JPS59109152U - semiconductor heat sink - Google Patents
semiconductor heat sinkInfo
- Publication number
- JPS59109152U JPS59109152U JP127483U JP127483U JPS59109152U JP S59109152 U JPS59109152 U JP S59109152U JP 127483 U JP127483 U JP 127483U JP 127483 U JP127483 U JP 127483U JP S59109152 U JPS59109152 U JP S59109152U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor heat
- semiconductor
- aluminum
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、半導体放熱器の構成図、第２図は、半導体放
熱器の使用方法を説明する図、第３図は、本考案の一実
施例の信頼性試験の結果を他の表面 パ処理品として
比較して示した図である。
１・・・軸体、２・・・放熱用フィン、３ａ、 ３ｂ
・・・放 ゛熱器、４・・・半導体装置、５ａ、
５ｂ・・・電極板。Fig. 1 is a block diagram of a semiconductor heatsink, Fig. 2 is a diagram explaining how to use the semiconductor heatsink, and Fig. 3 shows the results of a reliability test of an embodiment of the present invention on other surfaces. It is a diagram showing a comparison of treated products. 1... Shaft body, 2... Heat radiation fins, 3a, 3b
... Heat sink, 4... Semiconductor device, 5a,
5b...electrode plate.
Claims (1)
ミニウム合金製の円柱状軸体２個の間に半導体装置を挾
み、前記軸体を通して通電するとともに前記半導体装置
を冷却する半導体放熱器において、前記軸体の両端面罎
こアルミニウム用半田のメッキ被膜を設けたことを特徴
とする半導体放熱器。In the semiconductor heat radiator, a semiconductor device is sandwiched between two cylindrical shafts made of aluminum or aluminum alloy, each of which has heat radiation fins provided in its body, and the semiconductor device is cooled while electricity is supplied through the shafts. A semiconductor heat sink characterized in that both end faces of the shaft are plated with solder for aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP127483U JPS59109152U (en) | 1983-01-11 | 1983-01-11 | semiconductor heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP127483U JPS59109152U (en) | 1983-01-11 | 1983-01-11 | semiconductor heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59109152U true JPS59109152U (en) | 1984-07-23 |
| JPS6322679Y2 JPS6322679Y2 (en) | 1988-06-22 |
Family
ID=30133004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP127483U Granted JPS59109152U (en) | 1983-01-11 | 1983-01-11 | semiconductor heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59109152U (en) |
-
1983
- 1983-01-11 JP JP127483U patent/JPS59109152U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6322679Y2 (en) | 1988-06-22 |
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