JPS59111403A - High frequency circuit - Google Patents
High frequency circuitInfo
- Publication number
- JPS59111403A JPS59111403A JP57222480A JP22248082A JPS59111403A JP S59111403 A JPS59111403 A JP S59111403A JP 57222480 A JP57222480 A JP 57222480A JP 22248082 A JP22248082 A JP 22248082A JP S59111403 A JPS59111403 A JP S59111403A
- Authority
- JP
- Japan
- Prior art keywords
- stub
- circuit element
- circuit
- matching
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Waveguides (AREA)
Abstract
Description
【発明の詳細な説明】
この発明はUHFあるいは8HF等の信号を取シ扱う高
周波回路に関するもので、詳しくは縦列状に接続された
回路要素相互間の整合をとるようにしである高周波回路
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a high frequency circuit that handles signals such as UHF or 8HF, and specifically relates to a high frequency circuit that matches circuit elements connected in series. It is.
この種の高周波回路にあっては、前段側の回路要素と後
段側の回路要素とを接続する接続導体にスタブの一端を
接続すると共にそのスタブの先端側に予備の導体を備え
させておき、必要に応じて即ち後段側の回路要素の特性
に合わせてボンディングワイヤーでそれらスタブと予備
の導体とを接続して整合をとるようにしたものが知られ
ている。In this type of high-frequency circuit, one end of the stub is connected to a connecting conductor that connects a circuit element on the front side and a circuit element on the rear side, and a spare conductor is provided at the tip of the stub. It is known that the stub and the spare conductor are connected with bonding wires to achieve matching according to the characteristics of the circuit elements on the subsequent stage side as needed.
しかしながらそのような構造のものは、上記のボンディ
ングワイヤーの接続を行なう為に半田ごてての半田付と
いう煩わしい作業が必要で、1その作業性が悪いという
欠点があった。However, such a structure has the drawback that the troublesome work of soldering with a soldering iron is required to connect the bonding wires, and the workability is poor.
そこで本発明は、上述の欠点を除くように己たもので、
後段側の回路要素に特性が異なるものが用いられた場合
でも良好に整合をとることができ、しかもその作業を容
易に行ない得るようにした高周波回路を提供しようとす
るものである。Therefore, the present invention has been devised to eliminate the above-mentioned drawbacks.
It is an object of the present invention to provide a high frequency circuit which can achieve good matching even when circuit elements having different characteristics are used in the subsequent stage, and which can be easily matched.
以下本願の実施例を示す図面について説明する。The drawings showing the embodiments of the present application will be described below.
1は基板で、低損失の誘電体材料(絶縁体材料)でもっ
て形成されている。またこれは比較的軟らかい(ナイフ
を当てたときに凹陥する程度の)材質のもの(−例とし
てテフロン)を用いて、−例としてo、tm厚に形成し
である。2は入力端で、ここには導波管−同軸変換器が
接続される。3は出力端で、ここには次段の増幅器、コ
/バーク−等が接続される。4.4・・・は接続部を示
す。5゜5・・・は夫々接続導体で、夫々接続部4相互
及び接続部4と入力端2、出力端3とを結ぶものである
。7は整合用めスタブで、その元部7aは接続導体5の
中間部に接続されている。このスタブ7の幅及び長さL
lは、周知の如くスタブ7の設けられた場所の前段側と
後段側のインピーダンス整合及びノイズマツチができる
ように定められるものであり、−例としては夫々1.7
3;m前後、3゜73Wl1前後に定められる。また接
続導体5に対する元部7aの接続場所も同様にして定め
られる。Reference numeral 1 denotes a substrate, which is made of a low-loss dielectric material (insulator material). Moreover, this is made of a relatively soft material (teflon, for example) that is relatively soft (to the extent that it will dent when touched with a knife), and is formed to have a thickness of, for example, 0.05 mm. 2 is an input end, to which a waveguide-coaxial converter is connected. 3 is an output end, to which the next stage amplifier, co/bark, etc. are connected. 4.4... indicates a connection part. Reference numerals 5, 5, . . . are connecting conductors, which connect the connecting portions 4 to each other and the connecting portions 4 to the input end 2 and the output end 3, respectively. Reference numeral 7 denotes a matching stub, the base portion 7a of which is connected to the intermediate portion of the connecting conductor 5. The width and length L of this stub 7
As is well known, l is determined so as to achieve impedance matching and noise matching between the front and rear stages of the location where the stub 7 is provided, and is, for example, 1.7.
It is set at around 3;m, around 3°73Wl1. Further, the connection location of the base portion 7a to the connection conductor 5 is determined in the same manner.
8は礼状の欠如部で、スタブ7の一部をエツチング手段
によシ除去して形成しである。その形状は図示される如
き角孔の外、楕円孔でもよい。また形成場所は、元部7
aから欠如部8の位置までの長さL2が後段側の回路要
素として使用が予定されている第2順位のものの電気的
特性に適合して、その要素について整合状態を達成でき
る場所(その場所は例えば実験によって求められる)に
設定しである。尚本例の場合、Ll =2.23mとし
である。また欠如部8の寸法はa == 7.、l 3
tytSb =、0.2311Mとしである。9.lO
は電源供給端、11゜νはマイクロ波阻止用のコイルを
夫々示す。尚上記符号2 、3 、4 、5 、7 、
9 、10 、11 、12で示される部材は基板1の
一面に貼着した銅箔(その厚みは例えば/IPm)をも
って形成(例えば印刷配線手段)しである。次に、u、
14は接続部4に接続したコンデンサで、直流を阻止し
マイクロ波を通す為のものである。bは増幅素子として
例示するFETで、16はゲート、17はドレインを夫
々示し、これらの端子は接続部に接続しである。8 is a missing portion of the thank you note, which is formed by removing a portion of the stub 7 by etching means. Its shape may be an elliptical hole in addition to the square hole shown in the figure. The formation location is the original part 7.
A location where the length L2 from a to the position of the missing portion 8 is compatible with the electrical characteristics of the second order circuit element that is planned to be used as a subsequent circuit element, and a matching state can be achieved for that element (that location). is determined, for example, by experiment). In this example, Ll = 2.23 m. Also, the dimension of the missing portion 8 is a == 7. , l 3
tytSb =, 0.2311M. 9. lO
denotes a power supply end, and 11°ν denotes a microwave blocking coil. Note that the above symbols 2, 3, 4, 5, 7,
The members indicated by 9, 10, 11, and 12 are formed (for example, by printed wiring means) of copper foil (its thickness is, for example, /IPm) adhered to one surface of the substrate 1. Next, u,
14 is a capacitor connected to the connecting portion 4, which is used to block direct current and pass microwaves. b is an FET illustrated as an amplifying element, 16 is a gate, 17 is a drain, and these terminals are connected to a connection part.
凪は接地導体で、基板1の裏面全面に貼着しである。Nagi is a ground conductor and is attached to the entire back surface of the board 1.
上記構成のものにあっては、電源供給端9,10に直流
電源が接続されると、それからの直流はコイルu、12
を介してFET1fiに供給され、FET迅は増幅動作
をする。すると入力端2から入力されたマイクロ波信号
(例えば弘GHz)・は接続導体5、コンデンサ塾、接
続導体5を介してFET迅のゲート加に入力され、増幅
される。増幅されたマイクロ波はドレイン17から出力
され、接続導体5、コンデンサ14、接続導体5を介し
て出力端3から出力される。この場合、スタブ7の存在
によ2てコンデンサトとFET15の間の整合及びFE
T15とコンデンサ14との間の整合が良好に行なわれ
る1、従って上記マイクロ波は効率良く伝達される。尚
本件明細書中においては、第1図において左側のスタブ
7を中心として見た場合はコンデンサ邦を前段回路要素
、FET5を後段回路要素と呼び、右側のスタブ7を中
心として見た場合はFET15を前段回路要素、コンデ
ンサ14を後段回路要素と呼ぶ。In the above configuration, when a DC power source is connected to the power supply terminals 9 and 10, the DC power is supplied to the coils u and 12.
The signal is supplied to the FET1fi through the FET1fi, and the FET1fi performs an amplification operation. Then, the microwave signal (for example, GHz) inputted from the input terminal 2 is inputted to the gate of the FET via the connecting conductor 5, the capacitor, and the connecting conductor 5, and is amplified. The amplified microwave is outputted from the drain 17 and outputted from the output end 3 via the connecting conductor 5, the capacitor 14, and the connecting conductor 5. In this case, the presence of the stub 7 allows the matching between the capacitor and the FET 15 and the FE
The matching between T15 and the capacitor 14 is good 1, so the microwave is efficiently transmitted. In this specification, when the stub 7 on the left side of FIG. 1 is viewed as the center, the capacitor 5 is referred to as the front-stage circuit element, and the FET 5 is referred to as the rear-stage circuit element, and when the stub 7 on the right side is viewed as the center, the FET 15 is referred to as the front-stage circuit element. is called a front-stage circuit element, and the capacitor 14 is called a rear-stage circuit element.
次に、FET1fiあるいはコンデンサ13 、14と
して種類の異なるものを用いる場合には、その利用する
要素について整合状態が得られるようにスタブ印にスタ
ブ7の先部を切離す。この切り離しはどのようにして行
なってもよいが、次のようにして行なうのが好ましい。Next, when different types of FET 1fi or capacitors 13 and 14 are used, the tip of the stub 7 is cut off at the stub mark so that a matching state can be obtained for the elements to be used. Although this separation may be performed in any manner, it is preferable to perform it as follows.
即ち、先ずナイフ20の先20aを欠如部8に当てがい
ナイフ加を矢印X方向にすべらせ、縁部8&を切断する
。次にナイフ加の先201kを前回とは反対向きに欠如
部8に当てがい、ナイフ頷を矢印Y7向にすべらせ、縁
部8bを切断する。これによシスタブ7は第J、4.7
図に示される如き状態となシ、長さL2の部分が整合用
のスタブとして作用するようになる。尚上記切断の場合
、基板lがやや軟質であるとその基板1の表面がナイフ
加の先20aによって窪まされる為、上記ナイフ美をす
べらせての切断を容易に行なうことができる。That is, first, the tip 20a of the knife 20 is applied to the missing portion 8, and the knife is slid in the direction of the arrow X to cut the edge 8&. Next, apply the tip 201k of the knife to the missing portion 8 in the opposite direction to the previous one, slide the tip of the knife in the direction of arrow Y7, and cut the edge 8b. This makes systub 7 J, 4.7
In the state shown in the figure, the length L2 portion comes to act as a stub for alignment. In the case of the above-mentioned cutting, if the substrate 1 is somewhat soft, the surface of the substrate 1 will be depressed by the knife tip 20a, so that the cutting can be easily performed by sliding the knife.
次に本願の異なる実施例を示す図面第g図について説明
する。この図は二つの欠如部80を設けた例を示すもの
である。このようなものにあっては、前述の如き長さ調
整に当って、後段回路要素の特性に適合する側の欠如部
8eの箇所で切断を行なえばよい。上記欠如部8eの数
はより多数にしてもよい。この場合あるいは二つの場合
、それらを設ける位置は、後段回路要素として用いられ
るものの種類が予めわかっている場合には、それらの各
々について個々に整合状態を得ることができる位置に夫
々定めればよく、そうでない場合には後段回路要素がい
ずれの種類のものであっても適合させ得るよう所定間隔
で配列しておくとよい。Next, FIG. g of the drawing showing a different embodiment of the present application will be explained. This figure shows an example in which two cutouts 80 are provided. In such a case, when adjusting the length as described above, it is sufficient to cut the cutout portion 8e on the side that matches the characteristics of the subsequent stage circuit element. The number of the missing portions 8e may be increased. In this case or in two cases, if the type of circuit element to be used as a subsequent stage circuit element is known in advance, it is only necessary to set the positions at positions where matching can be achieved individually for each of them. If this is not the case, it is preferable to arrange them at predetermined intervals so as to be compatible with any type of subsequent circuit elements.
なお、機能上前図のものと同−又は均等構成と考えられ
る部分には、前回と同一の符号にアルファベットのeを
付して重複する説明を省略した。It should be noted that parts that are considered to have the same or equivalent structure as those in the previous figure in terms of function are given the same reference numerals as in the previous figure with the letter e, and redundant explanations are omitted.
以上のようにこの発明にあっては、基板1には前段回路
要素と後段回路要素とを夫々配設すると共に、それらは
基板1の表面に添着した接続導体5で接続し、更に上記
接続導体5の中間部には、基板の表面に添着した整合用
のスタブ7の元部7aを接続した構成であるから、
(イ)高周波信号を前段回路要素から接続導体5を介し
て後段回路要素に伝達する場合には、両回路要素をスタ
ブ7によって整合させることができて上記高周波信号を
効率良く伝達できる効果がある。As described above, in the present invention, the front-stage circuit element and the rear-stage circuit element are respectively arranged on the board 1, and are connected by the connecting conductor 5 attached to the surface of the board 1, and furthermore, the above-mentioned connecting conductor 5, the base part 7a of the matching stub 7 attached to the surface of the board is connected. When transmitting, both circuit elements can be matched by the stub 7, which has the effect of efficiently transmitting the high frequency signal.
しかもこの発明にあっては、上記構成に加えて、上記ス
タブ7の中間部には、夫々切離し位置指示用のl又は2
以上の礼状の欠如部8を具備させ、しかもその位置は、
上記元部7aから先端部7bまでの長さLlと、元部7
aから欠如部8までの長さL2の違いによるスタブの電
気的特性の違いの度合が、上記後段回路要素の種別の違
いによるその要素の電気的特性の違いの度合に対応した
値となる位置に定めであるから、上記(イ)の効果を有
するぞΩ上に、
←)後段回路要素としてn気的特性の異なるものを用い
た場合には、上記スタブ7において上記欠如部8から先
の部分を切シ離して、その用いられた後段回路要素につ
いて上記(イ)の如き整合状態を得ることができ、種々
の要素に対処できる適応性がある。Moreover, in this invention, in addition to the above configuration, the intermediate portion of the stub 7 is provided with a l or 2 for indicating the separation position.
The above thank you note missing part 8 is provided, and its position is as follows.
The length Ll from the base portion 7a to the tip portion 7b and the base portion 7
A position where the degree of difference in the electrical characteristics of the stub due to the difference in the length L2 from a to the missing portion 8 corresponds to the degree of difference in the electrical characteristics of the latter circuit element due to the difference in type. Therefore, it has the effect of (a) above. ←) When using circuit elements with different n-temperature characteristics as the subsequent circuit elements, the stub 7 has the effect of By separating the parts, matching conditions as described in (a) above can be obtained for the subsequent circuit elements used, and there is flexibility to deal with various elements.
(ハ)しかも上記切離しをする場合には、上記欠如部8
が礼状の構成数、欠如部8の両縁に残存するわずかな部
分sa、Bbを切断するだけでよく、作業を容易に行な
い得る効果がある。(c) Moreover, when the above-mentioned separation is performed, the above-mentioned missing part 8
However, it is only necessary to cut the small portions sa and Bb remaining on both edges of the missing portion 8, which makes the work easier.
に)その上、上記礼状である故、切断時には、第7に、
ナイフ加の先20&を欠如部8に当てかった後そのナイ
フを移動させて一方の縁部8aを切断し、次に、ナイフ
の先を再び欠如部に前回とは反対向きに当てかった後他
方の縁部8bを前回とは反対方向にナイフを移動させて
切断できる特長がある。) Moreover, since it is the above letter of appreciation, at the time of cutting, seventhly,
After applying the tip 20& of the knife to the missing part 8, move the knife to cut one edge 8a, and then apply the tip of the knife again to the missing part in the opposite direction from the previous time. It has the advantage that the other edge 8b can be cut by moving the knife in the opposite direction to the previous cut.
このことは、切断時にナイフがずれて切断すべきでない
箇所を切断してしまうことを防止できて、精度よく所定
箇所を切断できる効果がある上に、基板1の傷みも2箇
所に分散された夫々小さなものにできる効果がある。This has the effect of preventing the knife from shifting during cutting and cutting an area that should not be cut, allowing the user to cut a predetermined area with high precision, and also allows damage to the board 1 to be distributed over two areas. Each has the effect of making it smaller.
図面は本願の実施例を示すもので、第7図はマイクロ波
増幅器の平面図、第2図はスタブ付近の部分斜視図、第
3図はl−H9t断面図ζ第を図は切断状態を示す斜視
図、第5図、第6図は夫々切断後の状態を示す斜視図及
び平面図、第7図はv■−■線断面図、第1図は異なる
実施例を示す平面図O
1・・・基板、5・、・・接続導体、7・・・スタブ、
8・・・欠如部。
第1図
ざべ
第2図
a
7g
第3図
第4図 第6図
第5図
4
beThe drawings show an embodiment of the present application, and FIG. 7 is a plan view of the microwave amplifier, FIG. 2 is a partial perspective view of the vicinity of the stub, and FIG. 5 and 6 are respectively a perspective view and a plan view showing the state after cutting, FIG. 7 is a sectional view taken along the line v■-■, and FIG. 1 is a plan view showing a different embodiment. ... Board, 5... Connection conductor, 7... Stub,
8... Missing part. Figure 1 zabe Figure 2 a 7g Figure 3 Figure 4 Figure 6 Figure 5 4 be
Claims (1)
と共に、それらは基板の表面に添着した接続導体で接続
し、更に上記接続導体の中間部には、基板の表面に添着
した整合用のスタブの元部を接続している高周波回路に
おいて、上記スタブの中間部には、夫々切離し位置指示
用の/又は2以上の礼状の欠如部を具備させ、しかもそ
の位置は、上記元部から先端部までの長さと、元部から
欠如部までの長さの違いによるスタブの電気的特性の違
いの度合が、上記後段回路要素の種別の違いによるその
要素の電気的特性の違いの度合に対応した値となる位置
に定めたことを特徴とする高周波回路。A front-stage circuit element and a rear-stage circuit element are respectively arranged on the board, and they are connected by a connecting conductor attached to the surface of the board, and a matching conductor attached to the surface of the board is located in the middle of the connecting conductor. In a high-frequency circuit connecting the bases of the stubs, the middle part of the stub is provided with two or more thank-you note missing parts for indicating the disconnection position, and the positions thereof are different from the base part. The degree of difference in the electrical characteristics of the stub due to the difference in length to the tip and the length from the base to the missing portion is the same as the degree of difference in the electrical characteristics of the latter circuit element due to the difference in type. A high frequency circuit characterized in that the high frequency circuit is set at a position where a corresponding value is obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57222480A JPS59111403A (en) | 1982-12-17 | 1982-12-17 | High frequency circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57222480A JPS59111403A (en) | 1982-12-17 | 1982-12-17 | High frequency circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59111403A true JPS59111403A (en) | 1984-06-27 |
JPH0212401B2 JPH0212401B2 (en) | 1990-03-20 |
Family
ID=16783078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57222480A Granted JPS59111403A (en) | 1982-12-17 | 1982-12-17 | High frequency circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59111403A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0477001A (en) * | 1990-07-16 | 1992-03-11 | Matsushita Electric Ind Co Ltd | High frequency filter |
US6016084A (en) * | 1996-12-27 | 2000-01-18 | Canon Kabushiki Kaisha | Method for connecting printed circuit board with housing, and electronic instrument having connection structure according to the connecting method |
EP1045626A1 (en) * | 1999-04-16 | 2000-10-18 | Delphi Technologies, Inc. | Method for high resolution trimming of PCB components |
-
1982
- 1982-12-17 JP JP57222480A patent/JPS59111403A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0477001A (en) * | 1990-07-16 | 1992-03-11 | Matsushita Electric Ind Co Ltd | High frequency filter |
US6016084A (en) * | 1996-12-27 | 2000-01-18 | Canon Kabushiki Kaisha | Method for connecting printed circuit board with housing, and electronic instrument having connection structure according to the connecting method |
EP1045626A1 (en) * | 1999-04-16 | 2000-10-18 | Delphi Technologies, Inc. | Method for high resolution trimming of PCB components |
Also Published As
Publication number | Publication date |
---|---|
JPH0212401B2 (en) | 1990-03-20 |
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