JPS59120062U - soldering probe - Google Patents

soldering probe

Info

Publication number
JPS59120062U
JPS59120062U JP1405483U JP1405483U JPS59120062U JP S59120062 U JPS59120062 U JP S59120062U JP 1405483 U JP1405483 U JP 1405483U JP 1405483 U JP1405483 U JP 1405483U JP S59120062 U JPS59120062 U JP S59120062U
Authority
JP
Japan
Prior art keywords
probe
holes
soldering
electronic components
soldering probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1405483U
Other languages
Japanese (ja)
Other versions
JPS6347418Y2 (en
Inventor
唐沢　洋一
中尾　斉
志野　英男
小松　俊史
Original Assignee
松島工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松島工業株式会社 filed Critical 松島工業株式会社
Priority to JP1405483U priority Critical patent/JPS59120062U/en
Publication of JPS59120062U publication Critical patent/JPS59120062U/en
Application granted granted Critical
Publication of JPS6347418Y2 publication Critical patent/JPS6347418Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Measuring Leads Or Probes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はヒートプローブ方法の従来例。第２図はプロー
ブ形状の従来例。第３図は本出願人の先願になる電子部
品のはんだ付は装置の実施例。第４図、第５図は本考案
の実施例。 １３はプローブ、１４は通孔、１５は壁。Figure 1 shows a conventional example of the heat probe method. Figure 2 shows a conventional example of the probe shape. Figure 3 is an example of an apparatus for soldering electronic components, which was filed in the applicant's earlier application. Figures 4 and 5 show examples of the present invention. 13 is a probe, 14 is a through hole, and 15 is a wall.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 通孔を電子るプローブと、該プローブと摺動可能であっ
て、該プローブの通孔と同一ピッチで通孔が形成されて
いるカッタ一部とを有している電子部品のはんだ付は装
置の、該プローブには少な・くとも複数個の通孔が形成
され、該通孔のそれぞれは一定の高さを有する壁により
仕切られた構成であることを特徴とする電子部品のはん
だ付は装置。A device for soldering electronic components that has a probe that makes through holes, and a part of a cutter that is slidable with the probe and that has through holes formed at the same pitch as the through holes of the probe. The soldering of electronic components is characterized in that at least a plurality of through holes are formed in the probe, and each of the through holes is partitioned by a wall having a certain height. Device.
JP1405483U 1983-02-02 1983-02-02 soldering probe Granted JPS59120062U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1405483U JPS59120062U (en) 1983-02-02 1983-02-02 soldering probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1405483U JPS59120062U (en) 1983-02-02 1983-02-02 soldering probe

Publications (2)

Publication Number Publication Date
JPS59120062U true JPS59120062U (en) 1984-08-13
JPS6347418Y2 JPS6347418Y2 (en) 1988-12-07

Family

ID=30145428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1405483U Granted JPS59120062U (en) 1983-02-02 1983-02-02 soldering probe

Country Status (1)

Country Link
JP (1) JPS59120062U (en)

Also Published As

Publication number Publication date
JPS6347418Y2 (en) 1988-12-07

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