JPS59117191U - Solder dip type insulation support - Google Patents
Solder dip type insulation supportInfo
- Publication number
- JPS59117191U JPS59117191U JP1012183U JP1012183U JPS59117191U JP S59117191 U JPS59117191 U JP S59117191U JP 1012183 U JP1012183 U JP 1012183U JP 1012183 U JP1012183 U JP 1012183U JP S59117191 U JPS59117191 U JP S59117191U
- Authority
- JP
- Japan
- Prior art keywords
- dip type
- insulation support
- solder dip
- type insulation
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す図、第２図は本考案の
他の実施例を示す図、第３図は第１図お ・よび第２
図の実施例をＧ方向側面から示す図、第４図は第３図の
実施例のＨ−Ｈ’での切断面を示す図、および第５図は
本考案の使用例を示す図である。
第１図から第５図において、１・・・・・・絶縁体、２
・・・・・・リード線、３・・・・・・めねじ、４・・
・・・・ロック、５・・・・・・電子回路パッケージ、
６・・・・・・スルーホール、７・・・・・・他の部品
、８・・・・・・ハンダディップ型絶縁サポート、９・
・・・・・ねじ。
Ｈ−ＩＩＯノ −
９・」“
＾’＃ ） ｙで］
（１） （１）
／’ １FIG. 1 is a diagram showing one embodiment of the present invention, FIG. 2 is a diagram showing another embodiment of the present invention, and FIG. 3 is a diagram showing one embodiment of the present invention.
FIG. 4 is a view showing the embodiment shown in the figure from the side in the G direction, FIG. 4 is a view showing a cross section taken along line H-H' of the example shown in FIG. 3, and FIG. . In Figures 1 to 5, 1...Insulator, 2
...Lead wire, 3...Female thread, 4...
...Lock, 5...Electronic circuit package,
6... Through hole, 7... Other parts, 8... Solder dip type insulation support, 9...
·····screw. H-IIOノ-9・"＾'#) yで】 (1) (1) /' 1
Claims (1)
の空間に取付けるための絶縁体と、前記電子回路パッケ
ージにハンダディップするために前記絶縁体の一端に固
着された少な（とも１本のリード線と、 他の部品を取付けるために前記絶縁体の他端に設けられ
た取付具とを含むことを特徴とするハンダディップ型絶
縁サポート。[Claims for Utility Model Registration] An insulator for mounting other components in any space on the component surface of an electronic circuit package, and an insulator fixed to one end of the insulator for solder dipping to the electronic circuit package. A solder dip type insulating support, characterized in that it includes a lead wire and a fitting provided at the other end of the insulator for attaching other components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1012183U JPS59117191U (en) | 1983-01-27 | 1983-01-27 | Solder dip type insulation support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1012183U JPS59117191U (en) | 1983-01-27 | 1983-01-27 | Solder dip type insulation support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59117191U true JPS59117191U (en) | 1984-08-07 |
Family
ID=30141571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1012183U Pending JPS59117191U (en) | 1983-01-27 | 1983-01-27 | Solder dip type insulation support |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59117191U (en) |
-
1983
- 1983-01-27 JP JP1012183U patent/JPS59117191U/en active Pending
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