JPS59103458U - Glass substrate for thin film semiconductor devices - Google Patents

Glass substrate for thin film semiconductor devices

Info

Publication number
JPS59103458U
JPS59103458U JP19834082U JP19834082U JPS59103458U JP S59103458 U JPS59103458 U JP S59103458U JP 19834082 U JP19834082 U JP 19834082U JP 19834082 U JP19834082 U JP 19834082U JP S59103458 U JPS59103458 U JP S59103458U
Authority
JP
Japan
Prior art keywords
glass substrate
thin film
film semiconductor
semiconductor devices
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19834082U
Other languages
Japanese (ja)
Inventor
新保 雅文
Original Assignee
セイコーインスツルメンツ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコーインスツルメンツ株式会社 filed Critical セイコーインスツルメンツ株式会社
Priority to JP19834082U priority Critical patent/JPS59103458U/en
Publication of JPS59103458U publication Critical patent/JPS59103458U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図から第4図は、本考案によるガラス基板を用いた
ときのTPT及びその製造プロセスを説明するための図
である。 1・・・・・・ガ゛ラス基板、2・・・・・・psG含
有SiO2膜、3・・・・・・絶縁膜、10・・・・・
−TFT、11.12・・・・・・基板表面の凹凸。
1 to 4 are diagrams for explaining the TPT and its manufacturing process when using the glass substrate according to the present invention. 1... Glass substrate, 2... psG-containing SiO2 film, 3... Insulating film, 10...
-TFT, 11.12...Irregularities on the substrate surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 薄膜半導体装置が形成さるべきガラス基板において、前
記ガラス基板の表面にリンガラスを2〜10%含む酸化
膜を堆積後800°C以上の温度でアニールすることに
より前記酸化膜を少なく共一部に含む絶縁膜を形成して
なる薄膜半導体装置用ガラス基板。
In a glass substrate on which a thin film semiconductor device is to be formed, an oxide film containing 2 to 10% phosphorous glass is deposited on the surface of the glass substrate and then annealed at a temperature of 800° C. or higher to reduce the amount of the oxide film to a common portion. A glass substrate for a thin film semiconductor device formed with an insulating film containing the above.
JP19834082U 1982-12-28 1982-12-28 Glass substrate for thin film semiconductor devices Pending JPS59103458U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19834082U JPS59103458U (en) 1982-12-28 1982-12-28 Glass substrate for thin film semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19834082U JPS59103458U (en) 1982-12-28 1982-12-28 Glass substrate for thin film semiconductor devices

Publications (1)

Publication Number Publication Date
JPS59103458U true JPS59103458U (en) 1984-07-12

Family

ID=30423904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19834082U Pending JPS59103458U (en) 1982-12-28 1982-12-28 Glass substrate for thin film semiconductor devices

Country Status (1)

Country Link
JP (1) JPS59103458U (en)

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