JPS5897841U - bonding equipment - Google Patents

bonding equipment

Info

Publication number
JPS5897841U
JPS5897841U JP1981191747U JP19174781U JPS5897841U JP S5897841 U JPS5897841 U JP S5897841U JP 1981191747 U JP1981191747 U JP 1981191747U JP 19174781 U JP19174781 U JP 19174781U JP S5897841 U JPS5897841 U JP S5897841U
Authority
JP
Japan
Prior art keywords
bonding
platform
driving source
magazine
bonding equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981191747U
Other languages
Japanese (ja)
Inventor
忠 高野
Original Assignee
海上電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 海上電機株式会社 filed Critical 海上電機株式会社
Priority to JP1981191747U priority Critical patent/JPS5897841U/en
Publication of JPS5897841U publication Critical patent/JPS5897841U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は送り機構の主要部を示す正面図。第２図はリミ
ットスイッチに関する部分を示す正面図。 第３図はボンディング装置の斜視図。 １・・・モータ、２・・・歯車、３・・・送りネジ、４
・・・エアシリンダ、５・・・ガイドシャフト、６・・
・マガジン、７・・・台、８・・・上下リミットスイッ
チ、９・・・前後リミットスイッチ、１０・・・ローグ
一部、２０川アンローダ一部、３０・・・ボンディング
ステーション、１１・・・ガイドレール、１２・・・ボ
ンディングヘッド、１３・・・操作ハネル、１４・１５
・・・リードフレーム検知用スイッチ。FIG. 1 is a front view showing the main parts of the feeding mechanism. FIG. 2 is a front view showing the part related to the limit switch. FIG. 3 is a perspective view of the bonding device. 1...Motor, 2...Gear, 3...Feed screw, 4
...Air cylinder, 5...Guide shaft, 6...
・Magazine, 7...unit, 8...up/down limit switch, 9...front/rear limit switch, 10...part of Rogue, part of 20 river unloader, 30...bonding station, 11... Guide rail, 12... Bonding head, 13... Operation panel, 14/15
...Lead frame detection switch.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 相対する位置に同じ構造のローグ一部とアンローダ一部
とが配置され、両者の台上には所望の数のリードフレー
ムを収納するマガジンが載置され、両者には該台を上下
動せしめる駆動源と連結機構が設けられると共に、前記
マガジンを前後動せしめる駆動源が設けられ、かつ上下
及び前後動の範囲を規制するリミットスイッチが設けら
れており、両者の間を直線で結んで配された前記リード
フレームの移送用ガイドレールのほぼ中間位置に、ボン
ディングヘッドを配したボンディングステーション部が
設けられたことを特徴とするボンディング装置。A rogue part and an unloader part having the same structure are arranged in opposing positions, and a magazine that stores a desired number of lead frames is placed on the platform of both, and a drive that moves the platform up and down is mounted on both. A driving source and a connecting mechanism are provided, a driving source is provided for moving the magazine back and forth, and a limit switch is provided for regulating the range of vertical and longitudinal movement, and the two are connected with a straight line. A bonding apparatus characterized in that a bonding station portion having a bonding head is provided approximately in the middle of the guide rail for transporting the lead frame.
JP1981191747U 1981-12-24 1981-12-24 bonding equipment Pending JPS5897841U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981191747U JPS5897841U (en) 1981-12-24 1981-12-24 bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981191747U JPS5897841U (en) 1981-12-24 1981-12-24 bonding equipment

Publications (1)

Publication Number Publication Date
JPS5897841U true JPS5897841U (en) 1983-07-02

Family

ID=30105194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981191747U Pending JPS5897841U (en) 1981-12-24 1981-12-24 bonding equipment

Country Status (1)

Country Link
JP (1) JPS5897841U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63168076A (en) * 1986-12-29 1988-07-12 松下電器産業株式会社 Method of feeding printed board
JP2017126785A (en) * 2017-04-06 2017-07-20 リンテック株式会社 Sheet sticking device and sheet sticking method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63168076A (en) * 1986-12-29 1988-07-12 松下電器産業株式会社 Method of feeding printed board
JP2017126785A (en) * 2017-04-06 2017-07-20 リンテック株式会社 Sheet sticking device and sheet sticking method

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