JPS59103364A - Lead frame for resin-sealed type electronic parts - Google Patents
Lead frame for resin-sealed type electronic partsInfo
- Publication number
- JPS59103364A JPS59103364A JP17295283A JP17295283A JPS59103364A JP S59103364 A JPS59103364 A JP S59103364A JP 17295283 A JP17295283 A JP 17295283A JP 17295283 A JP17295283 A JP 17295283A JP S59103364 A JPS59103364 A JP S59103364A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- sealed
- lead frame
- supporting piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
本発明は樹脂封止型半導体装置の製造法に用いるリード
フレームに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead frame used in a method for manufacturing a resin-sealed semiconductor device.
樹脂封止型ＩＣは、各リードフレームが連結した連続フ
レーム群を形成し、各リードフレームに半導体ペレット
を組込み、半導体ペレット、接続コネクタワイヤ及びリ
ード線の内端部を包囲するように樹脂体で封止し、その
後裔ＩＣに切断分離して独立のＩＣにし、その特性検査
及び製品マーク付けを行って製造していた。In a resin-sealed IC, each lead frame is connected to form a continuous frame group, a semiconductor pellet is built into each lead frame, and a resin body is formed so as to surround the semiconductor pellet, the connecting connector wire, and the inner end of the lead wire. It was sealed, then cut and separated into descendant ICs to make independent ICs, and their characteristics were inspected and product markings were applied to manufacture them.
しかし、上記樹脂封止ＩＣの製造は、樹脂封止後、各Ｉ
Ｃに切断分離することから、その後は夫夫独立した樹脂
封止ＩＣとなる。そのため、その後の特性検査及び製品
マーク付は等の作業は独立した封止ＩＣの状態で行わな
ければならない。However, in the production of the resin-sealed IC, each I
Since the IC is cut and separated into C, it becomes an independent resin-sealed IC. Therefore, subsequent work such as characteristic inspection and product marking must be performed on an independent sealed IC.
そこで、これらの作業が複雑化するので、一般には独立
した樹脂封止ＩＣを治具等を用いて整列させて、作業し
易いようにしてから行うようにしている。しかし、この
方法でも整列させるための作業が加わり、結局多くの工
数と時間がかかった。Therefore, since these operations become complicated, the independent resin-sealed ICs are generally aligned using a jig or the like to make the operations easier. However, even with this method, the work to align them was added, and in the end it took a lot of man-hours and time.
本発明は上記欠点を解消するためになされたもので、そ
の目的は樹脂封止型半導体装置の製造における工数及び
時間を減すことによって、作業能率向上及び原価低減を
図るものである。The present invention has been made to eliminate the above-mentioned drawbacks, and its purpose is to improve work efficiency and reduce costs by reducing the number of man-hours and time in manufacturing a resin-sealed semiconductor device.
上記目的を達成するための本発明の実施例の要旨は、樹
脂封止型半導体装置の製造法において、タブの周囲に放
射状にリード線が配設され内端部が幅広くなった樹脂支
持片を配設したリードフレームを複数連結した長尺フレ
ームを用意し、各リードフレームに半導体ペレットを組
込み、その電極と対応リード線間をコネクタワイヤで接
続し、半導体ベレット、コネクタワイヤ リード線の内
端部及び樹脂支持片の内端部を包囲するように樹脂体で
封止し、外部フレームに接続している各リード線の外端
部を切断し必要に応じて同時に各リード線を成形し、外
部フレームに接続している樹脂支持片のみで樹脂体を支
持し、その状態で各半導体装置の特性検査及びマーク付
は等を行い、然る後、樹脂体を支持している樹脂支持片
を樹脂体から引き抜（ことを特徴とするもので、以下本
発明の詳細な説明する。The gist of the embodiment of the present invention for achieving the above object is to provide a method for manufacturing a resin-sealed semiconductor device, in which a resin support piece is provided with lead wires arranged radially around a tab and whose inner end is wide. Prepare a long frame in which multiple lead frames are connected, incorporate a semiconductor pellet into each lead frame, and connect the electrodes and corresponding lead wires with connector wires. Then, seal the inner end of the resin support piece with a resin body, cut the outer end of each lead wire connected to the external frame, and mold each lead wire at the same time as necessary. The resin body is supported only by the resin support piece that is connected to the frame, and in this state, the characteristics of each semiconductor device are inspected and marked, etc., and then the resin support piece that supports the resin body is The present invention is characterized by being withdrawn from the body.The present invention will be described in detail below.
第１図は本発明の一実施例のリードフレームを用いた樹
脂封止型ＩＣの製造法を工程順に示し１こものである。FIG. 1 shows, in order of steps, a method for manufacturing a resin-sealed IC using a lead frame according to an embodiment of the present invention.
（ａ）半導体ベレット８が固定されるべきタブｌを中心
としてリード線２が放射状に配設され、タブ１を支持し
ているタブリード３及び後において半導体ベレット８部
を封止する樹脂体１ｏを支持するために特に設けた内端
に突出する内端部４が幅広くなった樹脂支持片５が図の
ように配置され、それぞれその外端部で外部フレーム６
に接続する各リードフレームが横方向に多数連結した連
続フレーム群を形成する。この連続フレーム群の各リー
ドフレームにはタブリード３及び樹脂支持片５を含む各
リード線２の中間部を接続するように樹脂封止するとき
に樹脂の流れを防止するためのダム（連結片）７が設け
られている。この連続フレーム群は例えばコバール板を
打抜いて形成する。(a) Lead wires 2 are arranged radially around a tab l to which a semiconductor pellet 8 is to be fixed, and a tab lead 3 that supports the tab 1 and a resin body 1o that later seals the semiconductor pellet 8 are connected. Resin support pieces 5 with a widened inner end 4 protruding from the inner end specially provided for support are arranged as shown in the figure, each of which has an outer frame 6 at its outer end.
A number of lead frames connected to each other form a continuous frame group in which a large number of lead frames are connected in the lateral direction. Each lead frame of this continuous frame group is provided with a dam (connection piece) to prevent resin from flowing when resin sealing is performed to connect the intermediate portion of each lead wire 2 including the tab lead 3 and the resin support piece 5. 7 is provided. This continuous frame group is formed by punching out a Kovar plate, for example.
なお、一つのリードフレームは拡大すると第２図に示゛
すようになり、樹脂支持片５は第３図（Ａ）又＜Ｂ）そ
れぞれ大拡大図のように内端突出部４が二叉に別れて広
い幅になっている。Note that when one lead frame is enlarged, it becomes as shown in FIG. 2, and the resin support piece 5 has two protruding inner end portions 4 as shown in the large enlarged views of FIG. 3 (A) and <B). It is divided into wide widths.
（ｂ） 各リードフレームのタブ１に半導体ベレット
８をＡｕ−８ｉ共晶合金を利用して接続固定し、半導体
ベレット８の各電極と対応するリード線２間をそれぞ蛎
コネクタワイヤ（Ａｕ細線）９で接続する。(b) A semiconductor pellet 8 is connected and fixed to the tab 1 of each lead frame using an Au-8i eutectic alloy, and a wire connector wire (Au thin wire ) Connect with 9.
（ｃ） 各リードフレームの半導体ベレット８、半導
体ベレット８と接続するコネクタワイヤ９、コネクタワ
イヤ９が接続しているリード線２の内端部、タブリード
３の内端部及び樹脂支持片５の内端部を包囲するように
図において斜線で示すダム７内を樹脂体１０でそれぞれ
封止する。(c) The semiconductor pellet 8 of each lead frame, the connector wire 9 connected to the semiconductor pellet 8, the inner end of the lead wire 2 to which the connector wire 9 is connected, the inner end of the tab lead 3, and the inner end of the resin support piece 5. The inside of the dam 7 shown by diagonal lines in the figure is sealed with a resin body 10 so as to surround the end portion.
（ｄ）次に打抜き切断により外部フレーム６に接続して
いる各リード線２の外端部、露出するタブリード３の外
端部、ダム７を切断する。このとぎ樹脂支持片５は切断
しないで樹脂体１０を樹脂支持片５のみで支持するよう
にする。この状態、すなわち樹脂支持片５で支持され、
各樹脂封止型半導体装置が外部フレーム６により連結し
た整列したままの状態で各半導体装置の特性検査及びマ
ーク付は等の作業を行う。このように各半導体装置の特
性検査及びマーク付は作業は整列した状態で行われるの
で、能率よく短時間で行われる。なお、各リードＩＷ！
２の外端部を切断するとぎに、同時にリード線の成形を
行うようにしてもよい。(d) Next, the outer end of each lead wire 2 connected to the external frame 6, the exposed outer end of the tab lead 3, and the dam 7 are cut by punch cutting. The resin support piece 5 is not cut and the resin body 10 is supported only by the resin support piece 5. In this state, that is, supported by the resin support piece 5,
While the resin-sealed semiconductor devices are connected to each other by the external frame 6 and aligned, the characteristics of each semiconductor device are inspected, marks are added, and so on. In this way, the characteristic inspection and marking of each semiconductor device are performed in a lined-up state, so that the work can be carried out efficiently and in a short time. In addition, each lead IW!
When cutting the outer end of 2, the lead wire may be formed at the same time.
（ｅｌ 然る後、樹脂体１０を支持している樹脂支持
片５を樹脂体１０から引き抜くことによって、図に示す
ような独立し１こ樹脂封止型ＩＣを製造することができ
る。(el) Thereafter, by pulling out the resin support piece 5 supporting the resin body 10 from the resin body 10, it is possible to manufacture one independent resin-sealed IC as shown in the figure.
なお、樹脂支持片５を引き抜くこ′とにより、樹脂体１
０に引き抜き跡が残るが浅い溝であり、素子特性上何ん
らの影響を与えない。Note that by pulling out the resin support piece 5, the resin body 1 can be removed.
Although a pullout mark remains on the 0, it is a shallow groove and does not affect the device characteristics in any way.
以上実施例で説明し１こよりな本発明によれば、各リー
ド線の切断後も樹脂支持片で樹脂体を支持し整列したリ
ードフレームの状態で各半導体装置の特性検査、マーク
付は等の作業を行うために、これらの作業にあたってあ
らためて半導体装置を整列することはない。また、これ
らの作業後、樹脂体゛を支持していた樹脂支持片は引き
抜くことにより簡単に取り外せる。し１こがって、樹脂
封止型半導体装置の製造工数及び時間を短縮することが
でき、大幅な作業能率向上及び原価低減が図れるもので
ある。According to the present invention, which has been explained in the embodiments above, even after each lead wire is cut, the resin body is supported by the resin support piece, and the characteristics of each semiconductor device are inspected, markings, etc. are carried out in the aligned lead frame state. In order to carry out these operations, there is no need to align the semiconductor devices again. Moreover, after these operations, the resin support piece supporting the resin body can be easily removed by pulling it out. As a result, the number of man-hours and time for manufacturing a resin-sealed semiconductor device can be shortened, and work efficiency can be greatly improved and costs can be reduced.
本発明は上記実施例に限定されるものでなく、樹脂支持
片の形状及びその数は樹脂封止型半導体装置の種類に応
じて変えるものとする。したがって、本発明は樹脂封止
型ＩＣＫ限らず、樹脂封止型トランジスタその他の樹脂
封止型半導体装置の製造に適するものである。The present invention is not limited to the above embodiments, and the shape and number of resin support pieces may be changed depending on the type of resin-sealed semiconductor device. Therefore, the present invention is suitable for manufacturing not only resin-sealed ICKs but also resin-sealed transistors and other resin-sealed semiconductor devices.
第１図は本発明の一実施例を示したもので、（ａ）〜（
ｅｌは各工程の平面図、第２図は本発明の−っのリード
フレ・−ムの拡大平面図、第３図（ａ）、 （ｂ）はそ
れぞれ本発明のリードフレームの要部拡大平面図である
。
】・・・タブ、２・・・リード線、３・・・タブリード
、４・・・内端部、５・・・樹脂支持片、６・・・外部
フレーム、７・・・ダム、８・・・半導体ベレット、９
・・・コネクタワイヤ、１ｏ・・・樹脂体。
代理人 弁理士 高 橋 明 夫ｔｔし）第 １
図
３１３−
第 １ 図
（Ｃ）
第 ２ 図FIG. 1 shows an embodiment of the present invention, (a) to (
el is a plan view of each step, FIG. 2 is an enlarged plan view of the lead frame of the present invention, and FIGS. 3(a) and (b) are enlarged plan views of the main parts of the lead frame of the present invention, respectively. It is. ]...Tab, 2...Lead wire, 3...Tab lead, 4...Inner end, 5...Resin support piece, 6...External frame, 7...Dam, 8...・・Semiconductor pellet, 9
... Connector wire, 1o... Resin body. Agent: Patent Attorney Akio Takahashi) No. 1
Figure 313- Figure 1 (C) Figure 2
Claims (1)
片 （Ｃ）これらの間を一体的に支持する連結片[Claims] 1. (a) A plurality of leads (b) A support piece for locking the sealing body to be formed (C) A connecting piece that integrally supports these parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17295283A JPS59103364A (en) | 1983-09-21 | 1983-09-21 | Lead frame for resin-sealed type electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17295283A JPS59103364A (en) | 1983-09-21 | 1983-09-21 | Lead frame for resin-sealed type electronic parts |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2270177A Division JPS53108368A (en) | 1977-03-04 | 1977-03-04 | Manufacture for resin seal type semiconductor device and its lead frame for its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59103364A true JPS59103364A (en) | 1984-06-14 |
Family
ID=15951398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17295283A Pending JPS59103364A (en) | 1983-09-21 | 1983-09-21 | Lead frame for resin-sealed type electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59103364A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5495125A (en) * | 1993-11-19 | 1996-02-27 | Nec Corporation | Molded semiconductor device |
| US6331448B1 (en) | 1998-05-20 | 2001-12-18 | Micron Technology, Inc. | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes |
-
1983
- 1983-09-21 JP JP17295283A patent/JPS59103364A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5495125A (en) * | 1993-11-19 | 1996-02-27 | Nec Corporation | Molded semiconductor device |
| US6331448B1 (en) | 1998-05-20 | 2001-12-18 | Micron Technology, Inc. | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes |
| US6500697B2 (en) | 1998-05-20 | 2002-12-31 | Micron Technology, Inc. | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes |
| US6703260B2 (en) | 1998-05-20 | 2004-03-09 | Micron Technology, Inc. | Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes |
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