JPS59125631A - Sealing casting method - Google Patents
Sealing casting methodInfo
- Publication number
- JPS59125631A JPS59125631A JP84483A JP84483A JPS59125631A JP S59125631 A JPS59125631 A JP S59125631A JP 84483 A JP84483 A JP 84483A JP 84483 A JP84483 A JP 84483A JP S59125631 A JPS59125631 A JP S59125631A
- Authority
- JP
- Japan
- Prior art keywords
- curing
- resin
- sealed
- agent
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005266 casting Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 18
- 238000007789 sealing Methods 0.000 title claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 238000002347 injection Methods 0.000 claims abstract description 11
- 239000007924 injection Substances 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 abstract description 10
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- 238000005303 weighing Methods 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. alone Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、半辱体素子等の電子部品の熱硬化性樹脂によ
る封止注型方法の分野に属するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention belongs to the field of a method for sealing and casting electronic parts such as semicircular body elements with a thermosetting resin.
従来、電子部品を使用環境から保護するため合成樹脂で
封止することが多いかこの際、合成樹脂としては粉末状
成形材料乃至パテ状成形材料を用いるので封止成形時の
成形圧力によって＊ｍ、“微妙な電子部品に変形、歪を
与んたり、封止か不完蛍となりホイドを発生させたりし
ていた。Conventionally, electronic components are often sealed with synthetic resin to protect them from the environment in which they are used.In this case, the synthetic resin used is a powdered molding material or a putty-like molding material, so the molding pressure during sealing molding may cause *m ``It was causing deformation and distortion to delicate electronic components, and the sealing was incomplete, causing hoids.
本発明の目的は上記欠点を解決するもので、封止する電
子ｉＡ５品に変形、歪を与入ることなく、先金に封止で
き且つ安価な成形金型を使用できる利点のある封止注型
方法を提供することにあるっ〔発明の開示〕
本発明は電子部品の熱硬化性樹脂による封止注型時に、
注型直前に樹脂成分と硬化剤成分とを混合し、θ〜５０
撃 の注入圧力で成形金型内に充満せしめることを特徴
とする封止注型方法で、以下本発明の詳細な説明する。The object of the present invention is to solve the above-mentioned drawbacks, and to provide a sealing compound that can be sealed in a lead metal without causing deformation or distortion to the electronic iA5 product to be sealed, and which has the advantage of using an inexpensive molding die. [Disclosure of the Invention] The present invention provides a molding method for molding electronic components using a thermosetting resin.
Immediately before casting, mix the resin component and curing agent component,
The present invention will be described in detail below using a sealing casting method characterized in that the mold is filled with an injection pressure of about 100 ml.
本発明に用いる熱硬化性樹脂は、エポキシ樹脂、フェノ
ール樹脂、ウレタン樹脂、不飽和ポリエステル樹脂等の
単独、混合物、変性物等の二液硬化型熱硬化性侮脂全般
で特に限定樹脂ものではない。史に本＋ａ明の封止注型
方法に用いる熱硬化性樹脂には必要に応じて硬化剤、硬
化促進剤、触媒、架橋剤、充填剤、補強剤、晧型剤、着
色剤、界面活性剤、カップリング剤等を加えろことかで
きるものである。樹脂成分と硬化剤成分との混合方法は
ミキサ一方法、スクリュ一方法、拡散集中反復方法、ス
プレ一方法等の混合シラ法全般か適用され特に限定する
ものではないが好ましくは自動材ｊ仕方式、連、Ｉ：、
’ａ方式で且つ使用後の渭掃の１ｊＲ単なスクリュ一方
法か望ましい。更に硬化時間調整と混合時の粘度低下り
ため混合装置に刀１１熱方式が付加されていることが望
ましいことである。注入圧力は（１〜５０暫か必要であ
る。即し５０着 をこえると封止する電子部品に反形、
歪を与えるからであＱ Ω
以下木り、１明の一例を図示実施例にもとすいて説明す
る。The thermosetting resin used in the present invention is not particularly limited to two-component thermosetting resins such as epoxy resins, phenol resins, urethane resins, unsaturated polyester resins, etc. alone, mixtures, modified products, etc. . The thermosetting resin used in the sealing casting method of Fumihon+aaki may contain a curing agent, a curing accelerator, a catalyst, a crosslinking agent, a filler, a reinforcing agent, a molding agent, a coloring agent, and a surfactant as necessary. It is possible to add agents, coupling agents, etc. The method of mixing the resin component and the curing agent component may be any general mixing method such as a mixer method, a screw method, a diffusion concentration repetition method, a spray method, etc., and is not particularly limited, but an automatic method is preferable. , Ren, I:,
It is preferable to use the 'a method and a 1JR simple screw method for cleaning after use. Furthermore, it is desirable that the mixing device be equipped with a heat method to adjust the curing time and reduce the viscosity during mixing. The injection pressure must be between 1 and 50 degrees.
This is because distortion is caused by Q Ω.The following description will be made by referring to an example of the first light in the illustrated embodiment.
実施例
エポキシ悦脂（シェル化学株式会社製、品名エピコート
８２８ ） １００鍬柘部（以下単に都と記））に対し
粉末シリカ１００部を加乙た（釣瓶成分１を憾脂タンク
２に入れ、別にＮアミノエチルピペラジ２１００部に対
しイミダゾール１０部を加えた硬化剤成分３を硬化剤タ
ンク４に入れ計−ポンプ５番こより細胞成分１００部に
対し硬化剤成分１１都が自動計量されスクリューミキサ
ー６に、！す入され注入［１７から注入圧力５驚て予じ
め電子部品８をセ・ストした成形金型９に封止注型され
刺止注型品］０を州、た〔発明の効果〕
実施例での電子部品の変形、歪、充填不足による不良率
が０．５％であるのｌこ比較し、粉末状エポキシ樹脂成
形材料によるトランスファー成形での封止成形では電子
部品の変形、歪、充填不足による不良率は５％あり本発
明の封止注型方法の優れていることを確認した。Example 100 parts of powdered silica was added to 100 parts of epoxy resin (manufactured by Shell Chemical Co., Ltd., product name Epicote 828) (hereinafter simply referred to as Miyako). Separately, hardening agent component 3, which is made by adding 10 parts of imidazole to 2100 parts of N-aminoethyl piperazine, is put into the hardening agent tank 4, and 11 parts of the hardening agent component are automatically measured from the pump No. 5 to 100 parts of the cell component. 6, the injection pressure 5 was applied from 17, and the injection molded product was sealed and cast into the mold 9 in which the electronic component 8 had been set in advance] 0 was made by the state [invention [Effect] Compared to the defect rate of 0.5% due to deformation, distortion, and insufficient filling of electronic components in the example, the rate of failure due to deformation, distortion, and insufficient filling of electronic components was 0.5%. The defect rate due to deformation, distortion, and insufficient filling was 5%, confirming the superiority of the sealing casting method of the present invention.
第１図は本弁明の一実施例を示す簡略工程図である。
１は樹脂成分、２は樹脂タンク、３は硬化剤成分、４は
硬化剤タンク、５は計量ポンプ、６はスクリューミキサ
ー、７は注入口、８は電子部品、９は成形金型、１０は
封止注型品である。
力１FIG. 1 is a simplified process diagram showing an embodiment of the present invention. 1 is a resin component, 2 is a resin tank, 3 is a curing agent component, 4 is a curing agent tank, 5 is a metering pump, 6 is a screw mixer, 7 is an injection port, 8 is an electronic component, 9 is a molding die, 10 is a It is a sealed cast product. power 1
Claims (1)
ｉｌに樹脂成分と硬化剤成分とを混合し、０〜５０′Ｍ
の注入肚力で成形金型内に光調せしめることを特徴とす
る封圧注型方法。Direct casting when sealing electronic parts with thermosetting resin.
Mix the resin component and curing agent component with il, and add 0 to 50'M
A confining pressure casting method characterized by adjusting the light inside the mold by the injection force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP84483A JPS59125631A (en) | 1983-01-06 | 1983-01-06 | Sealing casting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP84483A JPS59125631A (en) | 1983-01-06 | 1983-01-06 | Sealing casting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59125631A true JPS59125631A (en) | 1984-07-20 |
Family
ID=11484934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP84483A Pending JPS59125631A (en) | 1983-01-06 | 1983-01-06 | Sealing casting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59125631A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7008575B2 (en) | 1999-12-16 | 2006-03-07 | Dai-Ichi Seiko Co., Ltd. | Resin sealing mold and resin sealing method |
-
1983
- 1983-01-06 JP JP84483A patent/JPS59125631A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7008575B2 (en) | 1999-12-16 | 2006-03-07 | Dai-Ichi Seiko Co., Ltd. | Resin sealing mold and resin sealing method |
| US7413425B2 (en) | 1999-12-16 | 2008-08-19 | Dai-Ichi Seiko Co., Ltd. | Resin sealing mold and resin sealing method |
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