JPS59101320A - Mold - Google Patents

Mold

Info

Publication number
JPS59101320A
JPS59101320A JP21019082A JP21019082A JPS59101320A JP S59101320 A JPS59101320 A JP S59101320A JP 21019082 A JP21019082 A JP 21019082A JP 21019082 A JP21019082 A JP 21019082A JP S59101320 A JPS59101320 A JP S59101320A
Authority
JP
Japan
Prior art keywords
mold
molding
sputtering
solid lubricant
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21019082A
Other languages
Japanese (ja)
Other versions
JPH0114849B2 (en
Inventor
Kazuyuki Ozaki
和行 尾崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nok Corp
Original Assignee
Nippon Oil Seal Industry Co Ltd
Nok Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Oil Seal Industry Co Ltd, Nok Corp filed Critical Nippon Oil Seal Industry Co Ltd
Priority to JP21019082A priority Critical patent/JPS59101320A/en
Publication of JPS59101320A publication Critical patent/JPS59101320A/en
Publication of JPH0114849B2 publication Critical patent/JPH0114849B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a mold wherein tailings are prevented from adhering to it when molding is effected, and the releasability is improved, by which a molded item good in quality can be provided, by providing the die surfaces with coated films of ceramic or a solid lubricant by high-frequency sputtering. CONSTITUTION:A high-frequency sputtering apparatus includes a pair of electrodes 2, 2' each having cooling water circulating pipes 1, 1' in such a way that they are opposed to each other in a reaction tank 4 having an exhaust cylinder 3. A mold 5 to subjected to sputtering treatment is placed on the lower electrode 2. A target 6 that comprises ceramic or a solid lubricant that is formed into a disk by press molding is attached to the upper electrode 2' and argon gas or the like is introduced via a line 8. A high frequency voltage is applied by a high frequency power source 10 to change a switch 13, and a shutter 14 is opened to effect sputtering, so that the die surfaces 21-24 of the mold are coated with thin films 31-34 to obtain the intended mold.

Description

【発明の詳細な説明】 本発明は、成形用金型に関する。更に詳しくは、ゴムや
プラスチック成形時のかす付きを防止し、離型性を改i
した成形用金型に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mold for molding. More specifically, it prevents scum from forming during rubber and plastic molding, and improves mold releasability.
This invention relates to a mold for molding.

一般に、ゴムやプラスチックを成形するのに用いられる
金型には、硬質クロムメッキが施されている。この種の
金型を含め、成形用金型では、従来からかす付きや離型
性が問題となっている。即ち、成形されるゴムやプラス
チックの種類によっては、成形品またはその一部が金型
にべっとりと付着し、きれいに離型できないものがある
。そこで、離型性を改善すべく、金型の成形面に離型剤
をスプレーで塗布することなどが一般に行われているが
、それをくり返し行なっても付着するかすが少しづつ増
えるので、メッキ表面がくもり始め、次第に離型し難く
なる。このため、−宇回数成形する毎に金型を洗浄する
ことが行われる。そして、洗浄だけでは十分に付着物が
とれなくなると、メッキの再生を行わなければならなく
なり、その回数も洗浄回数に応じて多くなる。
Generally, molds used for molding rubber and plastics are plated with hard chrome. Molding molds, including this type of mold, have traditionally had problems with scum buildup and mold releasability. That is, depending on the type of rubber or plastic to be molded, the molded product or a part thereof may stick to the mold and cannot be released cleanly from the mold. Therefore, in order to improve mold releasability, it is common practice to spray a mold release agent onto the molding surface of the mold, but even if this is done repeatedly, the adhesion of debris increases little by little, so the plating surface It will start to get cloudy and gradually become difficult to release from the mold. For this reason, the mold is cleaned every time the mold is molded several times. When the deposits cannot be removed sufficiently by cleaning alone, the plating must be regenerated, and the number of times the plating is regenerated increases depending on the number of times of cleaning.

また、ゴムを金属またはプラスチックと接着させる場合
には、加硫と同時に行われることも多いが、接着剤中に
腐食性のガスを発生させる成分が含まれている場合には
、めっきのピンホールやきずの部分から腐食が起るため
、−やはりめっきをやり直さなければならないことも多
い。
Additionally, when bonding rubber to metal or plastic, this is often done at the same time as vulcanization, but if the adhesive contains components that generate corrosive gases, pinholes in the plating may occur. Corrosion occurs from the scratched area, so re-plating is often necessary.

更に、離型剤を用いた場合には、離型性は改善されるも
のの、金型成形面の温度降下がもたらされるため、その
都度電熱を供給して、その温度を一定に保持しなければ
ならない。また、離型剤が、成形品の品質や不良率を左
右する場合もある。
Furthermore, when a mold release agent is used, although mold releasability is improved, the temperature of the molding surface drops, so electric heat must be supplied each time to maintain the temperature constant. No. Furthermore, the mold release agent may affect the quality and defective rate of the molded product.

金型の成形面に離型剤を塗布する従来技術の欠点が、金
型成形面に高周波スパッタリングにより耐熱性、耐食性
および雛型性などにすぐれたセラミックスまたは固体潤
滑剤のコーティング薄膜を設けることにより、−挙に解
決されることが、本発明者によって見出された。
The shortcomings of the conventional technique of applying a mold release agent to the molding surface of the mold can be resolved by providing a coating thin film of ceramic or solid lubricant with excellent heat resistance, corrosion resistance, moldability, etc. on the molding surface by high-frequency sputtering. The inventors have found that the following problems can be solved.

図面の第1図は、本発明で適用される高周波スパッタリ
ング法に用いられる装置の概要を示すものである。即ち
、冷却水循環パイプ1.1′をそれぞれ備えた一対の電
極2,2′が、排気n3を有する反応槽4内に、互いに
対向する位置で設置される。そして、下方の電極(2)
上には、スパッタリングされる金型5が搭載され、また
上方の電極(2)上には、セラミックスや固体潤滑剤を
、例えば直径60w1厚さ5酎の円板状にプレス成形し
たターゲット6が取付けられる。ここで、セラミックス
としては、例えば炭化けい素、炭化チタン、窒化ホウ素
などが、また固体潤滑剤としては、例えば二硫化モリブ
デン、窒化ホウ素などが用いられる。
FIG. 1 of the drawings shows an outline of an apparatus used in the high frequency sputtering method applied in the present invention. That is, a pair of electrodes 2, 2', each provided with a cooling water circulation pipe 1.1', are placed in opposing positions in a reaction tank 4 having an exhaust gas n3. And the lower electrode (2)
A mold 5 for sputtering is mounted on the top, and a target 6 press-molded with ceramics or solid lubricant into a disk shape, for example, 60W in diameter and 5cm in thickness, is mounted on the upper electrode (2). Installed. Here, as the ceramic, for example, silicon carbide, titanium carbide, boron nitride, etc. are used, and as the solid lubricant, for example, molybdenum disulfide, boron nitride, etc. are used.

スパッタリング処理は、まず油拡散ポンプなどの真空ポ
ンプ(図示せず)を用いて、反応槽内の空気を前記排気
筒から排気して、10” Torr以下に減圧し、次い
でバリアプルバルブ7を調整しながら、ライン8からア
ルゴンガスなどを導入し、反応槽内の圧力を10−’ 
Torrのオーダーとする。
In the sputtering process, the air in the reaction tank is first evacuated from the exhaust pipe using a vacuum pump (not shown) such as an oil diffusion pump to reduce the pressure to 10" Torr or less, and then the barrier pull valve 7 is adjusted. While doing so, introduce argon gas etc. from line 8 to reduce the pressure inside the reaction tank to 10-'
The order is Torr.

ここで、排気筒のメインバルブ(図示せず)を調整して
、圧力を104〜10°TOrrのオーダー、好ましく
は6 X 10−5〜I X 10−’ Torrとす
る。アルゴンガスなどの圧力がこれ以下では、放電で連
続的に行われず、またこね以上の圧力では、スパッタリ
ング速度が著しく低下するばかりではなく、放電も不安
定となって、均質なコーティング薄膜を形成させること
ができない。なお、符号9は、真空ゲージである。
The main valve (not shown) of the exhaust stack is now adjusted to provide a pressure on the order of 104 to 10° Torr, preferably 6 x 10-5 to I x 10' Torr. If the pressure of argon gas is lower than this, the discharge will not be continuous, and if the pressure is higher than kneading, not only will the sputtering speed drop significantly, but the discharge will also become unstable, making it impossible to form a homogeneous coating thin film. I can't. In addition, the code|symbol 9 is a vacuum gauge.

操作は、高周波電源(13,56MB2 ) 10およ
びマツチングボックス(電力計)11にスイッチ12を
接続させて高周波電圧をかけ、金型表面を清浄兼活性化
して、ピンホールを減少させ、薄膜との密着性を向上さ
せた後、放電を停止し、スイッチ13に切り換え、再度
放電して、今度はターゲット表面のごみや酸化層を除去
した後、放電を停止することなくシャッター14を開き
、目的とするスパッタリングを行ない、金型表面にセラ
ミックスまたは固体潤滑剤の薄膜を形成させ、所定の膜
厚が得られた時点で放電を停止し、アルゴンガスなどの
導入を中止し、メインバルブを閉じて、反応槽から処理
された金型を取り出すことによって行われる。
The operation involves connecting a switch 12 to a high frequency power source (13,56 MB2) 10 and a matching box (power meter) 11 to apply a high frequency voltage to clean and activate the mold surface, reduce pinholes, and form a thin film. After improving the adhesion of the target, stop the discharge, switch to the switch 13, discharge again, this time remove the dust and oxide layer on the target surface, open the shutter 14 without stopping the discharge, and move the target. Sputtering is performed to form a thin film of ceramics or solid lubricant on the mold surface, and when the desired film thickness is obtained, the discharge is stopped, the introduction of argon gas, etc. is stopped, and the main valve is closed. , by removing the treated mold from the reaction vessel.

高周波スパッタリングで形成されたセラミックスまたは
固体潤滑剤のコーティング薄膜は、一般に約5〜0.1
μm1好ましくは約1μm前後の厚さを有し、離型性に
すぐれているばかりではなく、金型成形面基体との密着
性が良く、またピンホールも少ないという特徴を有して
いる。この結果として、次のような効果が得られる。
Thin coatings of ceramics or solid lubricants formed by radio frequency sputtering are generally about 5 to 0.1
μm1 It preferably has a thickness of about 1 μm, and is characterized by not only excellent mold releasability but also good adhesion to the mold molding surface substrate and fewer pinholes. As a result, the following effects can be obtained.

(1)離型性がすぐれているため、ゴムやプラスチック
の成形時におけるかす付きが少なくなり、従来性なって
いた金型成形面への離型剤の塗布を必要とはしない。こ
のことは、離型剤使用による成形品の品質や不良率を悪
′化させるような悪影響を除去するばかりではなく、成
形工程の短縮および簡略化を達成させ、また金型成形面
における温度低下を少なくし、消費電力を減少させると
いう効果をもたらず。
(1) Due to its excellent mold release properties, there is less scum during molding of rubber or plastic, and there is no need to apply a mold release agent to the molding surface, which was conventional. This not only eliminates the negative effects of using a mold release agent that worsen the quality and defective rate of molded products, but also shortens and simplifies the molding process, and reduces the temperature on the molding surface. It does not have the effect of reducing power consumption.

(2)成形品のかす付きの度合いが抑えられるため、金
型洗浄のための寿命間隔を格段に長くすることができる
(2) Since the degree of scum buildup on the molded product is suppressed, the life interval for mold cleaning can be significantly extended.

(3)金型の成形面に耐食性でピンホールの少ないコー
ティング薄膜が設けられ、またこの薄膜がメッキ層のピ
ンホールをも覆っているため、金型の腐食が防止され、
メッキ再生のための力命間隔が一段と長くなる。
(3) A corrosion-resistant coating thin film with few pinholes is provided on the molding surface of the mold, and this thin film also covers pinholes in the plating layer, so corrosion of the mold is prevented.
The power life interval for plating regeneration becomes even longer.

(4)形成されたセラミックスまたは固体潤滑剤のコー
ティング薄膜を再生する場合には、この簿膜の耐食性か
ら酸やアルカリでは除去できないものの、厚さが約1μ
m程度で薄く物理的に基体に接着されているため、エメ
リーペーパーなどで削り落すことにより、その再生が容
易に行われる。
(4) When regenerating the formed coating thin film of ceramics or solid lubricant, it is difficult to remove it with acid or alkali due to the corrosion resistance of this film, but the thickness is approximately 1 μm.
Since it is thin and physically adhered to the substrate with a thickness of about m, it can be easily recycled by scraping it off with emery paper or the like.

次に、実施例について本発明を説明する。Next, the present invention will be explained with reference to examples.

実施例1 図面の第2図に縦断面図として示されるオイルシール成
形用金型の各部分21〜24の各成形面に、前記される
ような高周波スパッタリング方法により、それぞれ約1
μmの厚さの炭化けい素または二硫化モリブデンのコー
ティング薄膜31 、32 。
Example 1 Each molding surface of each part 21 to 24 of an oil seal molding die shown as a vertical cross-sectional view in FIG. 2 of the drawings was coated with about 1.
Coating thin films 31 , 32 of silicon carbide or molybdenum disulfide with a thickness of μm.

33および34をそれぞれ形成させ、そこに形成された
空間15にアクリルゴム、カーボンブラック、酸化けい
素およびグラファイトよりなるゴム配合物を封入し、2
00℃、150¥2.4分間の条件下で加硫を行ない、
オイルシールを成形する操作をくり返し行なった。
33 and 34, respectively, and a rubber compound made of acrylic rubber, carbon black, silicon oxide, and graphite is sealed in the space 15 formed therein.
Vulcanization was carried out under the conditions of 00℃, 150 yen for 2.4 minutes,
The operation of forming the oil seal was repeated.

炭化けい素コーティング薄膜を成形面に設けた金型を用
いた場合には、640回の連続加硫成形で、金型および
加硫成形品のいずれにも全く異常が認められなかった。
When a mold having a thin silicon carbide coating film on the molding surface was used, no abnormalities were observed in either the mold or the vulcanized product after 640 continuous vulcanization moldings.

また、二硫化モリブデンコーティング薄膜を成形面に設
けた金型を用いた場合には、431回目でやつと金型端
部にかす付きの発生が認められ、金型成形面にも微少な
メッキ層の剥離がみられた。
In addition, when using a mold with a thin molybdenum disulfide coating on the molding surface, scum was observed on the edges of the mold at the 431st time, and a small plating layer was also observed on the molding surface. Peeling was observed.

この金型を用い、高周波スパッタリング処理することな
く、市tfliiltf型剤を塗布しながら加硫成形を
行なった場合には、約200〜300回でかす付き(7
) が発生したため、その時点で金型の洗浄が必要だった。
When this mold was used for vulcanization molding without high-frequency sputtering treatment and while applying Ichitfliiltf molding agent, scum formed (7
) occurred, and the mold needed to be cleaned at that point.

実施例2 他の金型(実施例1と同様形状で、サイズのみが異なる
)を用い、その成形面を実施例1と同様に炭化けい素ま
たは二硫化モリブデンによる高周波スパッタリング処理
し、エピクロルヒドリンゴム、NBRN n9化鉛、ゲ
ラファイトおよび酸化けい素よりなるゴム酢合物からの
加硫成形を、180℃、150〜.6分間の条件下で行
なった場合、50回以上の連続加硫成形で、金型および
加硫成形品のいずれにも異常は認められなかった。
Example 2 Using another mold (same shape as in Example 1, differing only in size), its molding surface was subjected to high-frequency sputtering treatment with silicon carbide or molybdenum disulfide in the same manner as in Example 1, and epichlorohydrin rubber, NBRN n9 Vulcanization molding from a rubber acetate compound consisting of lead oxide, gelaphite and silicon oxide was performed at 180°C and 150~. When the vulcanization was carried out for 6 minutes, no abnormality was observed in either the mold or the vulcanized product after 50 or more continuous vulcanization moldings.

この金型を用い、高周波スパッタリング処理することな
く、実施例1に併記した離型剤を塗布しながら加硫成形
を行なった場合には、約201回程度でかす付きが発生
したため、その時点で金型の洗浄が必要だった。
When vulcanization molding was performed using this mold while applying the mold release agent described in Example 1 without high-frequency sputtering treatment, scum formed after about 201 cycles. The mold needed cleaning.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明で適用される高周波スパッタリング法
に用いられる装置の概要図である。また、(8) 第2図は、本発明に係る高周波スパッタリングされたオ
イルシール成形用金型の縦断面図である。 (符号の説明) 2.2′・・・・・・電極 4・・・・・・・・・・・・反応核 5・・・・・・・・・・・・成形用金型6・・・・・・
・・・・・・セラミックスまたは固体潤滑剤のターゲッ
ト 15・・・・・・・・・・・・金型の成形用空間21〜
24・・・・・・オイルシール成形用金型部分31〜3
4・・・・・・コーティングH膜代理人 弁理士  吉 1)俊 夫 第1図
FIG. 1 is a schematic diagram of an apparatus used in the high frequency sputtering method applied in the present invention. (8) FIG. 2 is a longitudinal cross-sectional view of a mold for forming an oil seal subjected to high-frequency sputtering according to the present invention. (Explanation of symbols) 2.2'... Electrode 4... Reaction nucleus 5... Molding mold 6.・・・・・・
...Target 15 for ceramics or solid lubricant ...Mold space 21 ~
24...Mold part 31-3 for oil seal molding
4...Yoshi Yoshi, Patent Attorney for Coating H Membrane 1) Toshio Diagram 1

Claims (1)

【特許請求の範囲】[Claims] 1、金型の成形面に、高周波スパッタリングによりセラ
ミックスまたは固体潤滑剤のコーティング薄膜を設けた
成形用金型。
1. A molding die in which a coating thin film of ceramics or solid lubricant is provided on the molding surface of the mold by high-frequency sputtering.
JP21019082A 1982-11-30 1982-11-30 Mold Granted JPS59101320A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21019082A JPS59101320A (en) 1982-11-30 1982-11-30 Mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21019082A JPS59101320A (en) 1982-11-30 1982-11-30 Mold

Publications (2)

Publication Number Publication Date
JPS59101320A true JPS59101320A (en) 1984-06-11
JPH0114849B2 JPH0114849B2 (en) 1989-03-14

Family

ID=16585268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21019082A Granted JPS59101320A (en) 1982-11-30 1982-11-30 Mold

Country Status (1)

Country Link
JP (1) JPS59101320A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02270508A (en) * 1989-04-12 1990-11-05 Ibiden Co Ltd Black lead mold for molding plastic
JP2008236865A (en) * 2007-03-19 2008-10-02 Yazaki Corp Harness attachment structure of electric connection box

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5541298A (en) * 1978-09-15 1980-03-24 Mobil Oil Laminating heat plastic film
JPS579510U (en) * 1980-06-19 1982-01-19
JPS58153608A (en) * 1982-03-09 1983-09-12 Sumitomo Bakelite Co Ltd Mold for molding synthetic resin and molding method of synthetic resin

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130482A (en) * 1974-09-09 1976-03-15 Tokyo Shibaura Electric Co RYOMENREIKYAKUGATAHIRAGATAHANDOTAISEIRYUSOSHI

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5541298A (en) * 1978-09-15 1980-03-24 Mobil Oil Laminating heat plastic film
JPS579510U (en) * 1980-06-19 1982-01-19
JPS58153608A (en) * 1982-03-09 1983-09-12 Sumitomo Bakelite Co Ltd Mold for molding synthetic resin and molding method of synthetic resin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02270508A (en) * 1989-04-12 1990-11-05 Ibiden Co Ltd Black lead mold for molding plastic
JP2008236865A (en) * 2007-03-19 2008-10-02 Yazaki Corp Harness attachment structure of electric connection box

Also Published As

Publication number Publication date
JPH0114849B2 (en) 1989-03-14

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