JPS5899734A - Method and apparatus for inspecting photomask - Google Patents

Method and apparatus for inspecting photomask

Info

Publication number
JPS5899734A
JPS5899734A JP56198905A JP19890581A JPS5899734A JP S5899734 A JPS5899734 A JP S5899734A JP 56198905 A JP56198905 A JP 56198905A JP 19890581 A JP19890581 A JP 19890581A JP S5899734 A JPS5899734 A JP S5899734A
Authority
JP
Japan
Prior art keywords
mask
photomask
pattern
photo
securing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56198905A
Other languages
Japanese (ja)
Other versions
JPH0330811B2 (en
Inventor
Shogo Matsui
正五 松井
Kenichi Kobayashi
賢一 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56198905A priority Critical patent/JPS5899734A/en
Publication of JPS5899734A publication Critical patent/JPS5899734A/en
Publication of JPH0330811B2 publication Critical patent/JPH0330811B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Cleaning In General (AREA)

Abstract

PURPOSE:To ensure the aptitude quality of a photomask as well as improve its production yield, by inspecting mask patterns after washing the mask surface while applying thereto a mechanical load of a desired intensity. CONSTITUTION:After a photomask 1 is brought above a washing means by a transfer mechanism, a mask-securing plate 10 is lifted up, and the mask 1 is transferred onto the securing plate 10. Then, the securing plate 10 is lowered to immerse the mask 1 in pure water 8 in the washing means. While ultrasonic vibrations are applied to the mask surface through a ultrasonic vibrator 16, the whole mask surface is scanned about two-three times by a rotary brush 15. Thereafter, the securing plate 10 is lifted up to the upper part of a washing vessel 8, and the mask 1 is transferred by the transfer mechanism located under the securing plate 10 to a stage 24 in a pattern inspecting means through a drying means to inspect the mask patterns, two by two, successively through optical microscopes 28a, 28b. Thus, all the photomasks having defective patterns not satisfying quality requirements can be judged to be failure.

Description

【発明の詳細な説明】 (幻 発明の技術分野 本発明はフォ°ト・マスク検査方法の改良及び7オトー
マスク検査装置の改良に関する。
DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to an improvement in a photo mask inspection method and an improvement in a 7-oto-mask inspection apparatus.

(蜀 技術の背景 フォト中マスクは使用する側の用途即ち密着露光に使用
するか投影露光に使用するかによって、更にその使用頻
度によりて要求されるパターン強度が異ってくる。又パ
ターンの微細度によちてもパターン強度が異なり。
(Shu Technology Background) The pattern strength required for photomasks varies depending on the purpose of use, i.e., whether it is used for contact exposure or projection exposure, and the frequency of use. The pattern strength also differs depending on the degree.

(Φ 従巣技術と問題点 一方従来のフォト・マスク製造工程に於ては、パターン
形成の完了したフォト・マスクのマスク・パターンをパ
ターン描二データと対比する手段、或いは基準パターン
と対比する手段等により検査した後、一定の条件でブラ
ッシング及び超音波等の機械的負荷をパターンに負荷し
ながら洗浄を行っていた。従りて洗浄条件をシビアにし
た場合には洗浄後にパターン損傷不良が発生し、又前記
パターン損傷不良をなくすために洗浄負荷を極端に軽く
した場合には二−ザの要求するパターン強度の保証がな
されないという問題があった。
(Φ Follower technology and problems) On the other hand, in the conventional photomask manufacturing process, there is a means for comparing the mask pattern of a photomask after pattern formation with pattern drawing data, or a means for comparing with a reference pattern. After inspection using methods such as methods, cleaning was performed under certain conditions while applying mechanical loads such as brushing and ultrasonic waves to the pattern.Therefore, if the cleaning conditions were made severe, patterns would be damaged or defective after cleaning. However, if the cleaning load is made extremely light in order to eliminate the pattern damage defects, there is a problem in that the pattern strength required by the razor cannot be guaranteed.

ゆ 発明の目的 本発明はパターンの微#夏に応じ、且つ用途及び使用頻
度に応じて、その品質が保証される所望の強さの機械的
負荷を与えてマスク面の洗浄を行った稜、マスク・パタ
ーンの検査を行い不良を除去した後直ちに出荷するフォ
ト・マスク検査方法及び該検査方法に用いる装置構造を
提供し、フォト・マスクの適正品質を確保すると同時に
、製造歩留まりを向上せしめるこきを目的とする。
OBJECT OF THE INVENTION The present invention provides a method for cleaning a mask surface by applying a mechanical load of a desired strength to ensure its quality, depending on the pattern's fineness, application, and frequency of use. We provide a photomask inspection method that inspects the mask pattern and removes defects before shipping immediately, and the equipment structure used in this inspection method, ensuring appropriate quality of the photomask and at the same time improving manufacturing yield. purpose.

(a)  発明の構成 即ち本発明はマスク・パターンの形成を終ったフォト・
マスクを、マスク面に阜擦力及び超音波を負荷しながら
水洗し、その後で該水洗の終り−たフォト・マスクを検
査する工程を有することを特徴とするフォト−マスクの
検査方法、及び流水中に於てマスク面をブラッシングす
る機能及びマスク面に超音波を照射する機能を有するフ
ォト・iスフ洗浄手段と、フォト・マスク乾燥手段とが
、フォト・マスク検査手段の前に順次配設されてなるこ
とを特徴とするフォト・マスク検査装置に一関するもの
である。
(a) Structure of the invention, that is, the present invention is a method for processing photo-photographs after forming a mask pattern.
A method for inspecting a photo-mask, comprising the steps of washing the mask with water while applying rubbing force and ultrasonic waves to the mask surface, and then inspecting the washed photo-mask, and running water. Inside, a photo-i-splash cleaning means having a function of brushing the mask surface and a function of irradiating the mask surface with ultrasonic waves, and a photo-mask drying means are sequentially arranged in front of the photo-mask inspection means. The present invention relates to a photomask inspection device characterized by:

□□□発明の実施例 以下本発明を実施例について、第1図に示す一実施例の
装置構成図、第2図に示す同実施例に於ける洗浄手段の
要部断面模式図、第3囚に示す同実施例に於ける乾燥手
段の要部断面模式図、第4図に示す同実施例に於けるパ
ターン検査手段の要jん 形成の完了したフォト・マスクをマスク面に機構的負荷
を与えながら水洗する機能と、水洗の終ったフォト・マ
スクを乾燥する機能と、乾燥の終フたフォト・マスクを
検査する機能とを持っており、例えば第1図に示すよう
に一フーオトーマ2り1を洗浄手門2に搭載するための
第1の搬−送機構3、洗浄手段2、フォト・マスクを洗
浄手段2から乾燥手段4に移し換えるための第2の搬送
機構5、乾燥手段4、フォト−マスク1を乾燥手段4か
らパターン検査手段6に移し換えるための第3の搬送機
構7、及びパターン検査手段6とから主として構成され
ている。
□□□Embodiments of the Invention The present invention will now be described in detail with reference to an apparatus configuration diagram of one embodiment shown in FIG. A schematic sectional view of the essential parts of the drying means in the same embodiment shown in Figure 4, and a mechanical load on the mask surface of the photomask that has completed the formation of the pattern inspection means in the same embodiment shown in Figure 4. It has a function of washing the photomask with water while applying water, a function of drying the photomask after washing with water, and a function of inspecting the photomask after drying. A first transport mechanism 3 for loading the mask 1 onto the cleaning gate 2, a cleaning means 2, a second transport mechanism 5 for transferring the photo mask from the cleaning means 2 to the drying means 4, and a drying means. 4, a third transport mechanism 7 for transferring the photomask 1 from the drying means 4 to the pattern inspection means 6, and the pattern inspection means 6.

そして上記洗浄手段2は15例えば第2図に示すような
構造を有している。即ち純水8を流した洗浄容器9の底
部に吸着機構10を有する第1のマスク固持台11が配
設されている。該マスク固持台11は気密ベアリング1
2を介して洗浄容器9の外部に導出された支持管13に
より上下動が自在lこなされる。又マスク固持台11の
上部には支軸14を介して水平方向移動、上下動ともに
自在な構造を有し、マスク固持台11上に固持搭載され
たフォト・マスク1のパターン面をブラッシングする機
能を有する回転ブラシ15が配設されている。そして更
に洗浄容器9の上部にフォト−マスク1市に向って超音
波(US)を照射する超音波振動子16が配設されてな
っている。
The cleaning means 2 has a structure 15, for example, as shown in FIG. That is, a first mask holding stand 11 having a suction mechanism 10 is disposed at the bottom of a cleaning container 9 into which pure water 8 is poured. The mask holding base 11 has an airtight bearing 1
It can be freely moved up and down by a support tube 13 led out of the cleaning container 9 via a support tube 13. The upper part of the mask holding stand 11 has a structure that can be moved both horizontally and vertically via a support shaft 14, and has a function of brushing the patterned surface of the photo mask 1 fixedly mounted on the mask holding stand 11. A rotating brush 15 is provided. Furthermore, an ultrasonic vibrator 16 is disposed above the cleaning container 9 to radiate ultrasonic waves (US) toward the photomask 1.

又乾に−t一段(第1囚4)は例えば第3図に示すよう
な構造を有している。即ち自動開閉バルブ17が接続さ
れた排水口18及び真空排気口19を有する真空容器2
0及び上下1.水平方向に移動可能な!21とにより乾
燥−が形成され、真空容器20の底部に吸着機構10を
有する第2のマスク固持台22が配設されている。該第
2のマスク固持台22は気密ベアリング12を介して真
空容器20の外部に導出された支持管13により上下動
自在であり、且つ高速回転が与えられて核マスク固持台
22上に吸着固持されたフォト−マスク1の水きりがな
される。
In addition, the first stage (first prisoner 4) has a structure as shown in FIG. 3, for example. That is, a vacuum container 2 having a drain port 18 and a vacuum exhaust port 19 to which an automatic opening/closing valve 17 is connected.
0 and upper and lower 1. Can be moved horizontally! 21 forms a drying chamber, and a second mask holding stand 22 having a suction mechanism 10 is disposed at the bottom of the vacuum container 20. The second mask holding stand 22 is movable up and down by a support tube 13 led out of the vacuum vessel 20 via an airtight bearing 12, and is rotated at high speed to attract and hold it on the nuclear mask holding stand 22. The photomask 1 is then drained.

又パターン検査手段(第1図6)は例えば第4図に示す
ような構造を有している。即ち吸着機構等のマスク固持
機構(図示せず)を有し、且つ中央に透光窓23を有す
るX−Yステージ24と、該X−Yステージ24の下部
に設けられた光源2飄プリズム26及びミラー27g、
27bから1「す2〔本〕の光束を照射する機能を持つ
照明部と、XYステージ24の上部に配設された1〔対
〕の顕微鏡28a及び28bとから主としてなる通常の
構造を有しており、例えば同種ツクターンが多数個整列
形成されてなるフォト・マスク1のノ(ターの光学像を
2〔個〕ずつ順次重ね合わせて、<ターンの欠陥を検出
するパターンの比較検査機能を持たされている。そして
更に検査機能部の前段には附属機構として、吸着機構1
0を有し、且つ上下動自在な第3のマスク固持台29か
らなるマスク受取り機構30と、X−Yステージ24上
にフォ)−マスク1を移動する通常構造のマスク押出し
機構31(32は押出し方向矢印し)が設けられ、又検
査機能部の後段にはX−Yステージ24上からフォト・
マスク1を取出すための通常のマスク掻き出し機構(図
示せず)が設けられる。
Further, the pattern inspection means (FIG. 1, 6) has a structure as shown in FIG. 4, for example. That is, an X-Y stage 24 having a mask holding mechanism (not shown) such as a suction mechanism and a light-transmitting window 23 in the center, and a light source 2 provided at the bottom of the X-Y stage 24 and a prism 26. and mirror 27g,
It has a normal structure mainly consisting of an illumination unit that has the function of irradiating 1 to 2 light beams from 27b, and a pair of microscopes 28a and 28b arranged on the top of the XY stage 24. For example, it has a pattern comparative inspection function for detecting defects in turns by sequentially superimposing two optical images of the photomask 1, which is formed by aligning a large number of similar patterns. Furthermore, a suction mechanism 1 is installed as an auxiliary mechanism in the preceding stage of the inspection function section.
a mask receiving mechanism 30 consisting of a third mask holding stand 29 which has a vertical axis and is movable up and down, and a mask extrusion mechanism 31 (32) of a normal structure that moves the mask 1 onto the X-Y stage 24. An extrusion direction arrow) is provided, and a photo and
A conventional mask scraping mechanism (not shown) is provided for removing the mask 1.

更に該フォト・マスク検査装置に配設される第1、第2
.第3のマスク搬送機構(第1図3,5゜7)は、通常
自動処理装置に於て良く用いられるフォト・マスクを裏
面から担持する構造の搬送機構で例えば第5図(a)及
びの)に示すように、吸着固持機構33を有する鍵形の
マスク担持腕34が、支持管35を軸にしてステージ3
6上に上下動及び回動自在に保持されてなっている。
Furthermore, a first and a second
.. The third mask transport mechanism (Fig. 1, 3, 5゜7) is a transport mechanism that is commonly used in automatic processing equipment and has a structure that supports a photomask from the back side. ), a key-shaped mask carrying arm 34 having a suction/holding mechanism 33 is attached to the stage 3 with the support tube 35 as an axis.
6, and is held so as to be vertically movable and rotatable.

本発明の方法に於ては、例えば上記のようなフォト書マ
スク検査装置を用いてパターン形成が完了したフォト・
マスクの検査がなされる。
In the method of the present invention, for example, a photo mask inspection device as described above is used to inspect a photo mask after pattern formation.
Masks will be inspected.

即ち先ずフォト・マスクを第1の搬送機Vt*<第1図
3)で洗浄手段(第1図2)上に持って来た後、洗浄手
段が具備しているマスク固持台(第2図10)を上昇せ
しめて該マスク固持台10上にフォト・マスクを移し取
り、次いで第2図に示すようにマスク固持台10を下降
せしめてフォト・マスクlを洗浄手段の純水8中に浸漬
し、マスク面に・超音波振動子16を介して超音波を照
射しながら、回転ブラシ15でマスク面全面を2〜3〔
回〕程度走査する。
That is, first, the photo mask is brought onto the cleaning means (FIG. 1, 2) by the first conveyor Vt*<FIG. 1, 3), and then the mask holding table (FIG. 2, 10) is raised to transfer the photo mask onto the mask holding stand 10, and then, as shown in FIG. Then, while irradiating the mask surface with ultrasonic waves via the ultrasonic transducer 16, the entire mask surface is brushed 2 to 3 times with the rotating brush 15.
[times] scanning.

なおこの際超音波及びブラッシングによってマ゛スク面
に与えられる機械的な負荷は、フォト・マスクの保証品
質によって、超音波負荷ζこ関しては例えば30±5 
(KHz〕程度の周波数に於て400〜600 (W)
の範囲で所望の出力に選ばれ(マスク面と振動子との距
離は10(m)程良)、ブラッシング負荷に関しては太
さ50〜60〔μmφ〕長さ10〔簡〕程度のナイロン
毛を用いた10(i)程度の回転ブラシに於て回転数9
0〜360(r、l)。
At this time, the mechanical load applied to the mask surface by ultrasonic waves and brushing is, for example, 30±5 depending on the guaranteed quality of the photo mask.
(400 to 600 (W) at a frequency of about (KHz))
The desired output is selected within the range (the distance between the mask surface and the vibrator is about 10 (m)), and for the brushing load, nylon bristles with a thickness of 50 to 60 [μmφ] and a length of about 10 [simple] are selected. The number of revolutions was 9 in the rotating brush of about 10(i) used.
0-360 (r, l).

”〕m加圧力5’O〜10’0 (# ) 、走葺速度
1〜5(m/分分根程度範囲で所望の値に選ばれる。上
記洗浄処理が完了したならば、前記回転ブラシ15をマ
スク上部から逸脱せしめ、次いでマスク固持台10を洗
浄容器8の上部まで上昇せしめ、フォト・マスク1を該
マスク固持台10の下部に位置せしめた第2の搬送機構
(第1図5)のマスク担持腕(第5図34)で、再び下
降せしめられるマスク固持台10上からフォト・マスク
1をすくい取り、該第2の搬送機構を回動しフォト・マ
スクを乾燥手段(第1図4)上に位置させる。なおこの
際乾燥手段に於ける真空容器の蓋は該容器の上部から逃
がしておく。次いで乾燥手段の具備する第2のマスク固
持台(第3図22)を上昇せしめ:第2の搬送機構から
フォト・マスクを受は取り、搬送機構を除去した後該第
2のマスク固持台を下降せしめ、第3図に示すように、
フォト・マスク1を真空@′器20の底部領域に位置せ
しめて後、真空容器20上に蓋21を被せ、マスク固持
台22を500〜1000(r、p、m)で数秒間回転
してフォト・マスクの水切りを行い、次いで真空容器2
0内をlO″″”(Torr−)程度に数10〔秒間〕
排気してフォト・マスクを乾燥させる。乾燥が完了じた
ならば蓋21を真空容器20の上部から除き、次いで第
2のマスク固持台22を真空容器20の上部まで上昇せ
しめ、第3の搬送機構(第1図7)によりて7オト・マ
スクlを前記同様の手段ですくい取りた後、該搬送機構
を回動しフォト−マスク1を第4図に示すパターン検査
手段(第1図6)に於けるマスク受取り機構30の上部
に位置せしめる一0茨−いて該マスク受取り機構30の
マスク固持台29を上昇せしめ、前記第3の搬送機構か
らフォ1ト匍マスク1をすくい取り、第3の搬送機構を
除去した後、マスク固持台29を所定位置まで下降せし
め、次いでマスク押出し機構31によりフォト拳マスク
1を押出して、図に示すようにX−Yステージ24上に
フォト・マスク1を固持させる。モしてX−Yステージ
24を間欠的に移動させながら、フォト・マスク1に形
成されている同種マスク・パターンを光学顕微鏡28a
、28bを介して2〔個〕ずつ順次対比して検査する。
”] m Pressure force 5'O~10'0 (#), Roofing speed 1~5 (m/min.) The desired value is selected in the range of about 1000 m/min. Once the above cleaning process is completed, the rotating brush 15 from the upper part of the mask, then the mask holding stand 10 is raised to the upper part of the cleaning container 8, and the photo mask 1 is positioned at the lower part of the mask holding stand 10 (FIG. 1, 5). The photomask 1 is scooped up from the top of the mask holding table 10 which is lowered again by the mask carrying arm (FIG. 5, 34), and the second conveyance mechanism is rotated to transfer the photomask to the drying means (FIG. 1). 4) Place the mask on top. At this time, leave the lid of the vacuum container in the drying means out of the top of the container. Next, raise the second mask holding stand (FIG. 3, 22) provided in the drying means. : Pick up the photo mask from the second transport mechanism, and after removing the transport mechanism, lower the second mask holding stand, as shown in Figure 3.
After positioning the photo mask 1 in the bottom area of the vacuum container 20, the lid 21 is placed on the vacuum container 20, and the mask holding table 22 is rotated at 500 to 1000 (r, p, m) for several seconds. Drain the water from the photo mask, then place it in vacuum container 2.
0 to around 10"" (Torr-) for several tens of seconds
Evacuate and dry the photomask. When drying is completed, the lid 21 is removed from the top of the vacuum container 20, the second mask holding stand 22 is raised to the top of the vacuum container 20, and the third transport mechanism (FIG. 1, 7) After scooping up the photo-mask 1 using the same means as described above, the conveyance mechanism is rotated to transfer the photo-mask 1 to the upper part of the mask receiving mechanism 30 in the pattern inspection means shown in FIG. 4 (FIG. 1, 6). The mask holding base 29 of the mask receiving mechanism 30 is raised, the photo mask 1 is scooped up from the third transport mechanism, and the third transport mechanism is removed. The holding table 29 is lowered to a predetermined position, and then the photo mask 1 is pushed out by the mask pushing mechanism 31, and the photo mask 1 is fixed on the XY stage 24 as shown in the figure. While intermittently moving the X-Y stage 24, the same type of mask pattern formed on the photo mask 1 is examined using an optical microscope 28a.
, 28b, and are sequentially compared and inspected two by two.

な′窓このパターン検査手段に於ては設計パターンと予
め対比された標準パターンの光学像と第1のパターンの
光学像が重ね合わされて第1のパターンの検査がなされ
、次いで該第1のパターンの光学像と第2のパターンの
光学像が重ね合わされて第2のパターンの検査がなされ
る。そしてこのような操作が順次繰り返えされてフォト
・マスク上の全パターンの検査がなされる。そしてこの
方法は従来から行われている方法である。上記検査が完
了したならば、図示してないがマスク掻き出し機構によ
りX−、Yステージ24上からフォト・マスク1を検査
手段の外部に取り出し、該検査の完了した7オト・マス
クはその該ま出荷される。
In this pattern inspection means, the first pattern is inspected by superimposing the optical image of the standard pattern, which has been compared with the design pattern in advance, and the optical image of the first pattern. The optical image of the second pattern is superimposed on the optical image of the second pattern, and the second pattern is inspected. These operations are repeated in sequence to inspect all patterns on the photomask. This method is a conventional method. When the above inspection is completed, the photomask 1 is taken out from the X-Y stage 24 to the outside of the inspection means by a mask scraping mechanism (not shown), and the 7 photomasks for which the inspection has been completed are taken out as they are. Will be shipped.

#7 発明の効果 以上説明したように本発明に於ては、フォト・マスクの
微細駁、用途、使用頻U等を勘案した要求品質に応じた
機械的負荷を、ブラッシング及び超音波によってマスク
面に与えながら洗浄を行った後パターン検査が行われる
ので、要求品質を満た゛さず欠陥パターンを生じたフォ
ト・マスクは総て該パターン検査によって不良と判定さ
れる。従ってフォト・マスクの出荷品質が充分に良く保
鉦又本発明に於ては前述のようにフォト・マスクの要求
品質に応じて洗浄工程に於て与えられる機械的負荷の程
度が加減されるので加剰品質擾こならず、7オトーマス
クの製造歩留才りが向上する。
#7 Effects of the Invention As explained above, in the present invention, a mechanical load is applied to the mask surface by brushing and ultrasonic waves in accordance with the required quality, taking into account the fineness of the photo mask, its purpose, frequency of use, etc. Since a pattern inspection is performed after cleaning while applying a high temperature, all photomasks that do not meet the required quality and have defective patterns are determined to be defective by the pattern inspection. Therefore, the shipping quality of the photomask is maintained at a sufficiently high quality.In addition, in the present invention, as mentioned above, the degree of mechanical load applied in the cleaning process is adjusted according to the required quality of the photomask. The manufacturing yield of 7-meter masks is improved without sacrificing additional quality.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例に於ける装置構成図、第2図
は同実施例に於ける洗浄手段の要部断面模式図、第3図
は同実施例に於ける乾燥手段の要部断面模式図、第4図
は同実施例に於けるパターン検査手段の要部断面模式図
、第5図は搬送機構の上面模式図(a)及び断面模式図
の)である。 図に於て、1はフォト・マスク、2は洗浄手段、3は第
1の搬送m構、4は乾燥手段、5は第2の搬送機構、6
はパターン検査手段、7は第3の搬送機構、8は純水、
9は洗浄容器、1oは吸着機構、11は第1のiスフ固
持台、12は気密ベアリング、13は支持管、14は支
軸、15は回転ブラシ、16は超音波振動子、−17は
自動開閉バルブ、18は排水口、19は真空排気口、2
oは真空容器、21は蓋、22は第2のマスク固持台、
23は透光窓、24はX−Yステージ、25は光源、2
6はプリズム、27a、27bはミラー、28、a、2
8bは顕微鏡、29は第3のマスク固持台、31はマス
、り押出し機構、32見マスク押出し方向矢印し、33
は吸着固持機構、34はマスク担持腕、35は支持管、
36はステージを示す。 第 1 閃 第 3(2) − 第4閃 第 5 閃
Fig. 1 is a diagram showing the configuration of an apparatus according to an embodiment of the present invention, Fig. 2 is a schematic cross-sectional view of the main parts of the cleaning means in the same embodiment, and Fig. 3 is a main part of the drying means in the same embodiment. FIG. 4 is a schematic cross-sectional view of a main part of the pattern inspection means in the same embodiment, and FIG. 5 is a schematic top view (a) and a schematic cross-sectional view of the transport mechanism. In the figure, 1 is a photo mask, 2 is a cleaning means, 3 is a first transport mechanism, 4 is a drying means, 5 is a second transport mechanism, 6
is a pattern inspection means, 7 is a third conveyance mechanism, 8 is pure water,
9 is a cleaning container, 1o is a suction mechanism, 11 is a first i-sphere holding base, 12 is an airtight bearing, 13 is a support tube, 14 is a support shaft, 15 is a rotating brush, 16 is an ultrasonic vibrator, -17 is a Automatic opening/closing valve, 18 is a drain port, 19 is a vacuum exhaust port, 2
o is a vacuum container, 21 is a lid, 22 is a second mask holding stand,
23 is a transparent window, 24 is an X-Y stage, 25 is a light source, 2
6 is a prism, 27a, 27b are mirrors, 28, a, 2
8b is a microscope, 29 is a third mask holding stand, 31 is a mass extrusion mechanism, 32 is a mask extrusion direction arrow, and 33
34 is a mask holding arm, 35 is a support tube,
36 indicates a stage. 1st Flash 3rd (2) - 4th Flash 5th Flash

Claims (1)

【特許請求の範囲】 1、マスク・パターンの形成を終ったフォト−マ、;′
スフを、マスク面に摩擦力及び超音波を負荷しながら水
洗し、その後で骸水洗の終ったフォト・マスクを検査す
る工程を有することを特徴きするフォト・マスク検査方
法。 2、流水中に於てマスク面をブラッシングする機能及び
マスク面に超讐波を照射する機能を有するフォト・マス
ク洗浄手段と、フォト・マスク乾燥手段とが、フォト・
マスク検査手段の前に順次配設されてなることを特徴と
するフォト・マ豆り検査装置。
[Claims] 1. A photomer that has finished forming a mask pattern;'
A method for inspecting a photo mask, comprising the steps of: washing the mask with water while applying frictional force and ultrasonic waves to the mask surface; and then inspecting the photo mask that has been washed with water. 2. A photomask cleaning means having a function of brushing the mask surface under running water and a function of irradiating the mask surface with ultraviolet waves, and a photomask drying means,
A photo machining inspection device characterized in that it is arranged sequentially in front of a mask inspection means.
JP56198905A 1981-12-10 1981-12-10 Method and apparatus for inspecting photomask Granted JPS5899734A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56198905A JPS5899734A (en) 1981-12-10 1981-12-10 Method and apparatus for inspecting photomask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56198905A JPS5899734A (en) 1981-12-10 1981-12-10 Method and apparatus for inspecting photomask

Publications (2)

Publication Number Publication Date
JPS5899734A true JPS5899734A (en) 1983-06-14
JPH0330811B2 JPH0330811B2 (en) 1991-05-01

Family

ID=16398888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56198905A Granted JPS5899734A (en) 1981-12-10 1981-12-10 Method and apparatus for inspecting photomask

Country Status (1)

Country Link
JP (1) JPS5899734A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60110194A (en) * 1983-11-18 1985-06-15 株式会社ニコン Cleaning device of substrate
JPH0774134A (en) * 1994-07-19 1995-03-17 Dainippon Screen Mfg Co Ltd Substrate washing method and substrate washer
CN108515035A (en) * 2018-03-22 2018-09-11 林雪莲 A kind of music teaching mouth organ cleaning equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588327A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Inspection device for flaw of mask

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588327A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Inspection device for flaw of mask

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60110194A (en) * 1983-11-18 1985-06-15 株式会社ニコン Cleaning device of substrate
JPH0473775B2 (en) * 1983-11-18 1992-11-24
JPH0774134A (en) * 1994-07-19 1995-03-17 Dainippon Screen Mfg Co Ltd Substrate washing method and substrate washer
CN108515035A (en) * 2018-03-22 2018-09-11 林雪莲 A kind of music teaching mouth organ cleaning equipment

Also Published As

Publication number Publication date
JPH0330811B2 (en) 1991-05-01

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