JPS59105241A - Manufacture of color cathode-ray tube - Google Patents

Abstract

PURPOSE:To obtain a flat type color cathode-ray tube strongly coated with color phosphor without color discrepancy by performing electron ray irradiation throught a selection means of the beam attainment position while coating a panel with a photoscreen film and a resist film. CONSTITUTION:The inside of a cathode-ray tube panel 1 is coated with a conductive photoscreen film 21 and a resist film 22. An electron beam is made to scan through a selection means 9 of the electron beam attainment position in order to etch a photoscreen film 21. Phosphor slurry 23 of the first color is applied and exposed from outside of the panel 1 in order to perform development treatment of the first slurry pattern Thereon an exfoliation 24 is formed and the electron ray irradiation corresponding to the second color is performed followed by development treatment. Further, the slurry 25 of the second color is applied by the means similar to the above for forming the second phosphor pattern and further similarly the third phosphor pattern is made to be formed. By said method, the cathode-ray tube, in which color phosphor is selectively applied to the prescribed position, can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a color cathode ray tube having a color phosphor surface formed by separately painting color phosphors of at least two colors, particularly to a color phosphor surface of an electron beam. The present invention relates to a method for manufacturing a color cathode ray tube that is suitable for application to, for example, a flat color cathode ray tube whose flight trajectory is complex and noticeably different in each part of the phosphor surface.

Background Art and Problems Therein, as shown in FIG. 1, a flat color cathode ray tube has, for example, a pair of dish-shaped front panel portions (1) and rear panel portions (2) that have frits on their mutually opposing surfaces. A flat space (3) is formed between both panels (1) and (21), and a neck pipe (4) is similarly fritted extending in the plane direction of this flat space (3). Flat tubular body (
5) is formed.

Inside the neck tube (4) is an electron gun (7) that emits three electron beams e (only one electron beam is shown in the diagram) corresponding to the three primary colors red, green, and blue, for example.
are arranged, and a color fluorescent surface (8) is attached to the inner surface of one panel part fi+, and the color fluorescent surface ( 8) Electron beam arrival position selection means (such as a so-called shadow mask or aperture grill) that reaches the phosphor of each color above (
9) is placed. In addition, a fluorescent surface (8) K is made of, for example, a metal electrode plate, and faces the fluorescent surface (8) with the electron beam arrival position selection means (9) sandwiched between the inner surfaces of the other panel (2). Back electricity! (11) are arranged so that a first deflection system is formed between the fluorescent surface (8) and the back electrode (lO).

Further, between the first deflection system and the electron gun (7), there is provided horizontal and vertical deflection means αD for horizontally and vertically scanning the electron beam b on the fluorescent surface (8). This deflection means (I
For example, the IJ may be configured to use electromagnetic deflection for horizontal deflection, and electrostatic deflection for horizontal deflection. +13 is a magnetic core made of an annular high magnetic permeability ferrite, etc., which is provided around the outer circumference of the tube (5) between the first deflection system and the electron gun (7), and the thickness of the tube (5) For example, electromagnetic deflection wires (13a) and (13b) for transmitting a pair of horizontal deflection currents are provided so as to face each other with respect to the electron gun (7).
A horizontal deflection magnetic field is applied to the path of each electron beam emitted from the electron beam.

Between the pair of wire rings (13a) and (13b) is a deflection plate (2) which also serves as a plate-shaped internal pole piece having the required conductivity of the pair.
14a) and (] 4b) are provided between these internal pole pieces and electrostatic deflection plates (10a) and (10b) so that the magnetic flux between the wire rings (13a) and (13b) is efficiently directed to the path of each electron beam. A vertical deflection electric field is applied between these deflection plates (14a) and (14b) to impart vertical deflection to each electron beam.

A high voltage of 8.0 V, for example, is applied to the fluorescent surface (7), a lower high voltage, for example 4.77 kV, is applied to the back electrode (101*, i), and the deflection plate (14a)
and (14b), e.g. 4.30kV to 5.24
kV (D deflection voltage is given.

In the figure, (151) is a stud pin provided with a frit on the inner surface of the panel (1), and a spring ++61 welded to the frame of the electron beam arrival position selection means (9) is engaged with this stud pin a1. (9) is fixed to a predetermined portion of the panel +11.

In such a flat color cathode ray tube, an electron gun (
7) Each electron beam corresponding to each color, e.g., red, green, and blue, emitted from the fluorescent surface (8) is placed opposite the electron beam arrival position selection means (9). It is designed to land (reach) on each color of phosphor on the light surface (8). However, in such a cathode ray tube, the electron gun (7)
Since the extension direction of the electron beam and the plane direction of the fluorescent surface (8) are arranged almost parallel to each other, the electron beams of each color landing on the fluorescent surface (8) are directed toward the side closer to the electron gun (7), for example. The flight trajectory is significantly different when scanning the electron gun (downward), when scanning a position t (hereinafter referred to as above) farther from the electron gun (force), and when scanning horizontally on the fluorescent surface. , they land on various parts of the fluorescent surface (8) with a complicated flight trajectory, that is, with complicatedly different angles of incidence.

In a normal color cathode ray tube manufacturing method, when forming the color fluorescent surface, the electron beam is replaced with light, and the fluorescent material is applied to the fluorescent surface using the above-mentioned means for controlling the electron beam arrival position as a mask. A method is adopted in which the slurry is optically baked to differentiate the coating. In this case, the exposure equipment requires selection of the exposure light source position so that the angle of incidence of light on each position of the fluorescent surface corresponds to the angle of incidence of each electron beam corresponding to the operating state of the cathode ray tube, and a correction lens. The correction is made according to the following.

However, in flat color cathode ray tubes such as those mentioned above, where the trajectory of the electron beams of each color with respect to the fluorescent surface changes significantly and complexly at each position, it is difficult to replace the electron beams of each color with light. Optical printing requires a large amount of movement of the light source position and requires a complicated correction lens, and the phosphor of each color is painted in a predetermined position, that is, the position where each color of electron beam reaches, so that there is no color shift. It is extremely difficult or impossible to obtain a flat color cathode ray tube.

Purpose of the Invention The present invention provides a method for obtaining a color fluorescent surface in a flat color cathode ray tube as described above, in which the trajectory of the electron beam corresponding to each color is complex. To obtain a color cathode ray tube with excellent image quality by making it possible to reliably apply color phosphors of each color to predetermined positions and to firmly adhere the colors without fading. It is.

SUMMARY OF THE INVENTION In the present invention, first, in the cathode ray tube panel on which a color fluorescent surface is to be formed, for example, in the flat type color cathode ray tube explained in FIG. The stud pin (151) used for attaching the electronic beam arrival position selection means (9) consisting of an aperture grill with a large number of slits arranged in one direction, for example, to determine the arrival position of the beam, is pre-fitted with a frit or the like. (Beforehand) (Fix it in place on the flannel (1).

In this state, the inner surface of the ohm channel has conductivity, and it also has high light noise properties with respect to the wavelength of light used in the exposure process to the color phosphor slurry, which will be described later. A light-shielding film is applied which does not affect the characteristics of the phosphor slurry and which is not damaged by the phosphor slurry. Then, a positive type electron beam resist +16 is applied on this light shielding film. This positive electron beam resist film is a resist film that is made to have a low molecular weight and become soluble by irradiation with an electron beam.

With the above-mentioned beam arrival position selection means such as an aperture grill attached to a predetermined position on the panel on which the light-shielding film and the positive electron beam resist film have been deposited, (1) '#@: is used to construct a substantially flat cathode ray tube by installing it in an electron beam irradiation device that performs electron beam scanning in the same operating state as in the final completed cathode a-tube. Under operating conditions similar to those in a flat color cathode ray tube, i.e., an electron beam arrival position selection means corresponding to one color, for example, red, from an electron gun is used to improve the resist 1 described above on a horizontal screen. The first electron beam irradiation was performed by horizontal and vertical scanning using the deflection means (ID), and then the panel was removed from the above-mentioned apparatus, and the electron beam arrival position selection means attached thereto was removed, and the exposure processing was performed by electron beam irradiation. The resist film is developed to dissolve and remove the beam-irradiated pattern.Then, this resist film is used as an etching film, and the light-shielding film underneath is selectively etched away.In this way, the first pattern is removed. The color, e.g. the scanning position of the red electron beam, and therefore the φ at which the red phosphor should be obtained
The inner surface of the panel is exposed to the outside, and a phosphor slurry of a first color, for example, red in this example, is applied to the entire surface including this portion. Thereafter, the phosphor slurry is exposed to light from the outer surface of the panel (i.e., using the light-shielding film as a mask) to bake the phosphor slurry. Thereafter, the phosphor slurry is subjected to a development process. The unexposed phosphor slurry blocked by the light-shielding film is removed to form a first phosphor pattern, that is, a red phosphor pattern, on which the phosphor slurry is selectively applied. A peeling film is formed on the phosphor pattern to obtain releasability for the second phosphor slurry that is subsequently formed thereon, and then the electron beam arrival position selection means is moved to the predetermined position 1c in the same manner as described above. : At the end of the process, the resist film is subjected to a second electron beam irradiation treatment by horizontally and vertically scanning an electron beam corresponding to a second color, for example, green, under the same operating conditions as the flat tube to be finally obtained. In the same manner as described above, the development treatment of the positive electron beam resist film and the etching of the light shielding film are carried out in addition to the second process.
A second phosphor, for example a green phosphor pattern, is formed by coating the phosphor slurry and exposing and baking the phosphor slurry from the outside of the panel. In this way, the KT phosphor patterns are sequentially formed to form a phosphor surface on which the phosphor patterns of each color, red, green, and blue are painted separately.

EXAMPLE Next, an example of a method for manufacturing a color cathode ray tube according to the present invention will be explained in detail with reference to FIG. 2 and subsequent figures.

In this example, the flat color cathode MA tube described in FIG. 1 is obtained. First, the panel (11 is a flat tube body (5
) is a stud made of ceramic, for example, used for attaching the electron beam arrival position selection means (9) as explained in Fig. Bottle (151
frit.

In this state, as shown in Figure 2, on the inner surface of the panel (1),
For example, it has a thickness of 1000 to 2000 and has a light shielding property against exposure light, such as ultraviolet rays, for the phosphor slurry described below.
A conductive light-shielding film (21) made of a vapor-deposited film of AQ of
EBI (-1000 (product name manufactured by Tokyo Ohka Co., Ltd.) or AZ
-1350 (trade name manufactured by Shipley) is applied. In this case, the thickness of the resist film (22) is selected to be, for example, 5000X, which is within the range of the resist film at the acceleration voltage during electron beam irradiation to be performed later. Dry at 150°C for about 30 minutes.

Thereafter, this panel (1) is mounted, for example, in an electron beam irradiation equipment that can be installed under the same operating conditions as the color cathode ray tube to be finally obtained. In this case, at a predetermined position on the inner surface of the nonnel fi+, a triplet beam remote position selection means (+51, as shown in FIG. This 'θ: child beam irradiation device is fixed by a stud bottle (151 (not shown)) with a rear electrode ill, 1 which should face the panel (1).
As mentioned above, the device is equipped with a directing means (group, etc.) and can set the same conditions as the flat negative LF tube to be finally obtained. In this state, the degree of vacuum inside the device is set to, for example, 1. I'o
rr, for example, the above-mentioned 8 in the shadow / birch tube that finally obtains the fluorescent surface M position, the back electrode potential is 4.77 kV, and the deflection voltage is about 4.3 to 5.24 kV.
kV and first irradiate only the electron beam eR corresponding to the color red, for example, to resist 11% +22)
Electron beam travel for K [L electron beam arrival position 13 selection means (9), for example, aperture grill sulin) (9
Through a), the resist film G21 is irradiated with the electron beam only at the position where the electron beam eR corresponding to red in the finally obtained color cathode ray tube lands.

Next, this panel (1) is removed from the electron beam irradiation device, and further the electron beam arrival position selection means (9) is removed from this panel (1), and the positive electron beam resist film +22 on the inner surface of the panel (11) is removed. Develop with a prescribed developer.In this way, as shown in Figure 4, the electron beam corresponding to red will land on the area irradiated with the electron beam, that is, on the color fluorescent surface that will be finally obtained. The resist a f2a from which only the positions have been removed is patterned into a first pattern.

Next, as shown in FIG. 5, using this patterned resist film (22) as a mask, etching is applied to the lower layer of the light-shielding film, that is, Agg (211), which is exposed to the outside by removing the patterned resist film (22). The light-shielding film 1211 is patterned in a similar pattern.The light-shielding film, that is, the U film, is etched using, for example, an organic alkali etching solution such as NMD-3 (product name manufactured by Tokyo Ohka Co., Ltd.) mixed with one part of NCW6 (+1 A (Wako)). A solution of 0.01 part (product name manufactured by Tsumugi Yakusha) and 3 parts of pure water was mixed with 60
This can be carried out by immersion etching at a temperature of ~70° C. for about 1 to 2 minutes.

Next, as shown in FIG. 6, at least these fil 12 are deposited on the light shielding film (21) and resist film (22) which are laminated with the same pattern on the inner surface of the panel fi+.
A red phosphor slurry (23) is formed over the entire surface including the areas where #11 and #2z have been removed.

The composition of this phosphor slurry is determined by the following composition KR. Here, the water-soluble photo-insolubilized polyvinyl alcohol derivative refers to PVA (polyvinyl alcohol) 1 moJ! % of stilbazolium, which gives PvA photosensitivity without the intervention of dichromate ions. Then, this phosphor slurry +231 is subjected to an exposure treatment using, for example, ultraviolet rays as shown by the arrow a from the outer surface side of the panel (1) to form the phosphor slurry (c).
The portions not shielded by the light shielding film C211 are exposed and cured, that is, baked. In this case, the slurry is
Since the baking is performed from the adhering surface side of the panel (1), the baking on the panel (1) is strongly hardened.

Next, this phosphor slurry IJ-(231) is subjected to a development process, i.e., water washing development, to remove the portions that are not exposed to light and cured.In this way, as shown in FIG. 7, a light-shielding film is formed.
211 and a resist film (a red phosphor pattern R1 having an opposite pattern to 2z, that is, a first phosphor pattern is formed. That is, a pattern corresponding to the electron beam irradiation pattern corresponding to red explained in FIG. 3). is formed.

Next, as shown in FIG. 8, at least a red phosphor pattern R
A release film (2), such as PV, which is cured on the entire surface including the top by ultraviolet irradiation and exhibits releasability to the phosphor slurry (for example, green phosphor slurry) to be described later, which is then applied.
A thin layer 1 is applied on the red phosphor pattern R, which is not shielded from light due to the light shielding film α1, which is coated with 2 layers of film A and is irradiated with ultraviolet rays from the outer surface of panel 11 as shown by the arrow.
Selectively cures odor (24I).

Next, this peeled III +241 K is subjected to a development process, and as shown in FIG. 9, the peeling layer is removed only on the red phosphor pattern R (leaving the chest and other parts).

Next, as shown in Fig. 1, an electron beam arrival position selection means (9) is attached to the panel (1) in the same way as shown in Fig. 3. It is attached to a beam irradiation device that can accommodate increased production conditions, and the inside of the device is maintained at a high degree of vacuum in the same way as described above.Next, an electron beam e corresponding to a second color, for example, green, is finally obtained. A second electron @ irradiation process is performed by scanning the resist film (221) through the means (9) in the same operating state as in the color shaded 4ft ray tube.

After that, the panel (1) is removed from the electron beam irradiation device, and the means (9) is removed from the panel +11.
In the same manner as explained in the figure, the resist + iiJ (23) is developed to form a second pattern, and the resist film formed by this second pattern is then used as an etching resist film and the exposed lower layer is removed. The light-shielding film + 21 of the portion corresponding to the landing position 11 of the electron beam corresponding to green in the color cathode ray tube finally obtained by etching the light 5t2n is removed.

Next, as shown in FIG. 12, one portion of the resist film (2z and the light shielding Imof211) is removed in this way, and the panel (
1) Apply green phosphor slurry 4 to the entire surface including the exposed inner surface. This green phosphor slurry may have the same composition as the red phosphor slurry described above, or it may have a composition in which only the phosphor powder is a green phosphor. In this case as well, as shown by arrow C from the outer surface of the panel (1), for example, an exposure treatment using ultraviolet rays is performed to expose the portions not covered by the phosphor slurry (25+ light-shielding film (21)) with four light beams. A curing light is applied. In this case as well, the baking of this slurry [F] is performed from the panel (11 side).In other words, since it is performed from the adhering surface 4f (!I) of the panel flIK, The attachment is strong.

Next buttonAs shown in FIG. 13, the phosphor slurry (251) is washed and developed, for example, to remove the exposed and hardened portion.
Even in the area where the red phosphor pattern 1 formed by Z removal exists, a certain amount of ultraviolet light is transmitted, and the green phosphor slurry (2ω remains on this pattern R as well, so next Peeling I formed on red phosphor pattern R
C4I is dissolved and removed, for example, with 5 to 10% hydrogen peroxide solution at 40 to 80 DEG C., and the green phosphor slurry formed thereon is removed. In this way, as shown in FIG. 14, no green phosphor slurry remains on the red phosphor pattern R, and the green phosphor slurry is placed at a different position from the red phosphor pattern R, for example. Green phosphor pattern G adjacent to
are painted separately on the panel fil.

Next, as shown in FIG. 15, using the same method as explained in FIG. A release layer (24) is optionally formed.

Next, as explained in FIG. 3, an electron beam arrival position selection means (9) is attached to the panel +11 to correspond to other colors, for example, blue, in the color cathode ray tube finally obtained in the electron beam irradiation device. Only the electron beam eB is used (9
) to irradiate the resist film (22+) with an electron beam.

Thereafter, the resist film (2z) is developed, that is, the resist film area is removed in the same manner as explained in FIGS. has a similar composition to
Slurry C having a blue fluorophore as a fluorophore! ! .theta. as shown in FIG. 17, and from the outer surface of the panel (1), the phosphor slurry +1261 is treated as indicated by the arrow d (for example, by irradiating with ultraviolet rays in the same manner as shown) -1261.

Next, this slurry □□□ is washed and developed, and the release layer (241) on each phosphor pattern R and G is removed using hydrogen peroxide solution in the same manner as described above. Then, as shown in FIG. 18, a phosphor surface is formed on the inner surface of the panel (1) in which red, green and blue phosphor patterns JG and B are respectively painted.

Next, if necessary, as shown in FIG. 19, an interlayer film (271
A metal back Fl F281, that is, an Ag evaporated film is formed through the process.

After that, a baking treatment is applied to the intermediate III,'! (27
1 and each phosphor pattern are subjected to a baking treatment to eliminate organic matter that may cause damage, the phosphor patterns It, G, and B are coated on the inner surface of the panel fil, as shown in FIG. 20, and a metal back layer ( /81 colored fluorescent surface +
2t is obtained. The panel tll on which the color fluorescent surface sickle is formed in this way has a back electrode (
10) and the other panel (2) provided with the electron gun (7).
) is joined with the neck tube (4) etc. into which it is inserted to form the tube body (5), and the interior of the tube is maintained at a high degree of vacuum to produce the desired flat color negative ray tube. Be configured.

Effects of the Invention As mentioned above, according to the manufacturing method of the present invention, the color fluorescent surface is finally obtained by electron beam irradiation, and the pattern is created by electron beam irradiation in the same manner as the electron beam in a color 18-electrode ray tube. As the phosphor slurry of each color is formed by Fluorescent material Ω can be painted differently. Moreover, since the exposure process for each phosphor is performed from the outer surface of panel +11, that is, from the side to which each phosphor pattern is adhered to panel (1) and baked, the phosphor can be adhered with high strength.

As described above, according to the sparseness of the present invention, each phosphor can be reliably painted separately in a predetermined pattern, and can be applied with high strength, so that there is no color discoloration or color bleeding. It is possible to obtain a color cathode ray tube that reproduces high-quality color images without color.

Although the above example is a case in which the present invention is implemented using a flat color cathode ray tube, a cathode 4F ray tube in which the electron gun is disposed in a direction substantially perpendicular to the fluorescent surface may also be used, for example, by post-focusing or post-acceleration. Therefore, it is also effective for continuous use in, for example, a cathode ray tube having an electron beam reaching means having a so-called four-pole configuration.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a main part of a flat color cathode ray tube used for explaining the present invention, and FIGS. 2 to 20 are cross-sectional views of each step of an example of the manufacturing method of the present invention. (5) is a flat tube body, (1) and 12) are its panels, (
4) is a neck part, (9) is an electron beam arrival position selection means, (7) is a kick gun, (IIJ is a horizontal/vertical deflection means,
G and B are phosphor patterns, respectively. ,,4 t t t toga. n 4 zz zt

Claims (1)

[Claims] A step of depositing a conductive light-shielding film on the inner surface of a cathode-ray tube panel on which a color fluorescent surface is to be formed, a step of depositing a positive electron beam resist film on the light-shielding film, and a color cathode-ray tube to be finally obtained. Similarly to the above, an electron beam arrival position selection means is disposed at a predetermined position facing the inner surface of the panel, and the electron beam corresponding to the first color is emitted under the same operating conditions as in the color cathode ray tube to be finally obtained. a first electron beam irradiation step of scanning the resist film through the electron beam arrival position selection means, removing the panel, removing the electron beam arrival position selection means from the panel, and irradiating the resist film with the electron beam; a first resist film development step to obtain a first patterned resist film by removing the resist film; and a first light shielding film etching step to selectively remove the light shielding film by using the resist film as an etching resist. a step of applying the phosphor slurry of the first color to the removed portions of the resist film and the light shielding film; and exposing the phosphor slurry of the first color to light from the outer surface side of the panel. a J-th slurry pattern development step of removing unexposed phosphor slurry shielded by the light-shielding film to form a first phosphor pattern; and a J-th slurry pattern development step for forming a first phosphor pattern; a step of forming a peeled MIFJ on the resist film; and a second step of scanning the resist film with an electron beam corresponding to the second color instead of the electron beam in the first patterning of the resist film.
a second resist film development step for obtaining a second patterned resist film for the resist film; and a second etching step for the light shielding film using the resist film as an etching resist. , applying a phosphor slurry of a second color including the removed portions of the resist film and the light shielding film; exposing the phosphor slurry to light from the outer surface of the panel; 1. A method for manufacturing a color cathode ray tube, comprising the step of developing a second slurry pattern by removing unexposed phosphor slurry to form a second phosphor pattern.