JPS5911636A - ボンデイング装置 - Google Patents
ボンデイング装置Info
- Publication number
- JPS5911636A JPS5911636A JP57119866A JP11986682A JPS5911636A JP S5911636 A JPS5911636 A JP S5911636A JP 57119866 A JP57119866 A JP 57119866A JP 11986682 A JP11986682 A JP 11986682A JP S5911636 A JPS5911636 A JP S5911636A
- Authority
- JP
- Japan
- Prior art keywords
- moving coil
- bonding
- wire
- pressing force
- cam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/07178—
-
- H10W72/075—
-
- H10W72/07502—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57119866A JPS5911636A (ja) | 1982-07-12 | 1982-07-12 | ボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57119866A JPS5911636A (ja) | 1982-07-12 | 1982-07-12 | ボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5911636A true JPS5911636A (ja) | 1984-01-21 |
| JPH0213818B2 JPH0213818B2 (enExample) | 1990-04-05 |
Family
ID=14772201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57119866A Granted JPS5911636A (ja) | 1982-07-12 | 1982-07-12 | ボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5911636A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60235432A (ja) * | 1984-05-09 | 1985-11-22 | Toshiba Corp | ワイヤボンデイング装置 |
| JPS63155627A (ja) * | 1986-12-18 | 1988-06-28 | Mitsubishi Electric Corp | ワイヤボンデイング装置 |
| US5180094A (en) * | 1991-02-27 | 1993-01-19 | Kaijo Corporation | Wire bonder with bonding arm angle sensor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5214352A (en) * | 1975-07-25 | 1977-02-03 | Hitachi Ltd | Equipment for wirebonding |
| JPS5345970A (en) * | 1976-10-07 | 1978-04-25 | Tesu Kk | Apparatus for bonding |
| JPS5615631A (en) * | 1979-07-14 | 1981-02-14 | Nakajima Seisakusho | Poultry breeding apparatus using low height container |
-
1982
- 1982-07-12 JP JP57119866A patent/JPS5911636A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5214352A (en) * | 1975-07-25 | 1977-02-03 | Hitachi Ltd | Equipment for wirebonding |
| JPS5345970A (en) * | 1976-10-07 | 1978-04-25 | Tesu Kk | Apparatus for bonding |
| JPS5615631A (en) * | 1979-07-14 | 1981-02-14 | Nakajima Seisakusho | Poultry breeding apparatus using low height container |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60235432A (ja) * | 1984-05-09 | 1985-11-22 | Toshiba Corp | ワイヤボンデイング装置 |
| JPS63155627A (ja) * | 1986-12-18 | 1988-06-28 | Mitsubishi Electric Corp | ワイヤボンデイング装置 |
| US5180094A (en) * | 1991-02-27 | 1993-01-19 | Kaijo Corporation | Wire bonder with bonding arm angle sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0213818B2 (enExample) | 1990-04-05 |
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