JPS5893337A - Selecting method for semiconductor chip - Google Patents

Abstract

PURPOSE:To shorten the select time of acceptables or defectives by a method wherein perforations are formed on a perforated tape according to the information in case of the measurement of electric characteristics, the perforated tape is conformed and stacked to a dividing pattern and an adhesive tape is glued onto the perforated tape. CONSTITUTION:Special form chips 12 and defective chips 13 are marked 14 in a probing process. The perforated tape 15 is perforated 16 while being made correspond to the pattern of marking 14 by means of a punching machine as well as the marking 14. The perforated tape 15 is stacked onto the surface of a semiconductor wafer 10 to which dicing is executed while being conformed to the dividing pattern, and the adhesive tape 17 is glued onto the perforated tape. When exfoliating the tape, only special form chips and defective chips are left on the adhesive tape, and acceptables or defectives can be selected for separation.

Description

[Detailed description of the invention] Pertaining to law.

In order to sort semiconductor chips into good and defective ones, generally, they are probed in a dry state, marked 7 times for good and defective chips, and then diced and divided into individual chips based on the marks. We are conducting a selection process.

This sorting process may be performed manually or by using a machine such as an automatic sorter, but the former takes time and inevitably increases product costs.

Also, in the latter case, machines such as automatic sorters generally
Because good quality items are to be sorted, there are a large number of them, and it is still not possible to sufficiently shorten the sorting time.

A common process for both is the process of attaching the semiconductor wafer to an adhesive tape after the blotting process, but since the entire product is attached without distinction between good and defective products, a chemical cleaning process is especially necessary for non-defective products. There have been problems in that it requires a lot of effort and time to remove from the adhesive tape, and there is a high risk of breakage.

The present invention has been made based on the above-mentioned circumstances, and at the same time when a semiconductor wafer is probed, a paper or the like is punched in correspondence with irregularly shaped chips and defective tips to be removed according to information obtained when measuring the electrical characteristics of the semiconductor wafer. Perforations are formed in the tape, and after dicing, the tapes are stacked in accordance with the dividing pattern of the semiconductor wafer, and adhesive tape is applied from above, and only irregularly shaped chips and defective chips are adhered to the surface through the perforations in the paper tape. Provided is a method for sorting semiconductor chips that exhibit hv characteristics when separated.

Below is a drawing of an embodiment of the present invention! Refer to and explain.

The present invention is carried out through the steps shown in FIG.

That is, probing is carried out by a semiconductor porcelain brush probing step 1 in which a bonding portion is created in advance.

At the same time, punching 2 is performed to form holes on the perforation tape at positions corresponding to irregularly shaped chips and defective chips to be removed based on the information at the time of blobbing.
1 After performing dicing 3, tape attachment moves to step 4.

This tape is attached in a process in which the perforated tape is made to match the division pattern of the semiconductor wafer, and then an adhesive tape is attached onto the tape. At this time, the adhesive tape is pasted onto the semiconductor wafer to be removed through the perforations of the perforated tape.

Next, a roller or the like is rolled to divide the chips 7vc into individual chips 5 of the semiconductor unit V, and further tape peeling 6 is performed, and finally chips are sorted 7 into good and defective products.

In this case, irregularly shaped chips and defective chips remain on the adhesive tape and can be very easily screened out.

The main parts of the above method will be explained in more detail as follows.

1:′,.

That is, for example, as shown in FIG.
When forming fine square chips 11 from 0, markings 14 are performed on irregularly shaped chips 2 and defective chips 13 in the blobbing process.

A punching process KJ (not shown) is driven synchronously with this marking 14. A punching process 16 (not shown) is performed on a thin perforated tape 15 made of paper or the like in correspondence with the turns of the marking 14. , the shape and size of the perforation]6 are not particularly limited, but the shape and size of the chip to be removed
It is preferable that the size be as close as possible.

Next, a perforated tape is applied to the surface of the diced semiconductor sea urchin/110 as shown in FIG. 4]5! After superimposing them according to the division pattern, adhesive tape 17 is stuck on the perforated tape.

In this case, since the perforated tape [5] is made of a thin material such as paper, the adhesive tape [7] is affixed to the portions of irregularly shaped chips and defective chips that are to be perforated and removed.

If the tape is peeled off after the above steps, only irregularly shaped chips and defective chips will remain on the adhesive tape, allowing the selection of good and defective chips.

As described above, according to the present invention, instead of removing irregularly shaped chips and defective chips one by one, they can be removed in four steps through perforated tape.
The time for sorting between good and defective products is significantly reduced.

Furthermore, since the adhesive tape is not adhered to the non-defective chips, the cleaning time in the subsequent cleaning process can be shortened, and it is possible to avoid adverse effects on electrical characteristics.

[Brief explanation of drawings]

Figure 1 is a process diagram for carrying out the invention, Figure 2 is a process diagram for implementing the invention.
Top view of semiconductor wafer after blowing process, 3rd
The figure is a top view of the perforated tape after the punching process.
The figure is a sectional view of the semiconductor wafer, perforated tape, and adhesive tape sequentially stacked one on top of the other. 10...Semiconductor wafer, 1]...Square chip, ]2.
... Irregular chip, 13... Defective chip, 14... Marking, 15... Perforated tape, 17... Adhesive tape. Application agent Patent attorney Kikuchi Division 5 Part 1 Figure 2 Garden

Claims (1)

[Claims] a step of probing a chip portion on a semiconductor wafer;
In synchronization with this step, there is a punching step of forming perforations on the perforated tape at positions corresponding to the irregularly shaped chip portions and defective chip portions; a step of dicing the wafer; A step of overlapping the tapes in a Y-aligned position with the perforation position of the tape, further adhering an adhesive tape onto the tape, a step of dividing the wafer into individual chips, and a step of separating the adhesive tape by one piece. A method for sorting semiconductor chips, characterized in that only irregularly shaped chips and defective chips are left on the adhesive tape.