JPS5897852A - Electronic part - Google Patents
Electronic partInfo
- Publication number
- JPS5897852A JPS5897852A JP19621081A JP19621081A JPS5897852A JP S5897852 A JPS5897852 A JP S5897852A JP 19621081 A JP19621081 A JP 19621081A JP 19621081 A JP19621081 A JP 19621081A JP S5897852 A JPS5897852 A JP S5897852A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- package
- circuit board
- terminal
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 abstract 4
- 238000005476 soldering Methods 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229930091051 Arenine Natural products 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Abstract
Description
【発明の詳細な説明】 本発明は、電子機器の電子部品に関するものである。[Detailed description of the invention] The present invention relates to electronic components for electronic equipment.
最近の電子技術の急速な発達により、電子Ｓ品の小型、
薄臘化が実現されまたこれに伴い電子機器も小１１．薄
型化されて来ている。そして、その結果電子部品９例え
ば大規模集積回路（以下、ＬＳ Ｉという）等のプリン
ト基板への実装においても実装の薄型化がなされている
。つまり、ＬＳＩ＄ｔプリント基板に実装する場合、従
来はプリント回路基板上にＬｌ実装用の；ネクターを半
田付して取付け、そのコネクターにＩＪＩパッケージの
リード端子を差込んで実装してい良。しかし、そのよう
な実装ではプリント回路基板とＬＳＩパッケージの間に
コネクターが介在する為薄型の実装が難かしい。よって
、最近ではプリント回路基板に直接ＩＪＩパッケージの
リード端子を半田付することにより実装の薄型化を図っ
ているのである。Due to the recent rapid development of electronic technology, electronic S products are becoming smaller and smaller.
Thinner materials have been realized, and with this, electronic equipment has also become smaller than the 11th grade. They are becoming thinner. As a result, electronic components 9, such as large-scale integrated circuits (hereinafter referred to as LSI), are being mounted thinner on printed circuit boards. In other words, when mounting on an LSI $t printed circuit board, conventionally a connector for Ll mounting is attached to the printed circuit board by soldering, and the lead terminal of the IJI package is inserted into the connector for mounting. However, in such mounting, a connector is interposed between the printed circuit board and the LSI package, making it difficult to achieve thin mounting. Therefore, recently, the lead terminals of the IJI package are soldered directly to the printed circuit board in order to reduce the thickness of the package.
しかし、以上のようなＬ８Ｉ４！の電子部品の端子を直
接半田付する実装方法にあって改、電子部品の故障の際
の修理、付は換えの場合その端子部分の半田を溶しプリ
ント回路基板より取り外さなければならない九め、その
作業が非常に困難となる欠点があり九。However, L8I4 like the above! The mounting method involves directly soldering the terminals of electronic components, and in the event of a failure of the electronic component, repair or replacement requires melting the solder on the terminal and removing it from the printed circuit board. There are 9 drawbacks that make the work extremely difficult.
本発明は上記のよ５な問題点に鑑みてなされたものであ
り、その目的とするところは半田付することなく簡単に
かつ薄型にプリント基板に実装接続することができ、更
にその取り外しも容易に行）ことができる電子部品管提
案することくある。The present invention was made in view of the above-mentioned problems, and its purpose is to easily and thinly mount and connect it to a printed circuit board without soldering, and also to easily remove it. There are many electronic parts tubes that can be proposed.
以下、本発明につき好適な一実施ｔｉｔ−示す図面に従
って詳細に説明する。なお、以下の説明においては本実
＆ｊＩｅＬＳＩパッケージに適用した例を用いて説明す
る。Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings. Note that the following description will be made using an example applied to a real &jIeLSI package.
第１図は本発明の一実Ｊ１１飼に係るＬＳｌＳｌパッケ
ージリプリント基板上続した状態の平面図、第２図はそ
の断面図を示す。１はＬＳＩのチップ１に実装するＬＳ
Ｉパッケージであり、２−＆はＬＳＩのチップの入出力
ｔＬｆｓＩＬＳＩパッケージへ導く良めＬ８Ｉメツケー
ジ１の側部に設けられた菅−ド端子である。このリード
端子２−ａはＬＳＩパッケージ１の側部から下方に延び
その先端が図示のよ５に丸みを持って曲げられかつＬＳ
Ｉパッケージ１の下方に位置するように設けられている
。また、リード端子２−ａの材質は弾力性を有する金属
、阿ｔばコパール、モリブデンタングステン、リン實銅
等を用いる。３はＬＳＩパッケージ１をプリント回路基
板上に実装するためＬＳＩパッケージ１上に設けられえ
２個の孔である。４は電子部品を実装するプリント回路
基板、Ｓはプリント回路基板４上に配線された回路の端
子部、６はプリント回路基Ｉ［ｌ上のＬＳＩパッケージ
の孔３と対応した位置に設けられ丸孔である。FIG. 1 is a plan view of the LSlSl package reprinted board according to the present invention J11, and FIG. 2 is a sectional view thereof. 1 is the LS mounted on LSI chip 1
It is an I package, and 2-& is a board terminal provided on the side of the L8I mesh cage 1 leading to the input/output tLfsILSI package of the LSI chip. This lead terminal 2-a extends downward from the side of the LSI package 1, and its tip is bent into a round shape 5 as shown in the figure.
It is provided so as to be located below the I package 1. Further, the material of the lead terminal 2-a is a metal having elasticity, such as copper copper, molybdenum tungsten, or phosphor copper. Reference numeral 3 denotes two holes that can be provided on the LSI package 1 for mounting the LSI package 1 on a printed circuit board. 4 is a printed circuit board on which electronic components are mounted, S is a terminal portion of a circuit wired on the printed circuit board 4, and 6 is a round hole provided at a position corresponding to the hole 3 of the LSI package on the printed circuit board I [l]. It is a hole.
次に、ＬＳＩパッケージ１ｔプリント囲路基板４に実装
する場合を説明する。プリント回路基板４上の端子部Ｓ
Ｏｇ分ＫＬ８レリクージｌのリード端子２−＆上型ね合
せて位置させる。次に、ＬＳＩパッケージｌの孔３とプ
リント回路基板４の孔・ヘビスフｔ−通し、更にビス７
にナツト８を嵌めてネジ込みＬＳＩパッケージｌとプリ
ント回路基板４とｔ互いに挾持するみこれにより、ＬＳ
Ｉパッケージ１のリード端子２−ａの先端部分は一定の
弾力を持ってプリント回路基板４の端子部５に圧接し、
ＬＳＩパッケージｌはプリント回路基板４に電気的機械
的に実装接続される（第２図）。Next, the case where the LSI package 1t is mounted on the printed circuit board 4 will be described. Terminal section S on printed circuit board 4
Position the lead terminal 2-&upper mold of KL8 relicuage l. Next, pass through the hole 3 of the LSI package 1 and the hole of the printed circuit board 4, and then screw 7.
Insert the nut 8 into the screw-in LSI package l and the printed circuit board 4 and t.
The tip of the lead terminal 2-a of the I package 1 is pressed against the terminal portion 5 of the printed circuit board 4 with a certain elasticity,
The LSI package 1 is electrically and mechanically connected to the printed circuit board 4 (FIG. 2).
ｇ３図はＬＳＩパッケージｌのリード端子の他飼を示す
。図示のような形状のリード端子２−ｂとすればプリン
ト回路基板４の端子部５との接続がより確実に行えよう
。まえ、第４図と第５図はＬＳＩパッケージ１の孔３ｔ
−ビス７が嵌るネジ孔３′とし、ビス７をプリント回路
基板４の孔６側から差込みネジ孔３′にネジ込むことに
より、ＬＳＩパッケージ１ｔ−プリント回路基板４上に
実装した場合を示す。Figure g3 shows the lead terminals of LSI package I. If the lead terminal 2-b has the shape shown in the figure, the connection with the terminal portion 5 of the printed circuit board 4 can be made more securely. Before, Figures 4 and 5 show hole 3t of LSI package 1.
A case is shown in which the LSI package 1t is mounted on the printed circuit board 4 by inserting the screw 7 into the screw hole 3' from the hole 6 side of the printed circuit board 4.
以上により、ＬＳＩパッケージ１はプリント回路基板４
に薄型にかつ簡単に実装されると共に、その取外しもビ
スを外せばよ（極めて簡単に行える。As described above, the LSI package 1 is connected to the printed circuit board 4.
It can be mounted thinly and easily, and can be removed by simply removing a screw (which is extremely easy to do).
尚、以上説明した実施的では、ＬＳＩパッケージ１ｔビ
ス７及びナツト８等の固定手段を用いてプリント回路基
板４上に実装する場−合を示したが、必ずしもその固定
手段に限定されるものではない。Incidentally, in the embodiment described above, a case has been shown in which the LSI package is mounted on the printed circuit board 4 using fixing means such as screws 7 and nuts 8, but the present invention is not necessarily limited to such fixing means. do not have.
ガえば、図示は省略するが、ＬＳＩパッケージ１の下部
に折り曲げ可能な爪片上複数個設け、かつプリント１回
路基板４にはその爪片が挿入する孔を設けてもよい、こ
の場合、ＬＳＩパッケージ１をその爪片ｔプリント回路
基板４の孔に挿入させて位置させ、その１ｉＬ８Ｉパツ
ケージ１のリード端子２−＆ｅ２−に−ＩＩｘプリント
回路基板４上の端子５に圧接するよさカを加えつつプリ
ント回路基板４の裏面から央き出た爪片の一部を折り曲
げればＬＳＩパッケージ１の実装が行えることは容易に
理解されよう。この場合も、ＬＳＩパッケージ１は薄型
に実Ｗ＆され、かつその取外しも容易に行えることは言
うまでもない。For example, although not shown, a plurality of bendable claw pieces may be provided at the bottom of the LSI package 1, and holes into which the claw pieces are inserted may be provided in the printed circuit board 4. In this case, the LSI package 1 is inserted into the hole of the printed circuit board 4, and printed while applying pressure to the lead terminals 2-&e2- of the 1iL8I package 1 to the terminals 5 on the -IIx printed circuit board 4. It will be easily understood that the LSI package 1 can be mounted by bending a portion of the claw protruding from the center of the back surface of the circuit board 4. In this case as well, it goes without saying that the LSI package 1 can be realized thinly and can be easily removed.
以上説明し九よさに、本発明によればこれまでのように
半田付を行うことな（プリント回路基板に簡単にかつ薄
型に実装できる電子部品を提供することができる。まえ
、その取外しも極めて容易に行えるので、修理、付は換
えの場合の取外し作業が極めて簡単となる。As explained above, according to the present invention, it is possible to provide an electronic component that can be easily and thinly mounted on a printed circuit board (without soldering as in the past). Since it is easy to perform, removal work for repair or replacement is extremely simple.
第１図は本発明の一実施例に係るＬＳＩパッケージをプ
リント回路基板上に実装し良状態の平面図、ｗｈ２図は
菖１図の側断面図、
ｔｓ３図は本発明の他の実施例の側断面図、第４図及び
第５図は他の固定方法を示し九個断面図である。
ここで％ ｉ ”−”ＬＳＩパッケージ、２−ａ、２
−ｂ・・・リード端子、３・・・孔、４”’プリント回
路基板、５・・・端子、Ｓ−・・孔、７−・ビス、８−
・ナツトである。
特許出願人 キャノン株式会社
□、；Ｌ元。
代理人 弁理士 大 塚 康 徳ｉ−・、１１（［・
第１図
９ａ４図
第５図Fig. 1 is a plan view of an LSI package according to an embodiment of the present invention mounted on a printed circuit board in good condition, Fig. WH2 is a side sectional view of Fig. 1, and Fig. TS3 is a plan view of another embodiment of the present invention. The side sectional view, FIGS. 4 and 5 are nine sectional views showing other fixing methods. Here, % i "-" LSI package, 2-a, 2
-b... Lead terminal, 3... Hole, 4"' printed circuit board, 5... Terminal, S-... Hole, 7-... Screw, 8-
・It's Natsuto. Patent applicant: Canon Co., Ltd.; L Gen. Agent Patent Attorney Yasunori Otsuka
Claims (1)
子部品の少なくとも一部が弾力性を有するリード端子と
、前記プリント回路基板上に固定するための固定手段を
備え、該固定手段によって前記プリント回路基板上に同
定することにより前記り−ド端子をプリント回路基板に
圧接し電気的に接続するよさにし九ことｔ％黴とする電
子部品。In an electronic component to be mounted on a printed circuit board, at least a part of the armpit electronic component includes a lead terminal having elasticity and a fixing means for fixing on the printed circuit board, and the fixing means allows the electronic component to be mounted on the printed circuit board. An electronic component in which the read terminal is press-contacted to a printed circuit board and electrically connected by the above identification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19621081A JPS5897852A (en) | 1981-12-08 | 1981-12-08 | Electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19621081A JPS5897852A (en) | 1981-12-08 | 1981-12-08 | Electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5897852A true JPS5897852A (en) | 1983-06-10 |
Family
ID=16354030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19621081A Pending JPS5897852A (en) | 1981-12-08 | 1981-12-08 | Electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5897852A (en) |
-
1981
- 1981-12-08 JP JP19621081A patent/JPS5897852A/en active Pending
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