JPS59124310A - Photosemiconductor device - Google Patents

Abstract

PURPOSE:To enable the use of an ordinary stem and to permit easy handling in a production stage by providing a stem mounted with a photosemiconductor element chip and a cap which fixes an optical fiber and is provided integrally with a mounting flange. CONSTITUTION:A cap 8 which fixes an optical fiber 2 is united to a flange 7 for fixing a photosemiconductor device to a circuit substate, etc. An ordinary semiconductor stem is used for a stem to be mounted with a photosemiconductor element chip 10. If the chip 10 is a light emitting element, a prescribed voltage is impressed to the chip 10 via leads 9, 9' to emit light. The emitted light is detected via the fiber 2 and the stem 5 is fixed and sealed to the cap 8 by means of a resin 11' in the position where the detecting intensity is max. The positioning operation is accomplished while the cap 8 fixed with the fiber 2 is kept fixed, whereby the handling is made easy and the cost of package is made low.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to semiconductor devices, and particularly to improvements in the mounting structure of optical semiconductor devices.

(b) Prior Art and Problems Pig-til type devices are often used as optical semiconductor devices used in optical fiber communications.

As shown in FIG. 1, this pig-tilt type optical semiconductor device has a pan cage 1.0 which accommodates an optical semiconductor element chip. Optical fiber called Bingchiil2. and the optical plug 3 are optically coupled to form an integrated structure.

The pan cage 1 constituting this Bingtil type optical semiconductor device uses a 4-inch male threaded stem 5 as shown in FIG. 1, and a flange 7 having a screw hole 6 as shown in FIG. There are some that use a stem 5, and the male thread 4 or flange 7 can be used to attach it to a desired part of a circuit board or the like.

The optical fiber 2 is attached by penetrating the top of the cap 8 bonded to the top surface of the stem 5, and is optically coupled to one tip or an optical semiconductor element chip (not shown) fixed to the top surface of the stem 5. An optical plaque 3 is attached to the other end, and can be connected to a transmission fiber or the like by inserting it into a fiber connector (not shown) fixed to the housing. Although not shown, it is also possible to make a permanent connection directly to a transmission connector fiber without using a fiber connector.

In this way, the chip type optical semiconductor device allows the chip to be set in a desired part of the circuit, requires short wiring, and does not pick up or emit noise, making it easy to use.

As described above, in the Bingtil type optical semiconductor device, the camp is for fixing the optical fiber, and the stem is for attaching to the circuit board, etc., so both require a special structure, making the package expensive.

In addition, in the manufacturing process of optical semiconductor devices in which optical semiconductor devices are manufactured using parts with the above configuration, only the stem can be fixed in position, and the optical fibers, which require careful handling, This requires an unstable operation in which both camps for fixing the optical fiber are aligned with respect to the fixed stem and then fixed.

fc) Purpose of the Invention The purpose of the present invention is to provide an optical semiconductor device which can be manufactured using a normal inexpensive stem and has an improved camp structure that is easy to handle in the manufacturing process. be.

(dl) Structure of the Invention The present invention is characterized by comprising a stem on which an optical semiconductor element chip is mounted, and a cap for fixing an optical fiber optically coupled to the optical semiconductor element chip, and The installation is based on the fact that the flange is integrally provided.

tel　Embodiments of the invention An embodiment of the present invention will be described below with reference to the drawings.

FIG. 3 is a perspective view showing the external appearance of an embodiment of the present invention, and FIG. 4 is a cross-sectional perspective view of FIG. 3. As seen in both figures, in this embodiment, the cap 8 that fixes the optical fiber 2 is
Flange 7 for fixing the optical semiconductor device to a circuit board, etc.
The stem 5 on which the optical semiconductor element chip 10 is mounted uses an ordinary semiconductor body stem.

To manufacture the optical semiconductor device of this embodiment, first, the optical fiber 2 is fixed to the camp 8 with resin 11, and then it is inserted into a predetermined position using the slot 6 provided in the flange 7. Fix it in a jig.

On the other hand, an optical semiconductor element chip 1O is fixed to a predetermined position on the stem 5, and an electrode (not shown) provided on the surface of the chip 10 is insulated and fixed to the base of the stem 5 with glass or the like. It is connected to the lead 9 by a thin metal wire (not shown).

Next, the stem 5 is placed at a predetermined position under the cap 8 so that the tip 9 and the tip of the optical fiber 2 are substantially opposed to each other.

When the optical semiconductor element chip 10 is a light emitting element, a predetermined voltage is applied to the chip 10 through the leads 9.9'' to cause it to emit light, and this emitted light is detected through the optical fiber 2. The stem 5 is fixed and sealed to the camp 8 with a resin 11' at a position where the light intensity is maximum. When the chip 10 is a light receiving element, light is made to enter from the other end of the optical fiber 2, and this is Receive light with chip 1O,
The stem 5 is fixed and sealed to the cap 8 so that the output current or output voltage detected through "9.9" is maximized.

In this embodiment, the positioning work in the above process can be performed while the camp 8 to which the optical fiber 2 is fixed is fixed. Therefore, there is no need to apply any external force to the easily damaged optical fiber 2 throughout the process, and alignment can be achieved by simply moving the stem 5 in the X and Y directions. Therefore, alignment work and sealing work become stable and easy.

Furthermore, as is already clear (in this embodiment), a special stem is not required and a stem used for producing a normal semiconductor device can be used, so the packaging cost is reduced.

In the above-described embodiment, the flange 7 is provided on the side wall of the camp 8, but the flange 7 is not limited to the side wall of the camp 8, but may be placed on the lower side, upper side, or the lower side.

(f) As described in detail, according to the present invention, it is possible to use an inexpensive stem when producing an optical semiconductor device,
Moreover, the manufacturing process becomes stable and easy.

[Brief explanation of the drawing]

FIGS. 1 and 2 are perspective views for explaining a conventional optical semiconductor device, and FIGS. 3 and 4 are a perspective view and a cross-sectional perspective view of a main part showing an embodiment of the present invention. In the figure, ■ is the package, 2 is the optical fiber, and 4 is the 1
1L screw, 5 is a stem, 6 is a mounting hole, 7 is a flange, 8 is a cap, 10 is an optical semiconductor element chip, 11.1
1' indicates resin.

Claims (1)

[Claims] It comprises a stem on which an optical semiconductor element chip is mounted, and a camp on which an optical fiber optically coupled with the optical semiconductor element chip is fixed, and a flange for attachment to the cap is integrally provided. An optical semiconductor device characterized by: