of the jet waves of the solder melt ejected from these jet ports, and the uneven waves of each jet wave are aligned with the running direction of the printed circuit board. This invention relates to solder baths that intersect and are moved in opposite directions.

Conventionally, when soldering a single chip component such as a resistor or capacitor temporarily attached with adhesive, or a printed circuit board with densely packed electronic components using a jet of melted solder, the direction of travel of the printed circuit board is On the other hand, the parts behind the chip components and the parts where each chip component is close to each other have a four-part shape, where air and other gases stay and prevent the solder melt from flowing in. In some cases, the adhesive did not adhere, or even if it adhered, a hollow portion was formed and the adhesive did not adhere completely. Moreover, if air bubbles are generated during one soldering process, there is a drawback that the air bubbles cannot be removed even if a jet of solder melt is applied for a long period of time.

This invention was made to eliminate the above-mentioned drawbacks, and in order to eliminate incomplete soldering caused by bubbles,
To provide a solder tank in which two jet ports are provided above the solder tank to generate jet waves, and uneven waves are formed in the jet waves to further improve adhesion of solder melt. The present invention will be explained below based on the drawings.

Figures 1(a), (b), and (c) show an embodiment of the present invention, with Figure 1(a) being a partially cutaway front view;
Figure 1(b) is an enlarged side sectional view taken along the line X-X of Figure 1(a), and Figure 1(,c) is an enlarged perspective view of the main part of Figure 1<a>. be. In these figures, reference numeral 1 denotes a printed circuit board, which is attached to a carrier of the device by soldering (not shown). 2 is a chip component such as a resistor or a resistor that is temporarily attached to the printed circuit board 1 with adhesive or the like; 3 is soldering (not shown) (1 shows the entire solder bath of the device; 4)
5 is a solder tank body, 5 is a solder melt, 6 is a jet tank installed in the solder body 4, and 7 and 8 are the main parts of the present invention. The second jet port is formed so that its longitudinal direction is perpendicular to the traveling direction of the printed circuit board 1 (the direction of arrow entry in FIG. 1(b)), and the printed circuit board
They are arranged sequentially with respect to the 0 travel direction person. The top of the jet port 8 is formed higher than the top of the lower jet in accordance with the inclination angle θ of the printed circuit board 1 in the running direction. Reference numeral 9 denotes an impeller that pressurizes and forcibly circulates the solder melt 5, and is rotated in a fixed direction by a motor 10.

11 is a flow tube, and 12 is a reflux port through which the solder melt 5 flows back. 13.14 is a cylindrical jet; 15.degree. and 16 are engagement portions formed in the longitudinal direction at the bottom of the jet 13.14, and are slidably engaged with the jet lower 8. Numerous through holes 17 and 18 are formed from the circumferential surface above the jet 13.degree. 140 toward the horizontal surface of the retaining portion 15.16, and are arranged in the longitudinal direction of the jet 13.degree.

19.20 is a piston that reciprocates the jet fluid 13.14 in the directions of arrows B and C in FIG. 1(c), and so that the directions of arrows B and C are opposite to each other;
1°22 to the jet fluid 13.14.

Paste, motor 10. The pistons 19 and 20 are provided away from the running direction so that they do not interfere with the running of the printed circuit board 10.

Next, the operation will be explained.

The solder melt 5 accommodated in the solder tank main body 4 is pressurized by the rotation of the impeller 9 driven by the motor 10, enters the jet tank 6 through the flow v11, and flows through the jet lower and 8. It rises and reaches the jet fluid 13.14 through each through hole 17. '1 Jet waves 5a, 5 eject from B in the direction of the arrow in Figure 1 (b).
b, and a large number of uneven waves 5c and sd are also formed. That is, the jet i3. , 14 through holes 17, 18
At this point, the solder melt 5 gushes out and flows around, so the height of the solder thin liquid 5 becomes crystallized and jet waves 5a, 5b are formed.
The running direction of the printed circuit board 1 (Cbl in Fig. 1,
A large number of uneven waves 5c and 5d are formed in a direction intersecting with (the direction of arrow A in C1).

At the same time, the jet fluid 13 is
．． 14 also repeats the reciprocating motion in the directions of arrows B and C, so the large number of uneven waves 5 c + 5 d also repeats the outward movement in the directions of arrows B and C.

Further, the printed circuit board 1 is temporarily attached with a chip component 2 using # additive, etc., tied up, then subjected to Franks treatment, preheated by lJl+1 in a preheating device, and transported to a soldering bath 3. It will be done. The printed circuit board 1 is soldered in the solder bath 3 as shown in Figure 1 (
As shown in tel, the vehicle travels in the direction of the arrow at an upward angle θ with respect to the horizontal line. Then, the jet wave 5a of the solder melt 5
, 5b, and the rear part of the chip component 2 with respect to the running direction A of the printed circuit board 1 due to the large number of concave and convex waves 5c and 5d that alternately move across the printed circuit board 10. The air bubbles attached to the concave-shaped areas where the chip components 2 are close to each other are removed. The solder melt 5 adheres well to the wire.

Figures 2(a) and <b) show another embodiment of the present invention, in which a worm-shaped rotating body is provided at the jet port, and Figure 2(a) is a plan view of the main part. FIG. 2(h) is a sectional view taken along the line Y--Y in FIG. 2(a). In these figures, reference numerals 31 and 32 indicate the first point provided at the upper part of the jet tank 6. a second jet port, 33° 34 is the jet port 31';
A worm-shaped rotating body provided at 32, 35.36 is a threaded portion of the rotating body 33.34, and uneven waves 5 are formed on the top surfaces of the jet waves 5a, 5b of the solder melt 5 jetted from the jet ports 31.32.
c.

5d and serves as a means for moving the uneven waves 5c, 5d in the axial direction.
It is formed by recesses 39 and 40. Reference numerals 41 and 42 denote the rotation shafts of the rotary bodies 33 and 34, which are rotatably supported by the jet ports 31 and 32, and can be rotated forward and backward by the motor 43.

Next, the operation will be explained.

The solder melt 5 accommodated in the solder tank main body 4 is pressurized by rotation of the vane tube 9 driven by the motor 10, enters the °C jet tank 6 through the flow pipe 11, and enters the jet port 31, 32. 2(b) in the direction of arrows R and F1 in FIG.
It erupts from 6. 1 and the recess 3 of the rotating body 33, 34
At the points 9 and 40, a large amount of solder melt 5 is ejected, so the height of the solder melt 5 becomes high, and at the protrusions 37 and 38, a small amount is ejected, so the height of the solder melt 5 becomes high. The printed circuit board 1 is lowered to the top surface of the jet waves 5a and 5b.
A large number of uneven waves 5c and 5d are formed in a direction intersecting the zero travel direction (the direction of the arrow in FIG. 2(b)).

At the same time, the motor 43 is also driven, and the rotating body 33.
The threaded portions 35 and 36 apparently move in the directions of the upward arrows H and I (the direction perpendicular to the direction of arrow entry, which is the running direction of the printed circuit board 1 shown in FIG. 2 (al)). , when the solder melt 5 passes through the concave portions 39.degree. 40 in the directions of arrows E and F, the side surfaces 37a and 38a of the convex portions 37 and 38 move in the directions of arrows H and I, resulting in jet waves. The uneven waves 5c and 5d on the top surfaces of 5a and 5b are also indicated by the arrow H,
Move in direction I. Next, when the motor 43 is driven in reverse, the rotating bodies 33 and 34 rotate in the direction opposite to the direction of arrow G.
Therefore, the uneven waves 5c and 5d on the top surface also move in the direction opposite to the direction of arrow H2.

By repeating the forward and reverse rotation of the motor 4-3 in this manner, the large number of uneven waves 5c and 5d are alternately moved in the direction of arrow C and in the opposite direction.

Note that the motor 43 does not necessarily have to be rotated in forward and reverse directions, but may be rotated in one direction.

As explained above, the present invention provides a jet tank in which the solder tank body contains circular solder melt, and the solder melt is pressurized by an impeller (1) to forcefully circulate the solder melt, and In a soldering bath, a printed circuit board on which electronic components are mounted is soldered by a jet wave emitted from a jet port provided in a soldering bath, in which a first jet port and a second jet port are arranged sequentially in the running direction of the printed circuit board. The jet waves are formed at the two jet ports, and the top surface of the jet waves ejected from these jet ports is arranged in a direction that intersects the running direction of the printed circuit board to form a large number of uneven waves. Since means are provided for moving a large number of uneven waves in directions opposite to each other and intersecting with the running direction of the printed circuit board, the uneven waves on the top surface of the jet waves can be moved in a direction that intersects with the running direction of the printed circuit board. Due to this, air bubbles or gas may be present in the rear or both sides of the chip components in the running direction of the printed circuit board, in the concave-shaped areas where the chip components are close to each other, and in the areas where the lead wires are densely packed. Soldering has the advantage that performance can be further improved because the stagnation of solder can be removed and the solder melt can be completely spread.

[Brief explanation of drawings]

FIGS. 1(a), (b), and (C) show an embodiment of the present invention; FIG. 1(a) is a partially cutaway front view;
Figure 1 (b) is an enlargement (L
llI sectional view, FIG. 1(C) is an enlarged perspective view of the main part of FIG. 1(a), and FIGS. 2(a) and (b) show an example of the song of this invention. FIG. 2(a) is a plan view of the main part, and FIG. 2(1) is a sectional view taken along the line Y--Y in FIG. 2(a). In the figure, 1 is a printed circuit board, 2 is a chip component, 3 is a solder tank, 4 is a solder tank body, 5 is a solder melt, 5a, 5b are jet waves, 5c, 5d are uneven waves, 6 is a jet tank, 7 .8 is a jet port, 9 is an impeller, 1o is a motor, 11 is a flow pipe, 12
is the reflux port, 13.14 is the jet fluid, 15.16 is the retaining part,
17.18 is the through hole, 19.20 is the piston, 21.22
is a rondo.

Claims (1)

[Claims] A jet tank is provided in which the solder melt is stored in the solder tank body, and the solder melt is pressurized by an impeller and forced to circulate.The jet waves ejected from the jet port provided above the jet tank generate electronic In the solder M for soldering to a printed circuit board on which a component is mounted, the jet ports are arranged sequentially in the running direction of the printed circuit board, such as a first jet port and a second jet port.
A large number of uneven waves are formed in the two jet ports of the jet port, and a large number of uneven waves are formed on the top surface of the jet waves ejected from these jet ports in a direction parallel to the running direction of the printed circuit board, and the large number of uneven waves are The waves intersect with the running direction of the printed circuit board, and the many uneven waves are directed in opposite directions.
We have provided means for each to move! A cold soldering bath.